• Journal of Applied Reliability
• /
• v.14 no.1
• /
• pp.45-51
• /
• 2014

Thermal shock tests at two stress levels were performed to see the life (cycles) of LPF ASSY (low pass filter assembly) at normal stress level. In this case Coffin-Manson relationship is generally used to describe the relationship between the temperature difference and the life, together with the Weibull distribution describing the life at each stress level. So for given data Coffin-Manson is fitted to predict the life at normal stress level. However, different types of models are appropriate for this type of test. Hence, a more appropriate model such as General log-linear model which can also incorporate the duration at the highest and lowest temperatures and acceleration time will be introduced.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.11a
• /
• pp.89-98
• /
• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• Journal of the Korean Society of Industry Convergence
• /
• v.3 no.1
• /
• pp.69-75
• /
• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.23 no.6
• /
• pp.413-420
• /
• 2011

Thermodynamic cycles using binary mixtures as working fluids offer a high potential for utilization of low-temperature heat sources. This paper presents a thermodynamic performance analysis of Goswami cycle which was recently suggested to produce power and cooling simultaneously and combines the Rankine cycle and absorption refrigeration cycle by using ammoniawater mixture as working fluid. Effects of the system parameters such as concentration of ammonia and turbine inlet pressure on the system are parametrically investigated. Results show that refrigeration capacity or thermal efficiency has an optimum value with respect to ammonia concentration as well as to turbine inlet pressure.

• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.21-23
• /
• 2006

The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

• Atmosphere
• /
• v.20 no.3
• /
• pp.355-366
• /
• 2010

The tropopause pressure in the Arctic region is calculated by the conventional thermal and dynamical methods using 30-year reanalysis data. The tropopause pressures determined thermally and dynamically both show semiannual cycles with one peak in April and May, and another in October, contrary to the tropopause temperatures. Although tropopause levels are higher both in January and July, the level of the tropopause in January seems to be associated with the stratospheric temperatures while that of July seems to be associated with the tropospheric temperatures. During the 30-year period the most significant trend appears in April, and it is shown that the altitude of the Arctic tropopause has been rising. Although a potential reason for this trend is stratospheric cooling due to ozone depletion, significant tropospheric warming in April is considered to be another reason.

• Textile Coloration and Finishing
• /
• v.20 no.4
• /
• pp.8-14
• /
• 2008

Flame-retardant cotton fabrics were prepared by UV curing of photocurable aqueous formulations of phosphorous-containing methacrylate monomers and 2-hydroxy-2-methyl-1-phenyl-1-propanone as flame retardants and a photoinitiator respectively, which is an environmentally friendly and energy-saving process. The characterization of the UV-coated cotton fabric was made by ATR, TGA and limited oxygen index measurement. UV cured coating onto cotton fabrics reduced the first thermal decomposition temperature and mass loss as well as increase in the amount of char residue compared with the untreated cotton fabric presumably due to modified thermal decomposition process. The LOI values up to 28.5 and 27.2 were obtained by the UV curing of MMEP and TMEP respectively. The treatment was durable to five laundering cycles, which was more prominent in the case of trifunctional TMEP treatment.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.10 no.5
• /
• pp.661-669
• /
• 1986

In this study, the resistance spot welding process of an aluminum alloy was analyzed through the numerical simulation including the electric contact resistance and the heat generation in the electrode. The finite element model was used to solve the electro-thermal responses in weld cycles. The resistance of the contact area was represented as the contact element modeling, but the thermal resistance between the contact surfaces was neglected. Welding tests of Alclad 2024-T3 aluminum alloy were made not only to get the input data for the numerical simulation, but also to compare the numerical results. The contact resistance was determined initially by the contact resistance tests and assumed to decay exponentially up to the solidus temperature. The temperature distributions and dynamic resistance obtained numerically were in good agreement with the experimental results. Numerical results revealed that nugget growth depends mainly on the heat generated in the workpiece and its contact area. The heat generated in the electrode has, however, only a little effect on the nugget growth, and the heat generation in the electrode-workpiece interface is initially high but decrease repidly.

• Transactions on Electrical and Electronic Materials
• /
• v.11 no.4
• /
• pp.182-185
• /
• 2010

$Pb_{0.99}[(Zr_{0.6}Sn_{0.4})_{0.9}Ti_{0.1}]_{0.98}Nb_{0.02}O_3$ (PNZST) thin films were deposited by radio frequency magnetron sputtering on a $(La_{0.5}Sr_{0.5})CoO_3$ (LSCO)/Pt/Ti/$SiO_2$/Si substrate using a PNZST target with an excess PbO of 10 mole%. The thin films deposited at the substrate temperature of $500^{\circ}C$ crystallized to a perovskite phase after rapid thermal annealing (RTA). The thin films, which annealed at $650^{\circ}C$ for 10 seconds in air, exhibited good crystal structures and ferroelectric properties. The remanent polarization and coercive field of the fabricated PNZST capacitor were approximately $20uC/cm^2$ and 50 kV/cm, respectively. The reduction of the polarization after $2.2\;{\times}\;10^9$ switching cycles was less than 10%.

• 한국태양에너지학회:학술대회논문집
• /
• 2011.04a
• /
• pp.191-194
• /
• 2011

Low-grade waste heat has generally been discarded in industry due to lack of efficient recovery methods. In recent years, organic Rankine cycle(ORC) has become a field of intense research and appears as a promising technology for conversion of heat into useful work of electricity. In this work thermodynamic performance of ORC with superheating of vapor is comparatively assessed for various working fluids. Special attention is paid to the effects of system parameters such as the evaporating temperature on the characteristics of the system such as maximum possible work extraction from the given source, volumetric flow rate per 1 kW of net work and quality of the working fluid at turbine exit as well as thermal efficiency.