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Heat Resistant Electromagnetic Noise Absorber Films Using Poly(amide imide)/Soft Magnet Composite  

Han, Ji-Eun (Department of Chemical Engineering, Sungkyunkwan University)
Jeon, Byung-Kuk (Department of Chemical Engineering, Sungkyunkwan University)
Goo, Bon-Jae (Department of Chemical Engineering, Sungkyunkwan University)
Cho, Seung-Hyun (Polymer Technology Institute, Sungkyunkwan University)
Kim, Sung-Hoon (R&D Center, Chang Sung Corporation)
Lee, Kyung-Sub (R&D Center, Chang Sung Corporation)
Park, Yun-Heum (Department of Chemical Engineering, Sungkyunkwan University)
Lee, Jun-Young (Department of Chemical Engineering, Sungkyunkwan University)
Publication Information
Polymer(Korea) / v.33, no.1, 2009 , pp. 91-95 More about this Journal
Abstract
We fabricated the electromagnetic (EM) noise absorber films for high temperature use by blending a soft magnetic powder with poly(amide imide) (PAI). The EM noise absorber films of PAI/soft magnet composite were prepared by casting the solution of poly(amide amic acid)/soft magnet powder into glass substrate with casting applicator device and then thermal imidization. The obtained films were fully characterized and their physical properties including thermal behavior, thermal stability and mechanical properties were studied. The EM noise absorption ability was also investigated using micro-strip line method. At 1 GHz, the power loss of composite film with 150 ${\mu}m$ thickness was about 25%.
Keywords
poly(amide imide); soft magnetic; composite films; electromagnetic noise absorption; microstrip line;
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