• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.51-56
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• 2014

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.333-340
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• 2010

The Korean Dendropanax lacquer, made from a natural resinous sap from Dendropanax orbifera Lev., was used as a golden and transparent varnish for the traditional artifacts (armor uits, helmets, arrowheads, etc.) to make them be brilliant golden color. The cured film of the acquer has excellent protective properties such as weatherability, water resistance, and nticorrosive. But, one of disadvantages is that takes a long time and much energy to fulfill curing the lacquer. The chemical constituents of the lacquer contained conjugated diene compounds s the photopolymerizable monomers. These monomers easily polymerized in sunlight to form olden-colored, hard-coating films in a short time. Photooxidation may be one of the most mportant reactions in the chemistry of the lacquer. Although the Korean Dendropanax Lacquer hould be dried to a thoroughly dry stage to achieve optimal film properties, curing with elevated emperatures may be required for the protracted curing time at atmospheric temperature. So we ntended to accelerate the curing rate of the lacquer by dual curing of thermal and radiation uring. The effect of thermal initiator on the thermal curing reaction was evaluated by monitoring he changes in double bond peak with FT-IR. Then the curing rate of the lacquer blended with hermal initiator and photoinitiator together was measured during dual curing using a RPT with V spot curing machine. Thermal initiator not only accelerated the curing rate but also improved he physical property. And the curing rate of the Korean Dendropanax lacquer was improved by ual curing method of thermal and UV curing. According to these results, the application area of he Korean Dendropanax lacquer could be expanded to surface coatings for electronic devices uch as mobile phones or electronics.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.6
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• pp.916-921
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• 2012

Sealant paste with silica immersed in cross-linked epoxy-acrylate polymer resin was prepared by thermal and UV curing process. The curing mechanism of polymer resin resulted from 2 functional groups of epoxy and acrylic structure. The properties of microstructure, thermal conductivity and mechanical strength were investigated for its various applications. The adhesion strength is increased by increasing the thermal curing time until 15 minutes, and curing efficiency is saturated over 20 minutes. The increase rate per day of pot life and viscosity is 4.8%, indicating it has excellent storage stability. It is found that the formulation of silica pastes can be applied to heavy industries, building materials, display and various industries.

• Polymer(Korea)
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• v.26 no.1
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• pp.80-87
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• 2002

A comparative study using electron-beam(EB) and thermal curing techniques was carried out to determine the effect of cure behavior and thermal stability of epoxy resins. In this work, benzylquinoxalinium hexafluoroantimonate(BQH) was used as a latent cationic catalyst for an epoxy resin. According to the thermogravimetric analysis(TGA), the decomposed activation energy based on Coats-Redfern method was higher in the case of thermal curing technique. This could be interpreted in terms of slow thermal diffusion rate resulted from high crosslink density of the thermally cured epoxy resin. However, the increase of hydroxyl group in the epoxy resin cured by EB technique was observed in near-infrared spectroscopy(NIRS) measurements, resulting in improving the stable short aromatic chain structure, integral procedural decomposition temperature, and finally ductile properties for high impact strengths.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.45-52
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• 2006

Five low molar ratio urea-formaldehyde (LUF) resins were synthesized in this study. The effects of molar ratio, free formaldehyde content, and catalysts on the curing characteristics of LUF resins were studied by measuring its free formaldehyde content, pH value change after catalysts added, curing rate, and pot life, observing its cured appearance, and analyzing its thermal behavior. The results indicate that: 1) The LUF resin with lower molar ratio than 1.0 can still cure; 2) Free formaldehyde content is not the main factor in affecting curing rate of LUF resin; 3) Compared with ammonium chloride as a traditional catalyst, persulfate salts markedly accelerate the curing rate of LUF resin, and result in the different appearance; 4) the addition of sodium chloride to catalysts can accelerate the curing rate of LUF resin, but the effect is moderate.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.63-66
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• 2000

This research addresses study on thermal residual stress of a composite patch repair of the edge cracked aluminium panel of aging aircraft. Composite patch repair is an efficient and economical technique to improve the damage tolerance of cracked metallic structures. These are thermal residual stresses due to the mismatch of coefficient of thermal expansion, and these are affected by the curing cycle of patch specimen. In this study, three curing cycles were selected for F.E. analysis. This study features the effect on composite patch and aluminum by thermal residual stress during crack propagation in aluminum plate.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.369-376
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• 2001

As many studies have performed to reduce thermal cracking in mass concrete, it is already prepared against thermal cracking, we can find many plans against thermal cracking in several reference book. But it needs practical guidelines to be available in construction site. In this study to establish control method of thermal cracking in mass concrete, tests which have factors of placing thickness and curing method of concrete are performed.

• The Journal of Natural Sciences
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• v.8 no.2
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• pp.21-26
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• 1996

Commercially available Chines oriental lacquer was treated to get two fractions, hexane soluble fraction and hexane insoluble fraction. Hexane soluble fraction was subjected to thermal curing process. Films obtained from the lacquer under normal conditions and obtained from thermal curing were compared. The compounds in hexane soluble fraction were copolymerized with 1,6-diisocyanohexane, and toluendiisocyanate(TDI). Films obtained by thermal curing were highly brittle and hydrophobic while the films obtained under normal conditions were hydrophilic. Curing reaction did not occur when oxygen was not available.Some of the major component in the lacquer was isolated by HPLC and UV spectrum of each compound was recorded.

• Journal of Radiation Industry
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• v.4 no.1
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• pp.19-23
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• 2010

Vinyl ester (VE) resins, introduced in the late 1960s, have made large strides in reinforced plastics applications as adhesive and matrix materials on their appropriate mechanical performance characteristics in the glassy state. Generally, VE resins are a group of dimethacrylate resins based on bisphenol A type epoxy resin. They exhibit easy handling properties as well as good resistance to most chemical agents due to their mechanical and thermal properties. In this study, the effects of curing methods of vinyl ester resins on gel contents, flexural strength and dynamic mechanical properties were investigated. Thermal curing (room temperature, $80^{\circ}C$) and electron beam curing were used to crosslink a VE resin/styrene complex (65/35 wt%) with methyl ethyl ketone peroxide (MEKPO) as a catalyst and an 8 wt% cobalt naphthenate in styrene solution as a accelerator. For the samples, gel contents as well as flexural strength and dynamic mechanical properties were characterized and compared by soxhlet apparatus, universal testing machine (UTM) and dynamic mechanical analysis (DMA). As a result, the electron-cured VE resin was confirmed as a better condition than those for gel contents, flexural strength and dynamic mechanical properties, respectively.