• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.334-337
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• 2007

Austenitic stainless steel is used as high temperature components such as gas turbine blade and disk because of its good thermal resistance. In the present investigation, tensile and low cycle fatigue(LCF) behavior of stainless steel for turbine disks was studied at wide temperature range $20^{\circ}C\;{\sim}\;750^{\circ}C$. In the tensile tests, it was shown that elastic modulus, yield strength, ultimate tensile strength decreased when temperature increased. The effect on fatigue failure of the parameters such as plastic strain amplitude, stress amplitude and plastic strain energy density was also investigated. Coffin-Manson and Morrow models were used to adjust experimental data and predict the fatigue life behavior at different mean strain values during cyclic loading of high temperature components.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2002.04a
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• pp.8-9
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• 2002

액체로켓엔진의 연소기는 고온고압의 연소가스에 의해 벽면온도가 매우 높은 수준에 도달하기 때문에, 연소기가 열적으로 안정적으로 작동할 수 있는 메카니즘이 필요하게 되며, 따라서 이러한 방식의 하나로서 추진제를 이용한 재생냉각방식이 널리 사용되고 있다. 일반적으로 재생냉각형 연소기의 내벽은 열전도도가 우수한 구리 또는 구리합금 계열이 많이 사용되고 있다. 이러한 내벽 재질의 내구성은 주로 creep rupture, low cycle thermal fatigue, thermal-mechanical ratcheting에 의해 결정되는데, 사각형태의 냉각채널의 연소기에서는 thermal-mechanical ratcheting 특성이 수명 결정 주요 인자이다. Thermal-mechanical ratcheting은 그림 1과 같이 연소가스 영역과 냉각제 영역을 분리하는 벽면에서 국부적인 부풀음이 일어나면서 벽면두께가 감소하는 소성변형 형태로 나타나는데, 이러한 것을 Dog- house 형상이라 한다.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.134-139
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• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.48-56
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• 2006

The fatigue strength of the welds is affected by such factors as the weld geometry, microstructures, tensile properties and residual stresses caused by fabrication. It is very important to evaluate the structural integrity of the welds in nuclear power plant because the weldment undergoes the most of damage and failure mechanisms. In this study, the fatigue assessments for a reactor vessel outlet nozzle with the weldment to the piping system are performed considering the welding residual stresses as well as the effect of local brittle zone in the vicinity of the weld fusion line. The analytical approaches employed are the microstructure and mechanical properties prediction by semi-analytical method, the thermal and stress analysis including the welding residual stress analysis by finite element method, the fatigue life assessment by following the ASME Code rules. The calculated results of cumulative usage factors(CUF) are compared for cases of the elastic and elasto-plastic analysis, and with or without residual stress and local brittle zone effects, respectively. Finally, the fatigue life of reactor vessel outlet nozzle weld is slightly affected by the local brittle zone and welding residual stresses.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.117-120
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• 2002

In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method, force-bal tranced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surface evolver) and then compare results of each method. The results in dicate that two methods can accurately predict the solder joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS. As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.05a
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• pp.18-21
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• 2009

The life of components under high thermal load is typically shorter than other components. The turbopump turbine of liquid rocket is operated under these environments like high temperature and high centrifugal dorce due to high rotating velocity during operating time. These conditions may often cause low-cycle fatigue problem in the turbopump turbine. First of all, to analyze heat stress, ABAQUS/CAE is used and Coffin-manson's equation is used to consider elasticity and plasticity strain. S.W.T's method is used to consider the mean stress effect, using strain history, low-cycle fatigue analysis is done for turbopump turbine which may have FCL(fracture critical location). In this paper, strain life method is applied to analyze low-cycle fatigue.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.337-343
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• 2009

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.9
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• pp.25-32
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• 1998

The forced cooling system is designed to shorten the overhaul time of steam turbine, which is important in view of economic concern of utility companies, Forced cooling of the hot turbine is achieved by suction of air flow into the turbine after the turbine shuts down. The heat transfer process by suction of air flow can cause thermal stress due to the thermal gradients. In this paper, the analysis of heat transfer is performed to calculate the air flow rate. Based on the prediction of cyclic fatigue damage and the experience, the cooling equipment is designed for shortening the cooling time of steam turbine.

• Journal of Applied Reliability
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• v.17 no.4
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• pp.280-288
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• 2017

Purpose: PBA buried in underwater requires high reliability because of its mission critical characteristic and harsh operational environment during its life cycle. Therefore, various reliability improvement activities are necessary. The defect on PBA manufacturing process have been studied, as a result, many activities and standards have been presented. However, there are less studies regarding failure pattern on physical features based on design. In this paper, we studied a possible failure patten based on physical features that is related with manufacturing process of PBA. And reliability improvement design based on PoF (Physical of Failure) were intruduced in this paper. Methods: A reliability prediction simulation were performed on the components A and B of the H system using Sherlock Software which is a PoF commercial tool from DFR solution. Solder fatigue and PTH fatigue analysis based on thermal cycling profiles and random vibration was analyzed on three earthquake response spectrum. Result: It was validated that life time and reliability improvement design through solder fatigue and PTH fatigue analysis in case of component. For compoenet B, random vibration fatigue was additionally analyzed and validated reliability for earthquakes profile. Conclusion: In design stage prior to manufacturing, PoF can be analyzed, and it is possible to make a reliability improvement/validated design using design data. This study can be applied in every design step and contribute to make more stable development product.