• Bulletin of the Korean Chemical Society
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• 제34권12호
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• pp.3787-3789
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• 2013

In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand.

• 한국염색가공학회지
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• 제30권3호
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• pp.180-189
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• 2018

To study the effect of stereoisomeric structures of curing agents on curing behaviors, thermal and mechanical properties of epoxy resins, DGEBA(diglycidyl ether of bisphenol A) epoxy resin and 3,3'- and 4,4'-DDS(diaminodiphenyl sulfone) curing agents were selected. The curing initiation temperature and activation energy of DGEBA/3,3'-DDS was lower than DGEBA/4,4'-DDS. DGEBA/3,3'-DDS has a faster curing rate and higher degree of cure than DGEBA/4,4'-DDS, suggesting that 3,3'-DDS has higher reactivity than 4,4'-DDS. Tensile strength and fracture toughness of DGEBA/3,3'-DDS was lower than those of DGEBA/4,4'-DDS, indicating that mechanical properties of the epoxy resin can be different only by the stereoisomeric difference in chemical structure of the curing agent.

• Journal of the Korean Wood Science and Technology
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• 제40권2호
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• pp.110-122
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• 2012

This study investigated the effects of layered clay on the thermal curing behavior and tensile properties of resole phenol-formaldehyde (PF) resin/clay/cellulose nanocomposites. The thermal curing behavior of the nanocomposite was characterized using conventional differential scanning calorimetry (DSC) and temperature modulated (TMDSC). The addition of clay was found to accelerate resin curing, as measured by peak temperature ($T_p$) and heat of reaction (${\Delta}H$) of the nanocomposite’ curing reaction increasing clay addition decreased $T_p$ with a minimum at 3~5% clay. However, the reversing heat flow and heat capacity showed that the clay addition up to 3% delayed the vitrification process of the resole PF resin in the nanocomposite, indicating an inhibition effect of the clay on curing in the later stages of the reaction. Three different methods were employed to determineactivation energies for the curing reaction of the nanocomposite. Both the Ozawa and Kissinger methods showed the lowest activation energy (E) at 3% clay content. Using the isoconversional method, the activation energy ($E_{\alpha}$) as a function of the degree of conversion was measured and showed that as the degree of cure increased, the $E_{\alpha}$ showed a gradual decrease, and gave the lowest value at 3% nanoclay. The addition of clay improved the tensile strengths of the nanocomposites, although a slight decrease in the elongation at break was observed as the clay content increased. These results demonstrated that the addition of clay to resole PF resins accelerate the curing behavior of the nanocomposites with an optimum level of 3% clay based on the balance between the cure kinetics and tensile properties.

• Elastomers and Composites
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• 제43권1호
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• pp.1-7
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• 2008

DSC 및 컴파운드 온도 측정을 통해 원적외선에 의한 EPDM의 가교 반응을 연구하였으며, 특히 동일 조건에서의 열풍에 의한 가교 시험을 통해 원적외선 가교시의 효율성을 평가하였다. 원적외선 및 열풍에 의한 EPDM 컴파운드의 가교도를 분석한 결과, 동일 조건에서 원적외선가교 시료의 가교도가 열풍가교에 비해 높게 나타남을 확인할 수 있었으며, 특히 3 mm 두께 시편의 경우 약 2배가량 높은 가교도를 나타내었다. EPDM 컴파운드의 열전도도의 증가는 원적외선에 의한 가교도를 크게 증가시켰으나, 열풍에 의한 가교도의 변화에는 거의 영향을 주지 못하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.83-87
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• 2004

In this work, the cure cycle of co-cured metal/composite structure was investigated to decrease fabricating thermal residual stresses between the metal and the composite material. DSC (Differential scanning calorimetry) experiment and static lap shear test of co-cured aluminum/composite double lap joint as well as the curvature experiment of co-cured steel/composite strip were performed to investigate the effect of curing cycle on the thermal residual stress of co-cured hybrid structures. From the experiments, it was found that post curing method after abrupt cooling of co-cured aluminum/composite hybrid structure at certain point of degree of cure during curing process could eliminate fabricating the thermal residual stresses.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.34-37
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• 2000

