• Title/Summary/Keyword: Thermal conditions

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Numerical Analysis for Unsteady Thermal Stratified Turbulent Flow in a Horizontal Circular Cylinder

  • Ahn, Jang-Sun;Ko, Yong-Sang;Park, Byeong-Ho;Youm, Hag-Ki;Park, Man-Heung
    • Nuclear Engineering and Technology
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    • v.28 no.4
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    • pp.405-414
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    • 1996
  • In this paper, the unsteady 2-dimensional turbulent flow model for thermal stratification in a pressurizer surge line of PWR plant is proposed to numerically investigate the heat transfer and flow characteristics. The turbulence model is adapted to the low Reynolds number K-$\varepsilon$ model (Davidson model). The dimensionless governing equations are solved by using the SIMPLE (Semi-Implicit Method for Pressure Linked Equations) algorithm. The results are compared with simulated experimental results of TEMR Test. The time-dependent temperature profiles in the fluid and pipe nil are shown with the thermal stratification occurring in the horizontal section of the pipe. The corresponding thermal stresses are also presented. The numerical result for thermal stratification by the outsurge during heatup operation of PWR shows that the maximum dimensionless temperature difference is about 0.83 between hot and cold sections of pipe well and the maximum thermal stress is calculated about 322MPa at the dimensionless time 28.5 under given conditions.

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Thermal Stresses Near the Crystal-Melt Interface During the Floating-Zone Growth of CdTe Under Microgravity Environment (미세중력장 CdTe 흘로우팅존 생성에서 결정체-용융액 계면주위의 열응력)

  • Lee Kyu-Jung
    • Journal of computational fluids engineering
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    • v.3 no.1
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    • pp.100-107
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    • 1998
  • A numerical analysis of thermal stress over temperature variations near the crystal-melt interface is carried out for a floating-zone growth of Cadmium Telluride (CdTe). Thermocapillary convection determines crystal-melt interfacial shape and signature of temperature in the crystal. Large temperature gradients near the crystal-melt interface yield excessive thermal stresses in a crystal, which affect the dislocations of the crystal. Based on the assumption that the crystal is elastic and isotropic, thermal stresses in a crystal are computed and the effects of operating conditions are investigated. The results show that the extreme thermal stresses are concentrated near the interface of a crystal and the radial and the tangential stresses are the dominant ones. Concentrated heating profile increases the stresses within the crystal, otherwise, the pulling rate decreases the stresses.

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Determination of thermal Stress Intensity Factors for General Cusp-Crack Shaped Rigid Inclusion (일반 형상의 커프스형 강체균열에 대한 열응력세기계수 결정)

  • 이강용;장용훈
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.6
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    • pp.1216-1220
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    • 1992
  • In case that a general cusp-crack shaped inclusion expressed in a polynominal form of conformal mapping function exists in a two dimensional elastic body under uniform heat flow, the complex potential and thermal stress intensity factors are derived. Two thermal boundary conditions are considered, one an insulated rigid inclusion and the other a rigid inclusion with fixed boundary temperature. The previous solutions of the thermal stress intensity factors for symmetrical airfoil and lip type rigid inclusions are obtained from the general solution of the thermal stress intensity factors.

A Study on Improvement of Accuracy of Positioning Induced Thermal Deformation of the Ball Screw in CNC Lathe (CNC 선반에서 볼 나사 열변형에 따른 위치결정 정도 개선에 관한 연구)

  • 홍성오
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.1
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    • pp.45-51
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    • 1999
  • Thermal expansion of the ball screw can directly affect the accuracy of positioning along the travel axis in the semi-closed loop type CNC Lathe. In this paper, use of MACRO variables can make the thermal displacement of the ball screw estimated. Also, the estimated displacements of the ball screw are controlled by calculating the interval of pitch error rate in the Numerical Control(NC). Under the constant operating conditions, the thermal expansion of the ball screw was measured to confirm the effectiveness of the compensation method in the CNC Lathe. By using this method the results show that the thermal displacement of the ball screw could be reduced to 20% compared with ordinary method.

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Thermal buckling analysis of functionally graded sandwich cylindrical shells

  • Daikh, Ahmed Amine
    • Advances in aircraft and spacecraft science
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    • v.7 no.4
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    • pp.335-351
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    • 2020
  • Thermal buckling of functionally graded sandwich cylindrical shells is presented in this study. Material properties and thermal expansion coefficient of FGM layers are assumed to vary continuously through the thickness according to a sigmoid function and simple power-law distribution in terms of the volume fractions of the constituents. Equilibrium and stability equations of FGM sandwich cylindrical shells with simply supported boundary conditions are derived according to the Donnell theory. The influences of cylindrical shell geometry and the gradient index on the critical buckling temperature of several kinds of FGM sandwich cylindrical shells are investigated. The thermal loads are assumed to be uniform, linear and nonlinear distribution across the thickness direction. An exact simple form of nonlinear temperature rise through its thickness taking into account the thermal conductivity and the inhomogeneity parameter is presented.

