• The Bulletin of The Korean Astronomical Society
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• v.37 no.2
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• pp.167.2-167.2
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• 2012

경희대학교와 UC Berkeley, Imperial College London에서 공동으로 진행하는 TRIO-CINEMA Mission(TRiplet Ionosphere Observatory-Cubesat for Ion, Neutral, Electron and MAgnetic fields)은 총 3기의 초소형 위성으로 구성되어 있다. 3기의 위성은 고도 650~800km 상공의 태양동주기 궤도운동을 예상하고 있으며, 지구 근접공간의 입자 검출과 자기장 측정의 과학 임무를 맡게 된다. TRIO-CINEMA 비행 모델(Flight Model)의 환경시험은 진동시험과 열진공시험으로 진행되었다. 진동시험은 X, Y, Z 세 축에 대해 Sine 과 Random 모드로 진행되었다. TRIO-CINEMA가 탑재 될 러시아의 드네프르 로켓의 요구사항은 각 축에서 20Hz 이상의 고유진동수, Sine의 경우 최대 0.8G와 4oct/min Sweep Rate, Random의 경우 5.2Grms 와 35초의 지속시간에서의 안정성을 만족하는 것이다. 시험 결과 TRIO-CINEMA가 요구사항을 모두 만족시키는 것을 확인하였다. 또한, 열 주기 시험(Thermal Cycling Test)을 진행하여 우주공간에서 위성 시스템이 정상 동작하는지에 대한 신뢰성을 검증하였다. 열주기 시험은 미국 MIL표준 값을 참고하여 $10^{-6}Torr$에서 $-20{\sim}30^{\circ}C$의 온도를 주었으며, 시험을 진행하는 동안과 시험 후에 위성이 정상작동 함을 확인하였다. 이에 본 연구의 시험 방법과 그 결과를 기술하였다.

• Korean Journal of Optics and Photonics
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• v.10 no.1
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• pp.73-79
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• 1999

Semiconductor optical switch modules of 1$\times$2, 1$\times$4, and 4$\times$4 types for 1550 nm optical communication systems were fabricated by using laser welding technique, embodying in 30-pin butterfly package. For better coupling efficiency between switch chip and optical fiber, tapered fibers of 10~15mm lens radii were used, which provided up to 60% optical coupling efficiency. With the help of new laser hammering process, we could recover the lost optical power almost completely up to average 82% of initially obtained power. The fabricated optical switch modules showed good thermal stability of less than 5% degradation even after 200 times thermal cycling test. The 2.5 Gbps optical transmission characteristics of the 4$\times$4 switch module showed low sensitivities of less than -30dB for all possible switching paths. The transmission penalties of 1$\times$2 switch module at $10^{-10}$ BER were 0.6dB and 0.7dB for 50Xm and 90 Km optical fibers, respectively.

• Progress in Superconductivity and Cryogenics
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• v.19 no.2
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• pp.25-28
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• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• The Journal of Advanced Prosthodontics
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• v.9 no.5
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• pp.328-334
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• 2017

PURPOSE. This study evaluated fracture resistance with regard to ferrule lengths and post reinforcement on endodontically treated mandibular premolars incorporating a prefabricated post and resin core. MATERIALS AND METHODS. One hundred extracted mandibular premolars were randomly divided into 5 groups (n=20): intact teeth (NR); endodontically treated teeth (ETT) without post (NP); ETT restored with a prefabricated post with ferrule lengths of either 0 mm (F0), 1 mm (F1), or 2 mm (F2). Prepared teeth were restored with metal crowns. A thermal cycling test was performed for 1,000 cycles. Loading was applied at an angle of 135 degrees to the axis of the tooth using a universal testing machine with a crosshead speed of 2.54 mm/min. Fracture loads were analyzed by one-way ANOVA and Tukey HSD test using a statistical program (${\alpha}=.05$). RESULTS. There were statistical differences in fracture loads among groups (P<.001). The fracture load of F2 ($237.7{\pm}83.4$) was significantly higher than those of NP ($155.6{\pm}74.3N$), F0 ($98.8{\pm}43.3N$), and F1 ($152.8{\pm}78.5N$) (P=.011, P<.001, and P=.008, respectively). CONCLUSION. Fracture resistance of ETT depends on the length of the ferrule, as shown by the significantly increased fracture resistance in the 2 mm ferrule group (F2) compared to the groups with shorter ferrule lengths (F0, F1) and without post (NP).

