• Transactions of Materials Processing
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• v.29 no.1
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• pp.44-48
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• 2020

Aluminum nitride (AlN), as a substrate material in electronic packaging, has attracted considerable attention over the last few decades because of its excellent properties, which include high thermal conductivity, a coefficient of thermal expansion that matches well with that of silicon, and a moderately low dielectric constant. AlN films with c-axis orientation and thermal conductivity characteristics were deposited by using Pulsed Laser Deposition (PLD). The epitaxial AlN films were grown on sapphire (c-Al₂O₃) single crystals by PLD with AlN target and Y₂O₃ doped AlN target. A comparison of different targets associated with AlN films deposited by PLD was presented with particular emphasis on thermal conductivity properties. The quality of AlN films was found to strongly depend on the growth temperature that was exerted during deposition. AlN thin films deposited using Y₂O₃-AlN targets doped with sintering additives showed relatively higher thermal conductivity than while using pure AlN targets. AlN thin films deposited at 600℃ were confirmed to have highly c-axis orientation and thermal conductivity of 39.413 W/mK.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.370-371
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• 2006

The particulate strengthened $Cu-MoSi_2$ composites were prepared by a PM process to develop novel copper based composites with reasonable strength, high thermal conductivity and low thermal expansion coefficient. Microstructure of the composites was investigated by SEM; the tensile strength, elongation, thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined. A comparative analysis of mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the $Cu-MoSi_2$ composites were discussed.

• Carbon letters
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• v.4 no.3
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• pp.117-120
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• 2003

Asbestos is being replaced throughout the world among friction materials because of its carcinogenic nature. This has raised an important issue of heat dissipation in the non-asbestos brake pad materials being developed for automobiles etc. It has been found that two of the components i.e. carbon fibres as reinforcement and graphite powder as friction modifier, in the brake pad material, can playa vital role in this direction. The study reports the influence of these modifications on the thermal properties like coefficient of thermal expansion (CTE) and thermal conductivity along with the mechanical properties of nonasbestos brake pad composite samples developed in the laboratory.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• Korean Journal of Materials Research
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• v.33 no.10
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• pp.422-429
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• 2023

High-strength low-alloy steel is one of the widely used materials in onshore and offshore plant engineering. We investigated the alloying effect of solute atoms in α-Fe based alloy using ab initio calculations. Empirical equations were used to establish the effect of alloying on the Vicker's hardness, screw energy coefficient, and edge dislocation energy coefficient of the steel. Screw and edge energy coefficients were improved by the addition of V and Cr solute atoms. In addition, the addition of trace quantities of V, Cr, and Mn enhanced abrasion resistance. Solute atoms and contents with excellent mechanical properties were selected and their thermal conductivity and thermal expansion behavior were investigated. The addition of Cr atom is expected to form alloys with low thermal conductivity and thermal expansion coefficient. This study provides a better understanding of the state-of-the-art research in low-alloy steel and can be used to guide researchers to explore and develop α-Fe based alloys with improved properties, that can be fabricated in smart and cost-effective manners.

• Bulletin of the Korean Chemical Society
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• v.28 no.10
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• pp.1697-1704
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• 2007

We present results for transport properties of diatomic fluids by isothermal-isobaric (NpT) equilibrium molecular dynamics (EMD) simulations using Green-Kubo and Einstein formulas. As the molecular elongation of diatomic molecules increases from the spherical monatomic molecule, the diffusion coefficient increases, indicating that longish shape molecules diffuse more than spherical molecules, and the rotational diffusion coefficients are almost the same in the statistical error since random rotation decreases. The calculated translational viscosity decreases with the molecular elongation of diatomic molecule within statistical error bar, while the rotational viscosity increases. The total thermal conductivity decreases as the molecular elongation increases. This result of thermal conductivity for diatomic molecules by EMD simulations is again inconsistent with the earlier results of those by non-equilibrium molecular dynamics (NEMD) simulations even though the missing terms related to rotational degree of freedom into the Green-Kubo and Einstein formulas with regard to the calculation of thermal conductivity for molecular fluids are included.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.5
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• pp.241-246
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• 2015

Cellular foamed insulation such as polyurethane foam ages and degrades the thermal conductivity. Aging of foam is a result from the diffusion of gases, initially consisting of $CO_2$ but eventually replaced by air from the environment. The variation of the cell gas content with time is primarily influenced by the increase of thermal conductivity of the cellular foam. The weight of foam also changes as the gas diffuses and exchanges. In this study, a weight measurement method has been proposed to evaluate the effective diffusion coefficients of $CO_2$ and Air, $D_{CO2}=7.08504E-11$ and $D_{air}=4.86086E-12$, respectively and are compared with the gas analysis method.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.8
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• pp.725-732
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• 2013

This study examined the convective heat transfer characteristics of nanofluids flowing over a heated fine wire. Convective heat transfer coefficients were measured for four different nano-engine-oil samples under three different temperature boundary conditions, i.e., both or either variation of wire and fluid temperature and constant film temperature. Experimental investigations that the increase in the convective heat transfer coefficients of nanofluids in the internal pipe flow often exceeded the increase in thermal conductivity were recently published; however, the current study did not confirm these results. Analyzing the behavior of the convective heat transfer coefficient under various temperature conditions was a useful tool to explain the relation between the thermal conductivity and the boundary layer thickness of nanofluids.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.83-87
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• 1999

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.