• 제목/요약/키워드: Thermal evolution

검색결과 356건 처리시간 0.026초

저온 분사 코팅법으로 제조된 Cu/CNT 복합 코팅층의 미세조직 및 물성 연구 (A Study on the Microstructure and Physical Properties of Cold Sprayed Cu/CNT Composite Coating)

  • 권성희;박동용;이대열;어광준;이기안
    • 대한금속재료학회지
    • /
    • 제46권3호
    • /
    • pp.182-188
    • /
    • 2008
  • Carbon nanotubes(CNTs) have outstanding mechanical, thermal, and electrical properties. Thus, by placing nanotubes into appropriate matrix, it is postulated that the resulting composites will have enhanced properties. Cold spray can produce thick metal-based composite coatings with very high density, low oxygen content, and phase purity, which leads to excellent physical properties. In this study, we applied cold spray coating process for the consolidation of Cu/CNT composite powder. The precursor powder mixture, in which CNTs were filled into copper particles, was prepared to improve the distribution of the CNT in copper matrix. Pure copper coating was also conducted by cold spraying as a reference. Annealing heat treatment was applied to the coating to examine its effect on the properties of the composite coating. The hardness of Cu/CNT composite coating represented similar value to that of pure copper coating. It was importantly found that the electrical conductivity of the Cu/CNT composite coating significantly increased from 53% for the standard condition to almost 55% in the optimized condition, taking annealed ($500^{\circ}C/1hr$.) copper coating as a reference (100%). The thermal conductivity of Cu/CNT composite coating layer was higher than that of pure Cu coating. It was also found that the electrical and thermal conductivities of Cu/CNT composite could be improved through annealing heat treatment. The microstructural evolution of Cu/CNT coating was also investigated and related to the macroscopic properties.

열-수리-역학 거동 해석을 위한 경계면 요소의 수식화 (Numerical Formulation of Thermo-Hydro-Mechanical Interface Element)

  • 신호성;윤석
    • 한국지반공학회논문집
    • /
    • 제38권9호
    • /
    • pp.45-52
    • /
    • 2022
  • 암반내 불연속면이나 지반-구조물의 접촉면은 열-수리-역학적으로 연계된 거동 특성을 보이므로, 온전한 지배방정식에 근거한 경계면 요소의 개발이 필요하다. 본 논문은 경계면 요소에 대한 힘평형 방정식, 유체의 연속방정식 그리고 에너지 평형 방정식을 유도하였다. 그리고 경계면 요소에 대한 탄소성 역학 모델의 강성행렬을 제시하였다. 개발된 유한요소는 2차원 조건에서 변위는 6절점, 수압과 온도는 4절점을 사용한다. 단층내 유체 주입에 대한 완전연계된 THM 해석은 단층내의 유효응력 감소와 주위 암반의 온도 수축에 의한 주입압의 복합적인 변화을 모델링 할수 있었다. 하지만, 열적 현상을 무시한 HM해석은 수리-역학적 변수를 과다하게 산정하였다.

대구경 파이프용 필라멘트 와인딩을 위한 UV 경화시스템 (UV-Curing System for the Filament Winding of Large Diameter Pipe)

  • 최재원;김세일;정용찬;전병철
    • 청정기술
    • /
    • 제16권4호
    • /
    • pp.245-253
    • /
    • 2010
  • 대구경 강관 표면 보호를 위해 사용되는 필라멘트 와인딩 공정에 불포화 폴리에스터 (unsaturated polyester: UP)를 이용한 자외선 (ultraviolet) 경화 방법을 적용하고자, UP를 이용한 최적의 UV 경화 조건을 찾아보았다. 기존의 유기계 과산화물을 개시제로 사용한 열경화 방법에서는 개시제의 불안정성, 휘발성 유기물 발생, 열에 약한 대상물질의 변형 등 문제점이 발생하므로 이에 대한 개선책으로 UV 경화방법을 시도하였다. UV 경화에 사용되는 다양한 개시제 중에서 비교적 침투력이 높아서 두꺼운 고분자 층 형성이 가능한 개시제 2 종(Irgacure 819 및 Darocure 1173)을 선정하여 이들의 조합비율에 따라 경화된 UP 고분자에 대한 열역학적, 기계적 물성을 비교 분석하여 우수한 경화조건 (개시제 함량 1.5 phr, 혼합 비율 1:1.2, UV 램프로는 갈륨램프)을 찾아내었다. 또한 UP 광경화수지의 경도, 충격강도, 굴곡강도 향상을 위해 유리섬유를 수지 내에 적층하여 복합재료를 제조하고 이들의 특성을 비교한 결과 충격강도가 매우 향상되었다.

