• Proceedings of the Computational Structural Engineering Institute Conference
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• 2008.04a
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• pp.60-64
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• 2008

According to previous research, welding-induced stress in steel structures can significantly affect the fatigue behaviour; it produces initial damage of weldiug part of structure locally and residual stresses reduce the fatigue strength after welding precess. In this study, through continuum damage mechanics, we can estimate the weldiug damage using the stress and strain history during welding process and the effect of welding residual stress for assessment of fatigue life. The variation of welding-induced stresses and strains need be traced precisely in advance for a reliable weldiug damage assessment. In this study, a damage and fatigue analysis techniques for steel structures with welding-induced residual stress are presented. First, We calculate the history of temperature according with welding process. And residual stress with a welding thermal history was evaluated by non-linear thermal stress analysis. Secondly, welding damage and fatigue life are estimated with kinetic damage law.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.4
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• pp.181-190
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• 2004

The interest of the fatigue life of rubber components such as engine mounts is increasing according to the extension of warranty period of the automotive components. Automotive engine mounts get damaged due to thermal and mechanical loadings. This paper discusses a fatigue life prediction of the 3-dimensional dumbbell specimens for natural rubber compound considering the effects of maximum strain and heat aging temperature. Displacement controlled fatigue life tests were performed using specimens with different levels of maximum strain and various hardness. The basic mechanical properties test and the fatigue test of aged rubber specimen under normal and elevated temperature were executed. A procedure to predicted the fatigue life of vulcanized natural rubber material based on the maximum strain method was proposed, and then this curve was in good agreement with fatigue test data less than 200% error range.

• Journal of the Society of Naval Architects of Korea
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• v.45 no.6
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• pp.679-687
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• 2008

The fatigue life of ship structure under cyclic loading condition is made up of crack initiation and propagation stages. For a welding member in ship structure, the fatigue crack propagation life is more important than the fatigue crack initiation life. To calculate precisely the fatigue crack propagation life at the critical welding location, the knowledge of the residual stress sensitivity on the fatigue strength is necessary. In this study, thermo elastic-plastic analysis was conducted in order to examine the effect of residual stress on the fatigue crack propagation life. Also the fatigue crack propagation lives considering residual stress were calculated using fatigue crack growth code, AFGROW, on the basis of fracture mechanics. AFGROW is widely used for fatigue crack growth predictions under constant and variable amplitude loading. The reliability of AFGROW on the fatigue of ship structure was confirmed by the comparison of the estimated results with the fatigue propagation test results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.427-434
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• 2004

Ferritic stainless steel is recently used in high temperature structures because of its good properties of thermal fatigue resistance, corrosion resistance, and low price. Tensile and low-cycle fatigue (LCF) tests on 429EM stainless steel used in exhaust manifold were performed at several temperatures from room temperature to 80$0^{\circ}C$. Elastic Modulus, yield strength, and ultimate tensile strength monotonically decreased when temperature increased. Cyclic hardening occurred considerably during the most part of the fatigue life. Dynamic strain aging was observed in 200~50$0^{\circ}C$, which affects the cyclic hardening behavior. Among the fatigue parameters such as plastic strain amplitude, stress amplitude, and plastic strain energy density (PSED), PSED was a proper fatigue parameter since it maintained at a constant value during LCF deformation even though cyclic hardening occurs considerably. A phenomenological life prediction model using PSED was proposed considering the influence of temperature on fatigue life.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.1
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• pp.52-57
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• 2007

One of the hot issues in composite patching is to reduce the thermal residual stresses between composite patch and aluminum surface which occurs after bonding of composite patch. In this study, the edge crack patching is adopted for different curing cycles. For the analysis, three layer Mindlin plate elements are used, and Paris' law is adopted to predict the fatigue life of composite patch plate. The analysis results show a good agreement with the experimental fatigue life and this technique can be applied for the prediction of fatigue life of aircraft structures.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.911-917
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• 2010

In this study, we performed structural and fatigue analyses of the engine exhaust manifold that was subjected to thermo-mechanical cyclic loading. The methodologies used in this study are based on an approach in which the techniques for modeling the exhaust system, the temperature-dependent properties of the material, and thermal cyclic loading are taken into consideration and a reliable strategy is adopted for failure prediction. An application example shows that at an elevated temperature, considerable compressive plastic deformation is observed and that at a low temperature, tensile stresses remain in those parts of the test exhaust manifold where failure is observed. In order to predict fatigue life, mechanical damage is determined on the basis of the stress.strain hysteresis loops by using the classical Coffin.Manson equation and by adopting a method in which the dissipated plastic energy is taken into consideration.

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.273-276
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• 2001

• Proceedings of the KIPE Conference
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• 2002.11a
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• pp.205-208
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• 2002

Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.3_1spc
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• pp.504-508
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• 2013

This paper describes in detail the life prediction models and simulations of thermal fatigue under different mold compounds and chip sizes for wafer-level embedded SiP. Three-dimensional finite element models are built to simulate the viscoplastic behaviors for various mold compounds and chip sizes. In particular, the bonding parts between a mold and silicon nitride (Si3N4) are carefully modeled, and the strain distributions are studied. Three different chip sizes are used, and the effects of the mold compounds are observed. Through the numerical studies, it is found that type-C, which has a relatively lower Young's modulus and higher CTE, has a better fatigue life than the other mold compounds. In addition, the $4{\times}4$ chip has a shorter life than the $6{\times}6$ and $8{\times}8$ chips.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.