• Current Optics and Photonics
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• v.3 no.5
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• pp.445-450
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• 2019

The influence of high-power laser diode (HPLD) emitter width on the device performance is investigated for 975-nm (In,Ga)(As,P)/(Al,Ga)As broad-area HPLDs, using self-consistent electro-thermal-optical simulation. To guarantee the simulation's accuracy, simulated results are matched with the measured results for a sample HPLD with fitting parameters. The influences of HPLD emitter width on temperature distribution, output power, and the beam product parameter (BPP) are analyzed for three different emitter widths of 50, 70, and $90{\mu}m$. It is found that a device with smaller emitter width exhibits both thermal rollover and thermal blooming at lower output power, but smaller BPP.

• Korean Journal of Optics and Photonics
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• v.18 no.3
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• pp.208-215
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• 2007

A fiber-coupled laser-diode pumped ceramic Nd:YAG laser for compensating the thermal tensing effect was developed. The thermal tensing effect was compensated using a convex lens, which was 25 mm away from the laser rod, with a focal length of 30 mm and an effective clear aperture of 22 mm. Without a compensator, the laser output power decreased suddenly above a pump power of 6 W. Using a compensator, the laser output power increased linearly according to the pump power. The beam propagation factor $M^{2}$ was 2.4 under a pump power of 12 W.

• Proceedings of the Optical Society of Korea Conference
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• 1990.02a
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• pp.69-72
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• 1990

For the effective heat transfering in Lser Diodes, Beam-Lead structure were introduced which is applicable to hybrid Optoelectronic Integrated Circuits. A 5-layer planar structure Laser Diode is fabricated and Beam-Lead is made by Au plating. And carrier was made by etching Si substrate and LD was mounted on a carrier. The thermal resistance was measured and we could certain that Beam-Lead structure behaves well as a heat sink.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.415-420
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• 2007

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

• Journal of information and communication convergence engineering
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• v.4 no.3
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• pp.105-107
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• 2006

Amorphous silicon is a kind of optical to electric conversion material with current or voltage type after generating a numerous free electron and hole when it is injected by light. It is very effective technology to make schottky diode by bonding thin film to use optical diode. In this paper, we have fabricated optical diode device by forming chrome silicide film through thermal processing with thin film($100{\AA}$) having optimal amorphous silicon. The optimal condition is that we make a thin film by using PECVD(Plasma Enhanced Chemical Vapor Deposition) to improve reliability and characteristics of optical diode. We have obtained high quality diode by using chrome silicide optical diode from dark current and optical current measurement compared to previous method. It makes a simple process and improves a good reliability.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.16 no.6
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• pp.126-129
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• 2002

To extract exact screening conditions of TO-CAN laser diode, junction temperature during screening was investigated. Temperature increase due to thermal resistance was measured and compared with theoretical calculation. Injection current dependence of injection temperature was derived with good agreement with experimental data and used to obtain accurate screening conditions.

• Proceedings of the Optical Society of Korea Conference
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• 1990.02a
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• pp.79-81
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• 1990

Temperature distribution of laser diode chip mounted on ideal heat kink was calculated by numerical analysis. In numerical analysis, infinite difference method and Gauss-Scidel iteration was adopted on the basis of two dimensional heat conduction phenomena. As a result, temperature increase of active medium of laser diode driven at 60mA was calculated to be 1.47$^{\circ}C$

• Korean Journal of Optics and Photonics
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• v.14 no.1
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• pp.44-50
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• 2003

This paper describes the thermal effect at Nd:YAG using a laser-diode side-pumping. To detect the depolarization loss and the retardation caused by the thermal effect, a λ/4 plate is inserted between the polarizer and the Nd:YAG laser material. Using a CCD has allowed detection of the variation of the beam pattern that could analyze the change of the refractive index of the Nd:YAG laser material by the thermal effect. Through the change of the probe beam power, we know that 21% of the pumping power was converted into heat in the material. The depolarization loss was 24.7% under a temperature of $25^{\circ}C$ of the laser material and a pumping power of 15 W. The inhomogeneous distribution showed that the retardation angle was 7$^{\circ}$ in the center of the material and 19$^{\circ}$ on the edge of it. It is confirmed that the thermal effect is analyzed at the each point of the laser material and it suggests an effective method to reduce the thermal effect on the LD side-pumped laser material.

• Korean Journal of Optics and Photonics
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• v.27 no.6
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• pp.218-222
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• 2016

The thermal characteristics of a laser diode TO package has been analyzed using a commercial computational fluid dynamics (CFD) tool, and the thermal bypass structure was optimized. Comparison of device temperature and the estimated thermal resistance of the resultant structure showed that the bypass structure relieved the thermal bottleneck, and improved the thermal characteristics quite efficiently.

• The KSFM Journal of Fluid Machinery
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• v.18 no.3
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• pp.33-37
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• 2015

A numerical study on the IPM/Bridge Diode cooling and coil cooling has been performed. Results are presented as plots of thermal resistance, temperature drop and RPM-ratio. CFD analysis for conventional cooling system has been performed as a reference case. As the RPM-Ratio was increased, heatsink thermal resistance and coil temperature were decreased. IPM/Bridge Diode thermal resistance and temperature of the coil is tended to be trade-off. The temperature of coil closest to the AC-motor fan showed the most significant change in accordance with duct design. The temperature of coil located at the top of DC-motor fan showed the most significant variation as the cooling air passes the heatsink fin area.