• Current Photovoltaic Research
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• 제10권1호
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• pp.23-27
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• 2022

In this study, we investigate organic-inorganic halide perovskite solar cells with a vacuum thermal evaporated hole transporting layer (NPB/MoO_3-x). By replacing solution process based Spiro-MeOTAD with vacuum thermal evaporation based NPB/MoO_3-x, a thin hole transporting layer was implemented. In addition, parasitic absorption that may occur during the doping process was eliminated by excluding solution process doping. In a solar cell with a thin vacuum thermal evaporated hole transporting layer, the short-circuit current density (Jsc) increased to 23.93 mA/cm², resulting in the highest power converstion efficiency (PCE) at 18.76%. Considering these results, it is essential to control the thickness of hole transporting layer located at the top in solar cell configuration.

• 한국세라믹학회지
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• 제32권3호
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• pp.349-358
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• 1995

The ceramic composite membrane was synthesized by thermal oxidation after evaporation of Al on the support prepared by slip casting process. Oxidation was performed at $700^{\circ}C$ and 80$0^{\circ}C$ under dry oxygen atmosphere. It was considered as optimum oxidation condition that the membrane showed a knudsen behaviro. A further oxidation resulted in an increase of gas permeability because top layer became densified. Then, a multi-layered composite membrane was synthesized through a sol-gel method, evaporation and thermal oxidation of Al coating processes. While the membrane was thermally stable up to 80$0^{\circ}C$, gas permeability was rapidly decreased even at a slight amount of deposition of Al.

• 한국세라믹학회지
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• 제47권2호
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• pp.142-145
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• 2010

We made a film of a few ${\mu}m$ thickness by evaporating $As_2S_3$ piece to perpendicularly cut optical fiber by thermal evaporation process. Linear refractive index(n) and linear absorption coefficient(k) of amorphous $As_2S_3$ are 2.525 and $1.727{\times}10^{-3}$, respectively. A surface roughness did not exceed 2 nm and a transmission spectrum showed that the sample of thermal evaporation was homogeneous.

• 한국전기전자재료학회논문지
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• 제25권11호
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• pp.873-877
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• 2012

The effect of oxygen pressure in the synthesis of ZnO nanostructures through thermal evaporation of Zn powder was investigated. The thermal evaporation process was carried out in oxygen ambient for 1 hr at $1,000^{\circ}C$ under different pressures. The oxygen pressure was changed in range of 0.5 ~ 900 Torr. Any nanostructure was not formed on the specimens prepared at oxygen pressures lower than 10 Torr. When oxygen pressure was 100 Torr, ZnO nanowires were observed. With increasing the oxygen pressure to 500 Torr, the morphology of ZnO nanostructures changed from wire to tetrapod. For all the samples, room temperature photoluminescence spectra show a strong green emission peak at around 550 nm.

• Journal of Ceramic Processing Research
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• 제19권5호
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• pp.424-427
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• 2018

The effect of oxygen pressure in the synthesis of $SnO_2$ micro/nanocrystals through thermal evaporation of Sn powder was investigated. The thermal evaporation process was performed at $1000^{\circ}C$ for 1 hr under various oxygen pressures. The pressure of oxygen changed from 10 to 500 Torr. The morphology of $SnO_2$ crystals changed drastically with oxygen pressure. $SnO_2$ nanoparticles with an average diameter of 120 nm were formed at oxygen pressure lower than 10 Torr. $SnO_2$ nanowires were grown under an oxygen pressure of 100 Torr. The nanowires have diameters in the range of 100 ~ 500 nm and lengths of several tens of micrometers. As increasing the oxygen pressure to 500 Torr, the sizes of wires increased. A strong visible emission peak centered at about 500 ~ 600 nm was observed in the room temperature cathodoluminescence spectra of all the products.

• 연구논문집
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• 통권30호
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• pp.15-23
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• 2000

In this study, develop the thermal pump using water evaporation and condensation. Vapor from heating room moves up to pumping room and press the water of pumping room. Consequently water is pumped out to water tank. Then hot vapor direct contact with cold water in condensing room after pumping process. At this time, pressure of condensing room is down to-5kPa and suck in water of tank. This pump executes self ping and good durability because of no mechanical moving parts. Thermal pump is pumped cyclic so that, this pump is not used single. Therefore thermal pump of hot water boiler used to multi-stage for stable pumping rate. As the result of performance test, the developed thermal pump proves pumping action of water evaporation/condensation. And total volume flow rate is 500liter during one hour. If three thermal pump is installed parallel, this pump can use to the hot water boiler in the 300,000kcal/h class.

• 설비공학논문집
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• 제28권11호
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• pp.434-443
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• 2016

The evaporation of water from an aqueous solution is widely used in the food, desalination, pulp, and chemical industries. Usually, a large amount of energy is consumed in the evaporation process to boil off water due to atmospheric pressure. As a way of improving the energy efficiency of the evaporation process, the combination of multiple effect evaporation and thermal vapor recompression has been proposed and has become a successful technique. In this study, 4 multiple-effect falling film type evaporators for sugar solution are designed and the energy efficiency of the system is analyzed in response to the selection of the steam ejector position. Energy efficiency is increased and vapor is more compressed in the steam ejector as the Thermal Vapor Recompression (TVR) is arranged in the rear part of the evaporator system. A simplified 0-dimensional evaporator model is developed using non-linear equations derived from mass balances, energy balances, and heat transfer equations. Steam economy is calculated to compare the evaporation performance of the 4 proposed evaporators. The entrainment ratio, compression ratio, and expansion ratio are computed to check the ejector performance.

• 한국분무공학회지
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• 제26권1호
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• pp.1-8
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• 2021

Droplet evaporation has been known as a common phenomenon in daily life, and it has been widely used for many applications. In particular, the influence of the different heated substrates on evaporation flux and flow characteristics is essential in understanding heat and mass transfer of evaporating droplets. This study aims to simulate the droplet evaporation process by considering variation of thermal property depending on the substrates and the surface temperature. The commercial program of ANSYS Fluent (V.17.2) is used for simulating the conjugated heat transfer in the solid-liquid-vapor domains. Moreover, we adopt the diffusion-limited model to predict the evaporation flux on the different heated substrates. It is found that the evaporation rate significantly changes with the increase in substrate temperature. The evaporation rate substantially varies with different substrates because of variation of thermal property. Also, the droplet evaporates more rapidly as the surface temperature increases owing to an increase in saturation vapor pressure as well as the free convection effect caused by the density gradient.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.184-185
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• 2006

Two-step growth to incorporate the Mg atoms in the ZnO nanorods fabricate by thermal evaporation process and also utilized the ZnO film as a template. In the first step of low temperature, Zn seed metals with low melting temperature formed the droplet, and then MgZnO ternary nanorods were grown by injecting oxygen and evaporating Mg atoms in high temperature process of the second step. The vertical growth of the MgZnO nanorods with large-area distribution and uniformity was successfully performed on the ZnO template. We investigated the shape of the vertically grown 1-D MgZnO nanorods and characterized the optical and crystal properties. We confirmed the incorporation of Mg atoms by the EDS and PL spectrum.

• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.