• 한국표면공학회지
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• 제32권1호
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• pp.49-60
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• 1999

The protective oxide scales and coatings formed on high temperature materials must be preserved in high temperature atmosphere. And the thermal stresses induced by thermal cycling and the growth stresses by the formation of oxide scales can cause the loss of adherence and spalling of the oxide scales and coated layers. Among the coating processes Al diffusion coating is favored due to thermochemical stability and superior adherence in an hostile atmosphere. In this study, protective oxide forming element, Al was coated on Ni, Inconel 600 and 690 by diffusion coating process varying coating temperature and time. And the surface stability and adherence of oxide scales formed on those Al diffusion coated materials were evaluated by thermal cycling test. Al diffusion coated specimens showed superior cyclic oxidation resistance compared to bare ones and specimens coated for longer period had better cyclic oxidation resistance, due to the abundant amount of Al in the coated layer. Meanwhile Al diffusion coated Inconel 600 and 690 showed improved cyclic oxidation resistance by the effect of Al in the coated layer and Cr in the substrate. Comparing both Al diffusion coated Inconel 600 and 690, Al diffusion coated Inconel 690 maintained better adhesion between coated layer and substrate by virtue of the bridging effect resulting from the segregation of Cr in the interdiffusion zone.

• Nuclear Engineering and Technology
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• 제45권4호
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• pp.469-476
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• 2013

In a postulated severe core damage accident in a PHWR, multiple failures of core cooling systems may lead to the collapse of pressure tubes and calandria tubes, which may ultimately relocate inside the calandria vessel forming a terminal debris bed. The debris bed, which may reach high temperatures due to the decay heat, is cooled by the moderator in the calandria. With time, the moderator is evaporated and after some time, a hot dry debris bed is formed. The debris bed transfers heat to the calandria vault water which acts as the ultimate heat sink. However, the questions remain: how long would the vault water be an ultimate heat sink, and what would be the failure mode of the calandria vessel if the heat sink capability of the reactor vault water is lost? In the present study, a numerical analysis is performed to evaluate the thermal loads and the stresses in the calandria vessel following the above accident scenario. The heat transfer from the molten corium pool to the surrounding is assumed to be by a combination of radiation, conduction, and convection from the calandria vessel wall to the vault water. From the temperature distribution in the vessel wall, the transient thermal loads have been evaluated. The strain rate and the vessel failure have been evaluated for the above scenario.

• 반도체디스플레이기술학회지
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• 제22권1호
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• pp.64-71
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• 2023

In this study, we investigated the effects of BiAlSiO glass composition on its glass forming range, thermal properties, and plasma resistance. The results showed that increasing the Al2O3 content suppressed the tendency for crystallization and hindered glass formation beyond a certain threshold. Bi2O3 was found to increase the content of non-bridging oxygen, resulting in a decrease in glass transition temperature and an increase in thermal expansion coefficient. Furthermore, the etching rate was found to improve with increasing Al2O3 content but decrease with increasing SiO2 content. It was concluded that the boiling point of fluorinated compounds should be considered to 900℃. Therefore, this study is expected to contribute to the understanding of the properties of BiAlSiO glass and its application to low temperature melting PRG compositions.

• Composites Research
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• 제31권1호
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• pp.12-16
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• 2018

복합소재와 금형강 간에는 열팽창계수의 차이로 인하여 성형 과정 중의 온도 구배에 따라 다른 열팽창길이를 갖는다. 따라서 금형 내에 복합소재를 삽입하여 성형을 하는 경우 복합소재의 표면에 작용하는 압력이 소재의 업체에서 추천하는 성형 압력을 유지하는지를 확인할 필요성이 있다. 본 연구에서는 온도의 차이에 따른 복합소재와 금형 사이의 압력을 유한요소해석법을 사용하여 예측하였으며 열팽창에 따른 금형의 길이를 측정함으로써 해석의 정확성을 검증하였다. 각 온도에서의 해석과 실험값의 차이로써 매우 근사한 값을 얻을 수 있었으며, 틈새 예측 값의 목표치인 ${\pm}0.05mm$ 안에 들어오는 것을 확인하였다. 이를 통하여 복합소재에 작용하는 압력을 추정한 해석값이 신뢰할 수준임을 알 수 있었다.

