• Macromolecular Research
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• v.15 no.4
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• pp.357-362
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• 2007

Polyimide/carbon nanotube (CNT) composite films, for potential use in high performance microelectronics and aerospace applications, were prepared by mixing a polyisoimide (PII) solution and a CNT suspension in NMP, followed by casting, evaporation and thermal imidization. The CNTs were modified by a nitric acid treatment to improve the thermal and electrical properties, as well as to provide good dispersion of the CNTs in a polymer matrix. The formation of functional groups on the modified CNT was confirmed by Raman spectroscopy. Scanning electron microscopy revealed the modified CNTs to be well dispersed in the polyimide matrix, with a uniform diameter of ca. 50 nm. The thermal stability of the films containing the CNTs was improved due to the enhanced interfacial interaction and good dispersion between the polyimide matrix and modified CNTs. In addition, the thermal expansion coefficient of the composites films was slightly decreased, but the dielectric constants increased linearly with increasing CNT content.

• Applied Chemistry for Engineering
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• v.3 no.1
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• pp.179-187
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• 1992

Poly(styrene-co-maliec anhydride) was reacted with aromatic amines such as aniline, p-toluidine, and p-chloroaniline in 10% (w/w) DMF solution to convert maleic anhydride units into maleimides. Optimum reaction conditions for cyclodehydration step of imide ring formation were : (a) reaction temp. of $80^{\circ}C$ (b) mole ratios of cyclodehydration agents : anhydride units in SMA/acetic anhydride/sodium acetate/triethyl amine= 1.0/2.0/0.2/1.1. $T_g$of SMI(imide modified SMA) was increased with increasing degree of imidization, but $T_g$leveled off in the early stage of imide content. And $T_g$of SMI was increased with the following order of amines used for imidization reagents : aniline < p-toluidine < p-chloroaniline.

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.37-40
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• 2001

Aromatic polyimides는 다른 고분자 재료에 비해 고온에서의 열 안정성 및 기계적 물성, 내화학성, 전기 절연성, 난연성 등이 매우 탁월하기 때문에, 최근 들어서 고성능 구조재료, 전자재료(microelectronics devices, electrical insulators of semiconduntor packages), 내열성 접착제, 코팅제 등 그 응용 범위가 점차 확대되고 있는 추세이다. (중략)

• Proceedings of the KIEE Conference
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• 1993.07a
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• pp.3-5
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• 1993

The use of preformed polymers and their cross-linking have been attempted in order to improve the intrinsic fragility of monolayers and Langmuir-Blodgett (LB) films and to make their technological applications possible. It has shown that an imidization followed a polyion-complexation can stabilize the LB films against heat and solvents. And, when the polymer structure was property designed, concurrent removal of the alkyl tails together with imide formation could be accomplished. In this paper, we present a characteristic monolayer behavior of polymer with pendent polyethers and carboxyls, it's polyion-complexed LB film with subphase polymer PAA, and a possible skeletonization of the LB film by thermal imidization. Also, deposition status of LB films are evaluated by using QCM.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.537-539
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• 1993

The use of preformed polymers and their cross-linking have been attempted in order to improve the intrinsic fragility of monolayers and Langmuir-Blodgett(LB) films and to make their technological applications possible. It has shown that an imidization followed a polyion-complexation can stabilize the LB films against heat and solvents. And, when the polymer structure was properly designed, concurrent removal of the alkyl tails together with imide formation could be accomplished. In this paper, we present a characteristic monolayer behavior of polymer with pendent polyethers and carboxyls, it's polyion-complexed LB film with subphase polymer PAA, and a possible skeletonization of the LB film by thermal imidization. Also, deposition status of LB films are evaluated by using QCM.

• Fibers and Polymers
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• v.1 no.2
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• pp.67-70
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• 2000

Rosin maleic anhydride adduct (RMA)-bisester was prepared by the esterification of chlorinated RMA with hydroquinone. Phenylpyridinylcyclot.isiloxane ($D_3^{Ph,Py}$) was synthesized from phenylpyridinyldichlorosilane in the presence of zinc oxide catalyst, and amino group terminated polyphenylpyridinylsiloxane prepolymer was prepared by equilibrium polymerization of $D_3^{Ph,Py}$ with 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane. Rosinimide (PSMR) was prepared from the imidization of RMA-bisester with polyphenylpyridinylsiloxane prepolymer at 12$0^{\circ}C$ for 7 h using ${\gamma}$-butyrolactone/pyridine. It showed that PSMR had better thermal stalbility than rosinimide modified with polydimethylsiloxane.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.227-227
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• 2006

It was attempted to synthesize polyimides from PPMDA and 3FPPMDA with mDAPPO/pPDA in order to afford CTE of 17ppm and adhesion property of 80g/mm, besides high Tg (>$300^{\circ}C$), good thermal stability (>$500^{\circ}C$), low water absorption and good solubility. The polyimides were prepared via a conventional two-step process; preparation of poly(amic-acid), followed by solution imidization by refluxing in NMP with o-DCB and the molar ratio of mDAPPO/pPDA was varied. The polyimides were characterized by FT-IR, NMR, DSC and TGA. In addition, intrinsic viscosity, solubility and coefficient of thermal expansion (CTE) were also measured.

• Macromolecular Research
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• v.16 no.6
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• pp.503-509
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• 2008

A series of colorless polyimide (PI) nanocomposite films were synthesized from 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB) with various organoclay contents by solution intercalation polymerization to poly(amic acid)s, followed by thermal imidization. The variation with the organoclay content of the thermomechanical properties, morphology, and optical transparency of the hybrids was examined at organoclay loadings ranging from 0 to 1.0 wt%. The hybrid films showed high optical transparency and almost no color, with cut-off wavelengths ranging from 352 and 356 nm and very low $b^*$ values of 1.19-1.77. The hybrid PI films showed good thermal properties with a glass transition temperature of $280-287^{\circ}C$. Most films did not show any significant thermal decomposition below $490^{\circ}C$. The addition of only a small amount of organoclay was sufficient to improve the tensile properties of the PI films with maximum enhancement being observed at 0.25 wt% organoclay. Moreover, these PI hybrids also had low coefficients of thermal expansion (CTE).

• Carbon letters
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• v.19
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• pp.1-11
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• 2016

In efforts to characterize and understand the properties and processing of phenylethynyl-terminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1719-1721
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• 1996

This paper describes the thermally stimulated current(TSC) of PAAS spin coated film and the electrical properties of pre TSC measurement and after TSC test specimens. The TSC measurement were performed from room temperature to about $280^{\circ}C$ and the temperature was increased by $5^{\circ}C/min$ automatically. It shows that two peaks of TSC are observed at about $50^{\circ}C$ and about $160^{\circ}C$. Result of this measurement indicate that one peak; $50^{\circ}C$ is from alkyl group; other peak at $160^{\circ}C$ is due to alkyl and C-O group of PAAS. Addition to larger peak at about $160^{\circ}C$ is due to dipolemoment of PAAS film. This result is proved by DSC measurement of PAAS film. The electrical properties of pre and after TSC were measured by currant-voltage(l-V) characteristics. The current-voltage characteristics after TSC specimens are increased the conductivity. The electrical properties of pre-after TSC measurement specimen is in the middle of imidization of PAAS. Because of this result a thermal imidization was performed at $300^{\circ}C$ for 1 hour.