Äspö 원형 처분장에 대한 열-수리-역학적 모델링 연구: 열적 거동 해석 (Thermal-hydro-mechanical Modelling for an Äspö prototype repository: analysis of thermal behavior)

  • 이재완;;최희주
    • 터널과지하공간
    • /
    • 제23권5호
    • /
    • pp.372-382
    • /
    • 2013
  • 고준위폐기물처분장에 대한 열-수리-역학적 거동 모델링은 처분장의 성능 및 안전성 평가를 위해서 선행되어야 할 중요한 연구과제이다. 본 연구에서는 $\ddot{A}$sp$\ddot{o}$ 원형처분장의 열적 거동을 해석하고, 현장 실험데이터와의 비교를 통해 모델 계산결과의 타당성을 검증하였다. 모델 시뮬레이션에서는 처분공과 처분터널 및 그 주변 암반에 대한 온도분포를 분석하였다. 현장 실험데이터와의 비교는 처분공 DH-6를 대상으로 수행하였다. 그 결과 모델 계산치는 측정위치에 따라 실험치 보다 약 2-$5^{\circ}C$ 정도 높은 온도값을 보였으나, 온도변이 곡선은 비슷한 패턴을 보여 주었다. 실험치와 모델 계산치의 이러한 차이는 모델에 의한 열적거동 해석에서 암반을 제외한 완충재, 벤토나이트 펠렛, 뒷채움재 내의 수리학적 및 역학적 거동을 고려하지 않았기 때문으로 판단되었다.

Nonequilibrium Domain Configurations Undergoing Large Angle Rotations in Mesoscopic Magnetic Thin Film Elements (retracted)

  • Choi, B.C.;Hong, Y.K.;Rudge J.;Donohoe G.;Xiao Q.F.
    • Journal of Magnetics
    • /
    • 제11권2호
    • /
    • pp.61-65
    • /
    • 2006
  • The physical origin of complex dynamic domain configuration in nonequilibrium magnetic systems with mesoscopic length scales has been studied. An increasing complexity in the spatial feature of the evolution is found to accompany the increasing reversal speed, when a ferromagnetic element is driven by progressively faster switching fields applied antiparallel to the initial magnetization direction. As reversal rates approach the characteristic precession frequencies of spin fluctuations, the thermal energy can boost the magnetization into local configurations which are completely different from those experienced during quasistatic reversal. The sensitive dependence of the spatial pattern on switching speed can be understood in terms of a dynamic exchange interaction of thermally excited spins; the coherent modulation of the spins is strongly dependent on the rise time of switching pulses.

Analysis and Evaluation of Capillary Passive Valves in Microfluidic Systems Using a Centrifugal Force

  • Cho, Han-Sang;Kim, Ho-Young;Kang, Ji-Yoon;Kwak, Seung-Min;Kim, Tae-Song
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • 제4C권4호
    • /
    • pp.155-159
    • /
    • 2004
  • This work reports the theoretical and experimental investigations of capillary bust valves to regulate liquid flow in microchannels. The theoretical analysis uses the Young-Laplace equation and geometrical considerations to predict the pressure at the edge of the valve opening. Numerical simulations are employed to calculate the meniscus shape evolution while the interface is pinned at the valve edge. Microchannels and valves are fabricated using soft lithography. A wafer-rotating system, which can adjust the driving pressure by rotational speed, induces a liquid flow. Experimentally measured valve-bursting pressure agrees with theoretical predictions.

Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술 (High-temperature Semiconductor Bonding using Backside Metallization with Ag/Sn/Ag Sandwich Structure)

  • 최진석;안성진
    • 마이크로전자및패키징학회지
    • /
    • 제27권1호
    • /
    • pp.1-7
    • /
    • 2020
  • The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

리튬이온전지용 난연성 첨가제(TCP, TFPP)의 전기화학적 특성 (Electrochemical Performance of Tricredyl Phosphate and Trispentafluorophenly Phosphine as Flame Retardant Additives for Lithium-ion Batteries)

  • 안세영;김기택;김현수;남상용
    • 한국전기전자재료학회논문지
    • /
    • 제20권9호
    • /
    • pp.756-760
    • /
    • 2007
  • Flame retardant(FR) properties were investigated with tricredyl phosphate(TCP) and tris(pentafluorophenyl)phosphine(TFPP) as additives for lithium-ion batteries. Thermal stability was improved with additives in $Li/LiNi\frac{1}{3}Mn\frac{1}{3}Co\frac{1}{3}O_2$ cells comparing to non-additive electrolytes. Oxygen evolution reaction of the cathode material was delayed to up $55^{\circ}C$, from $275^{\circ}C\;to\;330^{\circ}C$. Electrolytes with the 1 wt.% additives provided good FR properties while the resonable battery performance is maintained.

전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석 (Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging)

  • 송대현;최낙봉;김애정;조경목;박익민
    • 한국복합재료학회:학술대회논문집
    • /
    • 한국복합재료학회 2000년도 춘계학술발표대회 논문집
    • /
    • pp.175-183
    • /
    • 2000
  • The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

  • PDF

와이어 방전가공에서 전류파형이 양극침식에 미치는 영향 (Influence of Current Waveform on Anode Erosion in Wire Electric Discharge Machining)

  • 조성산;오진혁
    • 한국정밀공학회지
    • /
    • 제18권7호
    • /
    • pp.127-133
    • /
    • 2001
  • The effects of triangular and rectangular discharge current waveforms on anode erosion in wire electric discharge machining is investigated based on heat transfer analysis of half-space subject to time and space-dependent heat flux. The thermal load on the anode is simulated by a hear flux that is calculated from time-dependent discharge channel radius and energy. Evolution of the melting front during discharge, the molten volume at the experimental result for qualitative verification of the analysis. It is demonstrated that the triangular current waveform is more efficient in eroding the anode than the rectangular one.

  • PDF