• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• Polymer(Korea)
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• v.33 no.1
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• pp.91-95
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• 2009

We fabricated the electromagnetic (EM) noise absorber films for high temperature use by blending a soft magnetic powder with poly(amide imide) (PAI). The EM noise absorber films of PAI/soft magnet composite were prepared by casting the solution of poly(amide amic acid)/soft magnet powder into glass substrate with casting applicator device and then thermal imidization. The obtained films were fully characterized and their physical properties including thermal behavior, thermal stability and mechanical properties were studied. The EM noise absorption ability was also investigated using micro-strip line method. At 1 GHz, the power loss of composite film with 150 ${\mu}m$ thickness was about 25%.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.50-55
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• 2016

Aromatic diamines containing hexafluoroisopropylidene and ester moiety were synthesized from 4,4'-hexafluoroisopropylidene diphenol and nitrobenzoyl chloride. The reaction of aromatic diamines with hexafluoroisopropylidene phthalicdianhydride (6FDA) or pyromellitic dianhydride (PMDA) gave four kinds of poly(amic acid)s. Their inherent viscosities ranged from 0.196 to 0.346 dL/g. Poly(amic acid)s were converted to polyimides by thermal imidization. The glass transition temperatures ($T_g$) of polyimides were between 241 and $289^{\circ}C$. The 5% weight loss temperatures were recorded in the range of $430{\sim}492^{\circ}C$. The tensile strength of polyimide films were measured as 29.84~64.38 MPa.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.273-276
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• 1997

This paper describes the thermally stimulated current (TSC) measurements of arachidic acid and polyamic acid alkylamine salt(PAAS) LB film, which is a precursor of polyimide(PI). The measurements were performed from room temperature to about 25$0^{\circ}C$ and the temperature was increased at a rate of 0.02 K/s linearly. It shows that peaks of TSC are observed at about 8$0^{\circ}C$ in the arachidic acid and about 8$0^{\circ}C$, 16$0^{\circ}C$ in the PAAS LB films. Results of these measurements indicate that one peak at 8$0^{\circ}C$ is resulted from alkyl group; the other peak at 16$0^{\circ}C$ is due to alkyl and C-O group of PAAS. Additional large peak at about 16$0^{\circ}C$ is due to dipole moments in the PAAS films. The DSC of PAAS, arachidic acid and octadesylamine are measured. Thermal imidization was performed at 30$0^{\circ}C$ for 1 hour by our pre study.

• Macromolecular Research
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• v.11 no.3
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• pp.157-162
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• 2003

6FDA-based polyimides were prepared from the thermal imidization reaction of 6FDA with diamines of BAPAF, DAP, and DABA having a polar group of hydroxyL or carboxyl. Properties of the dense polyimide membranes were characterized and their gas permeation properties for H$_2$, $CO_2$, $O_2$, $N_2$, and CH$_4$ were investigated. Permeabilities, diffusion coefficients and diffusivity selectivities of polar group-containing polyimide membranes including 6FDA-BAPAF, 6FDA-DAP, and 6FDA-DABA polymer for the gases did not change largely. The separation properties of 6FDA-TrMPD polyimide membrane used as a reference polymer were compared with those of the polyimide membranes mentioned above. It was found that the polyimides of 6FDA-BAPAF, 6FDA-DAP, and 6FDA-DABA, which were soluble in alcohol or/and 2-methoxyethanol, could be applicable to the preparation of a dense composite membrane by dip-coating method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.199-202
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• 1996

This paper describes the thermally stimulated current (TSC) measurements of arachidic acid and polyamic acid alkylamine salt(PAAS) LB film, which is a precursor of polyimide(PI). The measurements were performed from room temperature to about 25$0^{\circ}C$ and the temperature was increased at a rate of 0.02 K/s linearly. It shows that peaks of TSC are observed at about 8$0^{\circ}C$ in the arachidic acid and about 8$0^{\circ}C$, 16$0^{\circ}C$ in the PAAS LB films. Results of these measurements indicate that one peak at 8$0^{\circ}C$ is resulted from alkyl group; the other peak at 16$0^{\circ}C$ is due to alkyl and C-O group of PAAS. Additional large peak at about 16$0^{\circ}C$ is due to dipole moments in the PAAS films. The DSC and TGA of PAAS, arachidic acid and octadesylamine are measured. Thermal imidization was performed at 30$0^{\circ}C$ far 1 hour by our pre study

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• Membrane Journal
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• v.9 no.4
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• pp.215-220
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• 1999

The asymmetric polyimide [PI] membrane with good solvent-resisting and heat-resisting properties was prepared by using the phase inversion method from polyamic acid, and its pervaporation separation characteristics of water-acetic acid system were studied. It was appeared from the prepared membranes that the best non-solvent of polyamie acid for the phase inversion was toluene. The best heat-treatment condition for the imidization of polyamic acid was 1 hr heating at each of the temperatures, 373, 473, and 573 K The thermal durability and chemical stability during the pervaporation separation of water-acetic acid of the prepared PI membrane was superior. The pervaporation characteristics of prepared membrane were 180 of separation factor and 0.5 kg/$m^2$hr of total flux for 80 wt% acetic acid feed.

• Journal of the Korean Applied Science and Technology
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• v.19 no.2
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• pp.73-78
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• 2002

The polyimide(PI) Langmuir-Blodgett(LB) ultra thin films were prepared by imidizing the PAAS LB films of PMDA and benzidine system with a thermal treatment at $250^{\circ}C$ for 30min, where the PAAS LB films were formed on substrates by using LB technique. The thicknesses of one layer of PAAS and PI LB film that deposited at the surface pressure of 27mN/m were 20.9 and 4A, respectively. At low electric field, ohmic conduction($I^{\propto}$ V) was observed and the calculated electrical conductivity was about $4.23{\times}10^{-15}{\sim}9.81{\times}10^{-15}S/cm$. The dielectric constant of LB film was about 7.0.

• Polymer(Korea)
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• v.27 no.5
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• pp.484-492
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• 2003

How the characteristics and stability of the rubbing-induced alignment of nematic liquid crystals (LCs) relate to the interfacial characteristics of LC-polyimide has been studied. The characteristics of the LC alignment (such as the LC texture, the pretilt angle, and the anchoring energy) and their thermal stability have been investigated for 5 polyimides synthesized for this work. The work showed that the rubbed polyimide alignment layer induces the strong LC anchoring and that the characteristics and stability of LC alignment are determined by the short-ranged interactions between LC and polyimide molecules at the alignment layer surface. The increased flexibility of the polyimide accelerates thermal imidization, increases the pretilt angle, and improves the alignment stability. It also turned out that fluorination of the polyimide tends to deteriorate the alignment uniformity and stability. No distinct differences in the alignment characteristics were shown for the aromatic- and alicyclic-dianhydride polyimides.