• Title/Summary/Keyword: Thermal condition

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Characteristics of $CH_4$ Decomposition by Plasma (플라즈마 이용 메탄 분해 특성)

  • Kim, Kwan-Tae;Lee, Dae-Hoon;Cha, Min-Suk;Ryu, Jeong-In;Song, Young-Hoon
    • Journal of the Korean Society of Combustion
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    • v.10 no.4
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    • pp.24-32
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    • 2005
  • Various types of plasma source applied in $CH_4$ decomposition process are compared. DBD by pulse and AC power, spark by pulse and AC power, rotating arc and hollow cathode plasma are chosen to be compared. The results show that $CH_4$ conversion per given unit power is relatively high in hollow cathode plasma and rotating arc that induces rather high temperature condition and that is why both thermal dehydration and plasma induced decomposition contribute for the overall process. In case of DBD wherein high temperature electron and low temperature gas molecule coexist, the process shows low conversion rate, for in rather low temperature condition the contribution of thermal dehydration is lowered. Selectivity of $C_2H_6$ and $C_2H_2$ is shown to be a good parameter of the relative contribution of plasma chemistry in the overall process. From the results we concluded that required condition of plasma source for a cost effective and high yield $CH_4$ decomposition is to have characteristics of both thermal plasma and non thermal plasma in which temperature is high above a certain threshold state for thermal dehydration and electron induced collision is maximized in the same breath.

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A Study on the Optimal Clothing Weight in an Air Conditioned Office in Summer (여름철 냉방실내의 적정착의량에 관한 연구)

  • Kim Sun Young;Lee Soon Won
    • Journal of the Korean Society of Clothing and Textiles
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    • v.9 no.3
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    • pp.45-51
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    • 1985
  • The purpose of this study is to research into the thermal condition and the weight of clothes suitable for the officers engagged in light works in an air-conditioned room in summer. The Major findings are as follows: 1. Thermal conditions of the working environment are $24.5^{\circ}C$ (Dry bulb temp.), $68\%$ (Relative humidity) and 2.6m/sec (Air Velocity). 2. Total clothing weights are 416.6 g/$m^2$ (male) and 340.9 g/$m^2$ (female). Underwear weights are 96.8g/$m^2$ (male) and 85.1g/$m^2$ (female). The latter turned out to be statistically significant in Sexual difference. 3. Means of the thermal sensation are 3.0 (comfortable; male) 2.7 ('Slightly cool' -'Comfortable'; female) and the relationship between clothing weights and thermal sensation proves to be significantly correlated in the case of female. 4. $66.7\%$ of the women and $37.1\%$ of the men feel sensation of coldness at the body's specific area and $79.5\%$ of the women and $54.3\%$ of the men reveals air-conditioning disturbance. 5. As the thermal sensation is close to 'cool-cold', sensation of coldness or air conditioning disturbance are showed up more frequently which is reversely related with weight of under-wear. It is also proved that air conditioning disturbances are influenced by sexual difference in addition to sensation of coldness and thermal sensation. 6. According to the result of experiment, we can have the idea that at condition $X_1$, the drop of limbs' skin temp. is remarkable. At condition $X_2$ skin temp. for distal limbs and mean skin temp. are raised and the falling degree is similar. At condition $X_3$, mean skin temp. and distal skin temp. are remarkably raised, and the falling degree decreases and the beats of pulse rate increase and diastoric blood pressure is lowered.

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Estimation of C(t)-Integral in Transient Creep Condition for Pipe with Crack Under Combined Mechanical and Thermal Stress (II) - Elastic-Plastic-Creep - (복합응력이 작용하는 균열 배관에 대한 천이 크리프 조건에서의 C(t)-적분 예측 (II) - 탄-소성-크리프 -)

  • Song, Tae-Kwang;Kim, Yun-Jae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.10
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    • pp.1065-1073
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    • 2009
  • In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

Thermal Analysis of Continuous Casting Welding-Coated Mold (용접코팅된 연속주조 몰드의 열해석)

  • 이종선;김세환
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.2 no.1
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    • pp.7-12
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    • 2001
  • This study is object to thermal analysis of continuous casting welding-coated mold. A two-dimen-sional transient finite element model was developed to compute the temperature distribution for continuous casting welding-coated mold. For thermal analysis using analysis result from FEM code. This thermal analysis results, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

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Sensitive analysis of design factor for the optimum design of PVT system

