The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model |
Shin Young-Eui
(School of Mechanical Engineering, Chung-Ang University)
Kim Yeon-Sung (School of Mechanical Engineering, Chung-Ang University) Kim Jong-Min (School of Mechanical Engineering, Chung-Ang University) Choi Myun-Gi (School of Mechanical Engineering, Chung-Ang University) |
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