• 제목/요약/키워드: Thermal creep

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Integral Abutment Bridge behavior under uncertain thermal and time-dependent load

  • Kim, WooSeok;Laman, Jeffrey A.
    • Structural Engineering and Mechanics
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    • 제46권1호
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    • pp.53-73
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    • 2013
  • Prediction of prestressed concrete girder integral abutment bridge (IAB) load effect requires understanding of the inherent uncertainties as it relates to thermal loading, time-dependent effects, bridge material properties and soil properties. In addition, complex inelastic and hysteretic behavior must be considered over an extended, 75-year bridge life. The present study establishes IAB displacement and internal force statistics based on available material property and soil property statistical models and Monte Carlo simulations. Numerical models within the simulation were developed to evaluate the 75-year bridge displacements and internal forces based on 2D numerical models that were calibrated against four field monitored IABs. The considered input uncertainties include both resistance and load variables. Material variables are: (1) concrete elastic modulus; (2) backfill stiffness; and (3) lateral pile soil stiffness. Thermal, time dependent, and soil loading variables are: (1) superstructure temperature fluctuation; (2) superstructure concrete thermal expansion coefficient; (3) superstructure temperature gradient; (4) concrete creep and shrinkage; (5) bridge construction timeline; and (6) backfill pressure on backwall and abutment. IAB displacement and internal force statistics were established for: (1) bridge axial force; (2) bridge bending moment; (3) pile lateral force; (4) pile moment; (5) pile head/abutment displacement; (6) compressive stress at the top fiber at the mid-span of the exterior span; and (7) tensile stress at the bottom fiber at the mid-span of the exterior span. These established IAB displacement and internal force statistics provide a basis for future reliability-based design criteria development.

플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석 (An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages)

  • 신기훈;김형태;장동영
    • 한국공작기계학회논문집
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    • 제16권5호
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

니켈기 초내열합금의 열간노출에 따른 미세조직 및 기계적 특성 변화 (Evolution of Microstructure and Mechanical Properties of a Ni Base Superalloy during Thermal Exposure)

  • 김인수;최백규;정중은;도정현;정인용;조창용
    • 한국주조공학회지
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    • 제36권5호
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    • pp.159-166
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    • 2016
  • The microstructural evolution of a cast Ni base superalloy, IN738LC, has been investigated after long term exposure at several temperatures. Most of the fine secondary ${\gamma}^{\prime}$ particles resolved after 2000 hour exposure at $816^{\circ}C$. At higher temperatures of $871^{\circ}C$ and $927^{\circ}C$, secondary ${\gamma}^{\prime}$ resolved after 1000 hours of exposure, and cuboidal primary ${\gamma}^{\prime}$ grew with exposure time. During the thermal exposure, ${\sigma}$ phase formed at all tested temperatures, and ${\eta}$ phase was observed around interdendritic regions due to carbide degeneration. The influence of microstructural evolution during thermal exposure on the mechanical properties has been analyzed. The effects of ${\gamma}^{\prime}$ particle growth are more pronounced on the high temperature creep properties than on the room temperature tensile properties.

Three-dimensional FE analysis of headed stud anchors exposed to fire

  • Ozbolt, Josko;Koxar, Ivica;Eligehausen, Rolf;Periskic, Goran
    • Computers and Concrete
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    • 제2권4호
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    • pp.249-266
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    • 2005
  • In the present paper a transient three-dimensional thermo-mechanical model for concrete is presented. For given boundary conditions, temperature distribution is calculated by employing a three-dimensional transient thermal finite element analysis. Thermal properties of concrete are assumed to be constant and independent of the stress-strain distribution. In the thermo-mechanical model for concrete the total strain tensor is decomposed into pure mechanical strain, free thermal strain and load induced thermal strain. The mechanical strain is calculated by using temperature dependent microplane model for concrete (O$\check{z}$bolt, et al. 2001). The dependency of the macroscopic concrete properties (Young's modulus, tensile and compressive strengths and fracture energy) on temperature is based on the available experimental database. The stress independent free thermal strain is calculated according to the proposal of Nielsen, et al. (2001). The load induced thermal strain is obtained by employing the biparabolic model, which was recently proposed by Nielsen, et al. (2004). It is assumed that the total load induced thermal strain is irrecoverable, i.e., creep component is neglected. The model is implemented into a three-dimensional FE code. The performance of headed stud anchors exposed to fire was studied. Three-dimensional transient thermal FE analysis was carried out for three embedment depths and for four thermal loading histories. The results of the analysis show that the resistance of anchors can be significantly reduced if they are exposed to fire. The largest reduction of the load capacity was obtained for anchors with relatively small embedment depths. The numerical results agree well with the available experimental evidence.

