• Journal of Welding and Joining
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• v.17 no.3
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• Nuclear Engineering and Technology
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• v.55 no.7
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• pp.2454-2465
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• 2023

Film boiling may lead to burnout of the heating element. Even though burnout does not occur, the heating element is subject to deformation because it is not sufficiently strong to withstand external loads. In particular, the ballooning and rupture of a tube under film boiling are important phenomena in the field of nuclear reactor safety. If the tube-type cladding of nuclear fuel ruptures owing to high internal pressure and thermal load, radioactive materials inside the cladding are released to the coolant. Therefore, predicting the ballooning and rupture is important. This study presents numerical simulations to predict the ballooning behavior and rupture time of a horizontal tube at high internal pressure under saturated film boiling. To do so, a multi-step coupled simulation of conjugated film boiling heat transfer and ballooning using creep model is adopted. The numerical methods and models are validated against experimental values. Two different nonuniform heat flux distributions and four different internal pressures are considered. The three-step simulation is enough to obtain a convergent result. However, the single-step simulation also successfully predicts the rupture time. This is because the film boiling heat transfer characteristics are slightly affected by the tube geometry related to creep ballooning.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2015.11a
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• pp.162-163
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• 2015

Thermal deformation behavior of high-strength concrete (HSC) exposed to fire is different from that of normal strength concrete (NSC). In case of ultra-high-strength concrete (UHSC), it is well known that thermal deformation behavior is greater than HSC. With increasing research of UHSC in buildings, it is necessary to understand the performance of UHSC at elevated temperatures considering loading condition. Therefore, evaluation on properties of thermal strain behavior properties of ultra high strength concrete by loading and high temperature was conducted.

• KEPCO Journal on Electric Power and Energy
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• v.2 no.4
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• pp.583-588
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• 2016

The high-temperature steam pipes of thermal power plants are subjected to severe conditions such as creep and fatigue due to the power plant frequently being started up and shut down. To prevent critical pipes from serious damage and possible failure, inspection methods such as computational analysis and online piping displacement monitoring have been developed. However, these methods are limited in that they cannot determine the life consumption rate of a critical pipe precisely. Therefore, we set out to develop a life assessment system, based on a three-dimensional piping displacement monitoring system, which is capable of evaluating the life consumption rate of a critical pipe. This system was installed at the "M" thermal power plant in Malaysia, and was shown to operate well in practice. The results of this study are expected to contribute to the increase safety of piping systems by minimizing stress and extending the actual life of critical piping.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2002.04a
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• pp.8-9
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• 2002

액체로켓엔진의 연소기는 고온고압의 연소가스에 의해 벽면온도가 매우 높은 수준에 도달하기 때문에, 연소기가 열적으로 안정적으로 작동할 수 있는 메카니즘이 필요하게 되며, 따라서 이러한 방식의 하나로서 추진제를 이용한 재생냉각방식이 널리 사용되고 있다. 일반적으로 재생냉각형 연소기의 내벽은 열전도도가 우수한 구리 또는 구리합금 계열이 많이 사용되고 있다. 이러한 내벽 재질의 내구성은 주로 creep rupture, low cycle thermal fatigue, thermal-mechanical ratcheting에 의해 결정되는데, 사각형태의 냉각채널의 연소기에서는 thermal-mechanical ratcheting 특성이 수명 결정 주요 인자이다. Thermal-mechanical ratcheting은 그림 1과 같이 연소가스 영역과 냉각제 영역을 분리하는 벽면에서 국부적인 부풀음이 일어나면서 벽면두께가 감소하는 소성변형 형태로 나타나는데, 이러한 것을 Dog- house 형상이라 한다.

• Journal of Applied Reliability
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• v.7 no.2
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• pp.45-55
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• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.05a
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• pp.255-256
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• 2012

In this study, strain properties of high strength concrete using light weight aggregate which is widely used in recent years are evaluated. For these purpose, thermal strain, transient creep were measured in prestressed condition as 0, 20, 40% of specimen strength at target temperature with 60MPa specimens which was using normal and light weight aggregate. As a result, light weight aggregate is more advantageous for the control of strain than normal aggregate because of its low thermal expansion.