• 한국주조공학회지
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• 제25권6호
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.33-33
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• 2007

In PDP industry, the dielectrics and barrier ribs have been required with low dielectric constant, low melting point and Pb-free composition due to the low power consumption, low signal delay time and the environment restriction. We were studied with $B_2O_3-Al_2O_3$-SrO glass systems about optical, thermal and dielectric properties. The glass forming region of the $B_2O_3-Al_2O_3$-SrO glass systems was narrow due to the amount of the glass former $(B_2O_3)$. The glass transition temperature (Tg) of the glasses was at $550{\sim}590^{\circ}C$. The glasses have 6~8 for the dielectric constant. Furthermore, the transmittance of the glasses was over 80% on the range of the visible ray. From the results, the glasses of the $B_2O_3-Al_2O_3$-SrO glass systems should enable to be a good candidate of the PDP devices for information display with low dielectric constant. The aim of this study is to give a fundamental result of new glass system for low dielectric constant in the information display.

• 한국전산유체공학회지
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• 제17권4호
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• pp.16-23
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• 2012

Current display manufacturing processes apply thermal treatment of glass backplanes widely for hydrogen degassing, crystallization of thin-films, tempering, forming, and precompaction. Estimation of the characteristics of transient heating stages and thermal non-uniformities on a single glass substrate or in a stack of glasses are extremely helpful to understand non-homogeneity of mechanical and electronic features of nano/micro structures of end products. Based on simple heat transfer models and using an electric muffle furnace, temperature variations in a glass stack were predicted and measured for glass backplanes of $1.5{\times}1.85m^2$ in size and 0.7 mm in thickness. Except for the period of putting glass backplanes into the furnace, thermal radiation was the major heating mechanism for the treatment and theoretical predictions agreed well to the experimental temperatures on the backplanes. Using the theoretical model, thermal fields for a glass stack of glass-size, $2.2{\times}2.5m^2$, and of the number of sheets, 1 to 12, were calculated for practical design and manufacturing of the muffle furnace for large-scale displays, e.g. up to $8^{th}$ generation.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.51-56
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• 2012

습식공정으로 thermal via용 SI 관통 via를 형성하기 위해 TMAH 용액의 농도와 온도에 따른 Si 기판의 이방성 습식식각 거동을 분석하였다. TMAH 용액의 온도를 $80^{\circ}C$로 유지한 경우, 5 wt%, 10 wt% 및 25 wt% 농도의 TMAH 용액은 각기 $0.76{\mu}m/min$, $0.75{\mu}m/min$ 및 $0.30{\mu}m/min$의 Si 식각속도를 나타내었다. 10 wt% TMAH 용액의 온도를 $20^{\circ}C$와 $50^{\circ}C$로 유지시에는 각기 $0.07{\mu}m/min$와 $0.23{\mu}m/min$으로 식각속도가 저하하였다. Si 기판의 양면에 동일한 형태의 식각 패턴을 형성하여 $80^{\circ}C$의 10 wt% TMAH 용액에 장입하고 5시간 식각하여 깊이 $500{\mu}m$의 관통 via hole을 형성하였다.

• Journal of Welding and Joining
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• 제32권3호
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.53-60
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• 2014

Different kinds of post-deposition annealing (PDA) by a rapid thermal process (RTP) are used to enhance the field-effect passivation of $Al_2O_3$ film in crystal Si solar cells. To characterize the effects of PDA on $Al_2O_3$ and the interface, metal-insulator semiconductor (MIS) devices were fabricated. The effects of PDA were characterized as functions of RTP temperature from $400{\sim}700^{\circ}C$ and RTP time from 30~120 s. A high temperature PDA can retard the passivation of thin $Al_2O_3$ film in c-Si solar cells. PDA by RTP at $400^{\circ}C$ results in better passivation than a PDA at $400^{\circ}C$ in forming gas ($H_2$ 4% in $N_2$) for 30 minutes. A high thermal budget causes blistering on $Al_2O_3$ film, which degrades its thermal stability and effective lifetime. It is related to the film structure, deposition temperature, thickness of the film, and annealing temperature. RTP shows the possibility of being applied to the PDA of $Al_2O_3$ film. Optimal PDA conditions should be studied for specific $Al_2O_3$ films, considering blistering.