• Restorative Dentistry and Endodontics
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• v.43 no.2
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• pp.26.1-26.12
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• 2018

Objective: The purpose of this study was to investigate the degree of conversion (DC) and mechanical properties of a microhybrid Filtek Z250 (3M ESPE) resin composite after aging. Method: The specimens were fabricated using circular molds to investigate Vickers microhardness (Vickers hardness number [VHN]) and DC, and were prepared according to ISO 4049 for flexural strength testing. The initial DC (%) of discs was recorded using attenuated total reflectance-Fourier transforming infrared spectroscopy. The initial VHN of the specimens was measured using a microhardness tester under a load of 300 g for 15 seconds and the flexural strength test was carried out with a universal testing machine (crosshead speed, 0.5 mm/min). The specimens were then subjected to thermocycling in $5^{\circ}C$ and $55^{\circ}C$ water baths. Properties were assessed after 1,000-10,000 cycles of thermocycling. The surfaces were evaluated using scanning electron microscopy (SEM). Data were analyzed using 1-way analysis of variance followed by the Tukey honest significant difference post hoc test. Results: Statistical analysis showed that DC tended to increase up to 4,000 cycles, with no significant changes. VHN and flexural strength values significantly decreased upon thermal cycling when compared to baseline (p < 0.05). However, there was no significant difference between initial and post-thermocycling VHN results at 1,000 cycles. SEM images after aging showed deteriorative changes in the resin composite surfaces. Conclusions: The Z250 microhybrid resin composite showed reduced surface microhardness and flexural strength and increased DC after thermocycling.

• The Journal of Advanced Prosthodontics
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• v.11 no.4
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• pp.223-231
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• 2019

PURPOSE. The purpose of this study was to evaluate the shear bond strength (SBS) of an indirect resin composite (IRC) to the various resin matrix ceramic (RMC) blocks using different surface treatments. MATERIALS AND METHODS. Ninety-nine cubic RMC specimens consisting of a resin nanoceramic (RNC), a polymer-infiltrated hybrid ceramic (PIHC), and a flexible hybrid ceramic (FHC) were divided randomly into three surface treatment subgroups (n = 11). In the experimental groups, untreated (Cnt), tribochemical silica coating (Tbc), and Neodymium-Doped Yttrium Aluminum Garnet (Nd:YAG) laser irradiation (Lsr) with 3 W (150 mJ/pulse, 20 Hz for 20 sec.) were used as surface treatments. An indirect composite resin (IRC) was layered with a disc-shape mold ($2{\times}3mm$) onto the treated-ceramic surfaces and the specimens submitted to thermal cycling (6000 cycles, $5-55^{\circ}C$). The SBS test of specimens was performed using a universal testing machine and the specimens were examined with a scanning electron microscope to determine the failure mode. Data were statistically analyzed with two-way analysis of variance (ANOVA) and Tukey HSD test (${\alpha}=.05$). RESULTS. According to the two-way ANOVA, only the surface treatment parameter was statistically significant (P<.05) on the SBS of IRC to RMC. The SBS values of Lsr-applied RMC groups were significantly higher than Cnt groups for each RMC material, (P<.05). Significant differences were also determined between Tbc surface treatment applied and untreated (Cnt) PIHC materials (P=.039). CONCLUSION. For promoting a reliable bond strength during characterization of RMC with IRC, Nd:YAG laser or Tbc surface treatment technique should be used, putting in consideration the microstructure and composition of RMC materials and appropriate parameters for each material.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.