The effect of novel N-crotyl-N,N-dimethyl-4-methylanilinium hexafluroantimonate (CMH) curing agent on cure behavior and thermal properties of DGEBA epoxy cationic system was investigated. From DSC measurements of DGEBA/CMH system, it was shown that this system exhibits an excellent thermal latent characteristic in a given temperature and reveals complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of DGEBA/CMH system increased with increasing the concentration of initiator due to high activity of CMH. Viscoelastic properties during gel formation of DGEBA with CMH were investigated by rheological techniques under isothermal condition. The gel time obtained from the modulus crossover. point t(G')=G", was affected by high curing temperature and concentration of CMH, resulting in high degree of network formation in cationic polymerization. The thermal stabilities were discussed in terms of the activation energy for decomposition and thermal factors determined from TGA measurements.ents.

• Journal of the Korean Wood Science and Technology
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• 제30권3호
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• pp.34-41
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• 2002

This study investigated the thermogravimetric analysis of two types of cured tannin-based adhesives from wattle and pine, with three hardeners of paraformaldehyde, hexamethylenetetramine and TN (tris(hydroxyl)nitromethan), at a temperature of 170℃ and a heating rate of 5, 10, 20 and 40℃/min for 10 minutes. The 5 minutes cured wattle tannin-based adhesive with each hardener at 170℃ was also tested to compare the degree of curing. It was found that thermogravimetric analysis could be used to measure the degree of curing of a thermosetting adhesive. The TG-DTG curves of all the adhesive systems were similar and showed three steps in a similar way to a phenolic resin. This means that each adhesive system is well cross-linked. However, a high thermal decomposition rate was shown at 150 to 400℃ in the case of the pine tannin sample with TN (tris(hydroxyl)nitromethan). The Flynn & Wall expression was used to evaluate the activation energy for thermal decomposition. As the level of conversion (𝛼) increased, the activation energy of each system increased. The activation energy of the wattle tannin-based adhesive with paraformaldehyde was higher than the others.

• Bulletin of the Korean Chemical Society
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• 제21권6호
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• pp.628-634
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• 2000

Crosslink is the most important chemistry in a rubber vulcanizate. Degree and type of crosslinks of the vulcanizate determine its physical properties. Change of crosslink density and deformation of a rubber vulcanizate by thermal aging were studied using natural rubber (NR) vulcanizates with various cure systems (conventional, semi-EV, and EV) and different cure times (under-, optimum-, and overture). All the NR vulcanizates were deformed by the thermal aging at 60-100 $^{\circ}C.$ The higher the aging temperature is, the more degree of the deformation is. The undercured NR vulcanizates after the thermal aging were deformed more than the optimumand overcured ones. The NR vulcanizates with the EV cure system were less deformed than those with the conventional and semi-EV cure systems. The deformation of the NR vulcanizates was found to be due to change of the crosslink density of the vulcanizates. The crosslink densities of all the vulcanizates after the extraction of organic materials were also changed by the thermal ging. The sources to change the crosslink densities of the vulcanizates by the thermal aging were found to be dissociation of the existing sulfur crosslink and the formation of new crosslinks by free sulfur, reaction products of curing agents, and pendent sulfide groups.

• Korean Chemical Engineering Research
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• 제46권1호
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• pp.200-204
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• 2008

비대칭성 고리형 지방족 아민 경화제를 이용한 diglycidyl ether of bisphenol F(DGEBF) 계열의 에폭시의 경화 반응을 등온 및 동적 경화 실험을 통하여 분석하였다. 등온 부분경화 실험 및 동적 경화반응을 통하여 아민 경화제의 비대칭성으로 인해 경화 반응이 저온부 및 고온부분의 두 가지 반응으로 구성되어 있다는 것을 확인하였고, 따라서 경화도가 0.6 이상인 영역에서는 등온경화반응 모델식을 이용하여 실험값을 예측하기는 어렵다는 것을 확인하였다. 승온 속도를 여러 가지로 변화시키며 동적 경화반응을 분석하여 저온부 및 고온부 각각의 반응에 대한 활성화에너지 및 속도상수를 알아보았고, 경화 초기에는 저온부의 반응이 주가 되는 것을 확인하였다.