  • Jeong, Yong-Dae;Nam, Yujin
    • KIEAE Journal
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    • v.15 no.4
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    • pp.5-11
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    • 2015
  • Purpose: Recently, renewable energy system has been widely used to reduce the energy consumption and CO2 emission of building. A photovoltaic/thermal(PVT) system is a kind of efficient energy uses, which is combined with photovoltaic module and solar thermal collector. PVT system removes heat from PV module by through thermal fluid to raise the performance efficiency of the PV system. However, though PVT system has the merit of the improved efficiency in theoretical approach, there have been few performance analysis for PVT system using the dynamic energy simulation. In this study, in order to establish the optimum design method of this system, simulation was conducted by using individual system modules. Method: For the dynamic simulation, TRNSYS17 was used and local weather data was utilized. Furthermore, the system performance in various installation condition was calculated by case studies. Result: As a result, the amount of electric generation and heat production in each case was found by the simulation. The gap of system performance was also evident according to the installation condition.

The Analysis of Temperature Distribution Electric incoming Apparatus Using a Infrared Thermal Imaging System (적외선 열화상 카메라를 이용한 수전설비 온도분포해석)

  • Jeong, Seung-Cheon;Lim, Yeung-Bae;Kim, Jong-Seo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1113-1116
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    • 2004
  • This paper presents the method for analyzing surface temperature of Electric incoming Apparatus. For the experiment, the surface temperature of electric power apparatus was measured and analyzed by using a infrared thermal imaging system. Surface Discharges(SD) have very complex characteristics of discharge patterns, therefore it requires the development of precise analysis methods. recently, studies on infrared thermal imaging system are carried out to analyze temperature distribution of power equipments through condition diagnosis and to diagnose the degradation of power equipments. The changes in suface temperature was measured by using the infrared thermal imaging system under hot line condition. The system was set up based on the diagnostic method of the electric incoming apparatus.

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A Study on the Room Temperature Control Methods Considering Human Thermal Comfort Under Hot and Humid Condition (인체의 온열환경 적응을 고려한 여름철의 실온 쾌적변동 제어에 관한 연구)

  • Lee, Ju-Youn
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.20 no.5
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    • pp.334-341
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    • 2008
  • The purpose of this study is to investigate the effects of changing air temperature and the changing on/off periods of the air-conditioner system. Adding to that, this paper discuss is to consider the effects of air temperature with the air-conditioner system upon the human thermal comfort. The experiment is conducted during the summer. The subjects(6 young females) are exposed to the following conditions: combinations of 2 Swing and 2 Linear air control Conditions. (2 Swing during 40 min, 4 Swing during 40 min, Linear 40 min, Linear 60 min in still air and RH 50%). From the experiment, the following results are obtained; the thermal sensation vote is neutral after 90 minute. The mean skin temperature ranged about $34^{\circ}C$ at all conditions. The skin temperature was greatly affected by 2 Swing big amplitude condition.

Multi-phase Accelerating Test Method of Thermal Aging Considering Heat Generation of Electric Equipment (전기기기의 발열을 고려한 다단계 가속열노화 방법)

  • Lim, Byung-Ju;Park, Chang-Dae;Chung, Kyung-Yul
    • The KSFM Journal of Fluid Machinery
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    • v.16 no.5
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    • pp.18-23
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    • 2013
  • Thermal aging test is performed to qualify the life time of equipment in thermally aged condition. Due to long life time more than 10 years like as in power plant, the equipment is subjected to the accelerated thermal aging condition which is able to shorten the long aging test period by increasing aging temperature. Normally, conservatism of thermal aging test causes to impose unbalanced and excessive thermal load on components of the equipment, and deformation and damage problems of the components. Additionally, temperature rise of each component through heat generation of the electric equipment leads to long-term problem of the test period. Multi-phase accelerating aging test is to perform thermal aging test in multiple aging conditions after dividing into groups with various components of equipment. The groups might be classified considering various factors such as activation energy, temperature rise, glass transition temperature and melting temperature. In this study, we verify that the multi-phase accelerating aging test method can reduce and equalize the thermal over load of the components and shorten aging test time.

Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model (Darveaux 모델에 의한 플립칩 패키지 솔더 접합부의 열피로 해석 및 수명 평가)

  • Shin Young-Eui;Kim Yeon-Sung;Kim Jong-Min;Choi Myun-Gi
    • Journal of Welding and Joining
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    • v.22 no.6
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    • pp.36-42
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    • 2004
  • Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.