• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.9
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• pp.1359-1367
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• 2001

Improvement of machine tool accuracy is an essential part of quality control in manufacturing process. Among of all the errors of a particular machine tool, the thermal errors of the spindle have a notably significant effect on machining accuracy and have a direct influence upon both the surface finish and geometric shape of the finished workpiece. Therefore, this paper proposed new measurement method for thermal errors of the spindle in machine tools. The thermal errors are measured by a ball bar system instead of capacitance sensor system. The novel measurement method using ball bar system is more efficient, easier to use than conventional measurement system. And also the ball bar system is possible to measure both geometric errors and thermal errors at the same time.

• Journal of Power Electronics
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• v.14 no.6
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• pp.1345-1356
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• 2014

The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

• Journal of IKEEE
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• v.25 no.2
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• pp.261-266
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• 2021

This paper suggests design methodology for thermal infrared data correction algorithms considering environmental temperature variations. First, a thermal infrared measurement model is suggested by a parameter-dependent first-order input-output equation using the relationship between infrared measurement data and model environmental parameters. In order to compensate the influence of environmental temperatures on infrared data, a compensation function is identified. Through experiments, the proposed algorithm is shown to reduce the influence of environmental temperatures on the infrared data effectively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1747-1755
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• 2002

A complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in semi-infinite solid materials. The influence of the parameters, such as radius and modulation frequency of the heating beam and the thermal diffusivity, was studied. Usually, thermal diffusivity was determined by the deformation angle and phase angle as the relative position between the heating and probe beams. In this study, we proposed the simple analysis method based on the real part of deformation gradient as the relative position between two beams. It is independent in the parameters such as power of heating beam, absorption coefficient, reflectivity, Poisson's ratio, and thermal expansion coefficient.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2202-2207
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• 2007

The present article investigates experimentally and theoretically thermal and optical characteristics of thin film structures through measurement of thermal conductivity of Pyrex 7740 and reflectance in silicon thin film. The $3{\omega}$ method is used to measure thermal conductivity of very thin film with high accuracy and the optical characteristics in thin films are studied to examine the influence of incidence angle of light on reflectance by using the CTM(Characteristics Transmission Method) and the 633 nm He-Ne laser reflectance measurement system. It is found that the estimated reflectance of silicon show good agreement with experimental data. In particular, the present study solves the EPRT(Equation of Phonon Radiative Transport) which is based on Boltzmann transport equation for predicting thermal conductivity of nanoscale film structures. From the results, the measured thermal conductivity is in good agreement with the previous published data. Moreover, thermal conductivities are estimated for different film thickness. It indicates that as film thickness decreases, thermal conductivity decreases substantially due to internal scattering.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2465-2470
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• 2007

We have analyzed the three-dimensional thermal conduction in anisotropic materials using nonsymmetric-Fourier transforms. And a complete theoretical treatment of the photothermal deflection spectroscopy has been performed for thermal conductivity measurement in anisotropic medium. Thermal conductivity tensor was determined by the deflection angle and phase angle with the relative position between the heating and probe beams. The influence of the parameters, such as modulation frequency of the heating beam, the thermal conductivity tensor, was investigated.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.26.2-26.2
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• 2005

• Journal of the Korean Society of Safety
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• v.21 no.4 s.76
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• pp.95-101
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• 2006

It is well known that the thermal load in PSC(prestressed concrete) box-girder bridge is the principal cause of detrimental crack. The longitudinal stress caused by the lateral stress from the temperature gradient in slab of PSC box-girder bridge has a considerable influence on the durability and economy of bridge structures. As the basic study for the rational consideration of thermal load and the derivation of design guide, the inverse thermal analysis program for PSC box-girder bridges using field measurement data is developed. In this paper, thermal analyses are performed using field monitoring data for the sample PSC box-girder bridge. It is proposed that the link between monitoring program and the inverse analysis program is available.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.132-137
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• 2000

A complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in solid materials. The influence of parameters - radius and modulation frequency of pump beam and thickness of material - on the phase lag was studied. The phase decreases up to a certain position, then starts to increase and does have an asymptotic value. The position, where phase has the minimum value, is a function of thermal diffusion length thickness of sample, and radius of pump beam. A new method based on minimum phase lag is described to determine the thermal diffusivity of solid material.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.213-218
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• 1997

Thermal deformation of machine origin of machine tools due to internal and external heat sources has been the most important problem to fabricate products with higher accuracy and performance. In order to solve this problem, GMDH models were constructed to estimate thermal deformation of machine origin for a vertical machining ceneter through measurement of temperature data of specific points on the machine tool. These models are nonlinear equations with high-order polynomials and implemented in a multilayered perceptron type network structure. Input variables and orders are automatically selected by correlation and optimization procedure. Sensors with small influence are deleted automatically in this algorithm. It was shown that the points of temperature measurement can be reduced without sacrificing the estimation accuracy of $\pm$5${\mu}{\textrm}{m}$. From the experimental result, it was confirmed that GMDH methodology was superior to least square models to estimate the thermal behavior of machine tools.