Reliability-based design of prestressed concrete girders in integral Abutment Bridges for thermal effects

  • Kim, WooSeok;Laman, Jeffrey A.;Park, Jong Yil
    • Structural Engineering and Mechanics
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    • 제50권3호
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    • pp.305-322
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    • 2014
  • Reliability-based design limit states and associated partial load factors provide a consistent level of design safety across bridge types and members. However, limit states in the current AASHTO LRFD have not been developed explicitly for the situation encountered by integral abutment bridges (IABs) that have unique boundary conditions and loads with inherent uncertainties. Therefore, new reliability-based limit states for IABs considering the variability of the abutment support conditions and thermal loading must be developed to achieve IAB designs that achieve the same safety level as other bridge designs. Prestressed concrete girder bridges are considered in this study and are subjected to concrete time-dependent effects (creep and shrinkage), backfill pressure, temperature fluctuation and temperature gradient. Based on the previously established database for bridge loads and resistances, reliability analyses are performed. The IAB limit states proposed herein are intended to supplement current AASHTO LRFD limit states as specified in AASHTO LRFD Table 3.4.1-1.

용융탄산염형 연료전지의 anode 전극 제작 (Electrode Fabrication of Molten Carbonate Fuel Cell Anode)

  • 김귀열;문성인;윤문수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1991년도 하계학술대회 논문집
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    • pp.255-258
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    • 1991
  • MCFC are expected as an electric and thermal power source of the urban cogenerating system because MCFC have higher electric power efficiency and better thermal power quality. However, the MCFC which use strorgly corrosive molten Carbonate at $650^{\circ}C$ have many problems. Material issues with the molten carbonate fuel cell in clude anode creep, conthode dissolution and bipolar plate corrosion. The objectives of this study are to examied fabrication process and characteristics of anode electrode.

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산화물 및 비산화물 Microfiller의 첨가가 저시멘트 알루미나 캐스타블의 특성에 미치는 영향 (Influence of Various Oxide and Nonoxide Microfillers on the Thermomechanical Properties of Alumina Based Low-Cement-Castables)

  • 이승재;이상원
    • 한국세라믹학회지
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    • 제32권9호
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    • pp.977-988
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    • 1995
  • Several oxide (ZrO2, Al2TiO5, reactive Al2O3) and nonoxide (SiC, Si3N4, "ALON" (5AlN.9Al2O3)) additives were used as a microfiller for alumina based LCC (Low-Cement-Castable). High temperature prooperties (HMOR, softening under load) and the phase changes of developed LCC on various sintering temperatures were examined. In addition, thermal shock test and corrosion test were accomplished. Based on these data the effects of each microfiller on the properties of LCC were established comparing to those of the commercial LCC with amorphous silica as a microfiller. The castables, containing reactive alumina, ZrO2 and "ALON" (5AlN.9Al2O3) as a first portion, exhibited considerably higher HMOR-values over 100$0^{\circ}C$, better creep behavior, and thermal shock resistance than those of castables with amorphous silica. The LCC with 5% Al2TiO5 showed no corrosion against molten aluminum.nst molten aluminum.

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BLP 패키지의 솔더 조인트의 신뢰성 연구 (Solder Joint Reliability of Bottom-leaded Plastic Package)

  • 박주혁
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.79-84
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    • 2002
  • The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

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세도우 마스크 장력에 열공정이 미치는 영향 (Effect of Heat Treatment Process on the Shadow Mask Tension)

  • 현도익;문영훈;조종래
    • 소성∙가공
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    • 제12권5호
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    • pp.487-492
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    • 2003
  • Tension variations with heat treatment in shadow mask for flat braun tubes are investigated in this study. In CRT, landing shift of the electron beam due to thermal deformation of the tension mask made the color purity of screen worse. In order to get the final results of thermal deformation, the tensile force within the mask and the welding processes between the rail and the extended mask have to be analysed sequentially. In this study, the effect of heat treatment is studied in terms of tension variations of shadow mask during its manufacturing process.

Multi-dimensional finite element analyses of OECD lower head failure tests

  • Jang Min Park ;Kukhee Lim
    • Nuclear Engineering and Technology
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    • 제54권12호
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    • pp.4522-4533
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    • 2022
  • For severe accident assessment of reactor pressure vessel (RPV), it is important to develop an accurate model that can predict transient thermo-mechanical behavior of the RPV lower head under the given condition. The present study revisits the lower head failure with two- and three-dimensional finite element models. In particular, we aim to give clear insight regarding the effect of the three-dimensionality present in the distribution of the thickness and thermal load of the lower head. For a rigorous validation of the result, both the OLHF-1 and the OLHF-2 tests are considered in this study. The result suggests that the three-dimensional effect is not negligible as far as the failure location is concerned. The non-uniformity of the thickness distribution is found to affect the failure location and time. The thermal load, which may not be axisymmetric in general, has the most significant effect on the failure assessment. We also observe that the creep property can affect the global deformation of the lower head, depending on the applied mechanical load.