A Study on Reliability of Solder Joint in Different Electronic Materials (이종 전자재료 JO1NT 부위의 신뢰성에 관한 연구)

  • 신영의;김경섭;김형호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1993.11a
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    • pp.49-54
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    • 1993
  • This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

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A Experimental Study for Developing of the Dry Double Floors Hydronic Ondol System (건식이중바닥온돌시스템 개발을 위한 실험적 연구)

  • Kim Nan-Haeng;Sohn Jang-Yeul
    • Journal of the Korean housing association
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    • v.17 no.3
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    • pp.1-7
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    • 2006
  • The aim of the research was to evaluate the characteristics of thermal environment and thermal comfort in the Dry Double floors Hydronic Ondol System. Physical indoor thermal environments (the floor surface temperature, the vertical temperature, etc.) and skin temperature have especially been measured. Physical features conditions, sensation, thermal comfort, humidity sensation, comfort of body were investigated for the survey. As a result, (1) During the operation of the boiler (12 hour), the average indoor temperature is appeared to be $21.6^{\circ}C$. The floor surface temperature showed peak value of $31.4{\sim}40.6^{\circ}C$ after 8hours 30minutes after the start-point of the heating. The vertical difference of temperature was turned out to be not uniform. (2) While the skin temperature showed a narrow distribution of temperature in the Dry Double floors Hydronic Ondol system. (3) The response to thermal comfort which people felt was satisfactory, and most of them felt dry during the test.

The Effects of Heat Diffusion Fin on the Thermal Behavior and Performance of Radiant Heatomg Panel (방열핀이 난방용 패널의 열적거동 및 성능에 미치는 영향)

  • 이태원
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.9
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    • pp.2486-2493
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    • 1994
  • Transient heat transfer characteristics in th radiant heating panel with heat diffusion fin were predicted by numerical analysis. Thermal behaviors of panel, such as temperature distributions in panel and convective and radiative heat fluxes in panel surface with advance of time, were obtained for several important parameters. The performance and thermal comfort of heating panel were studied and compared for various design conditions, such as pipe pitch, area ratio and thermal conductivity of optimal design of the new heating panels with heat diffusion fin. It was concluded that the efficient area ratio of heat diffusion fin is about 0.5, and the greater the thermal conductivity of fin is, the better the performance of panel is.

The Thermal Diffusivity of Standard Pieces for Spark Test (불꽃試驗용 標準試片 의 熱擴散 係數)

  • 차경옥;이관수;이흥주
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.7 no.3
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    • pp.319-327
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    • 1983
  • The thermal diffusivity one of the series of standard pieces for spark test are determined by the flash method. The standard pieces are composed with carbon steels, structural carbon steels, alloy steels and high speed tool steels. In order to compute the thermal conductivity of the standard pieces, their specific heats are measured by a differential scanning calorimeter. The thermal conductivities are calculated from the data of specific heat, density and thermal diffusivity. To increase the accuracy of data for the thermal diffusivity by data reduction excursion method in the flash method, the governing heat diffusion equation, which is closely described experimental conditions with the finite pulse and the heat loss from the sample surfaces, is solved. In this analysis an integral transform is used.

Optimal Design of Dual-Structured Disc of a Safety-Valve for the Specialized Pressure Vessel Considering Thermal Expansion (특수 압력요기용 안전밸브의 2중 구조로 디스크의 최적설계)

  • Kim, Chang-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.6 no.4
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    • pp.81-85
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    • 2007
  • A safety valve is used for protecting the pressure vessel and facilities by discharging the operating fluid into the valve from the accident when the pressure is over the designated value. The fluid is sulfurous acid and nitric acid. etc. in the semi-conductor assembly line. Thus the valve elements material must be acid resistance. Teflon, which is used generally as inner parts of a valve, tends to easily sticks to sliding surface by thermal expansion under high temperature. Some studies are performed to change teflon to another material and shape to have a better fluidity under the condition. The analysis of the thermal expansion is conducted by commercial FEM software to improve the problems. Boundary conditions were temperature and load in this study. From the analysis, the thermal expansion of stainless steel is verified to be lower than that of teflon under high temperature. Thus coupled teflon/stainless steel-made valve is applied to assembly line without danger due to thermal expansion.

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