• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.69-73
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• 2010

Through-silicon-via (TSV)를 포함하고 있는 3차원 적층 반도체 패키지에서 구조적 변수에 따른 열응력의 변화를 살펴보기 위하여 유한요소해석을 수행하였다. 이를 통하여 TSV를 포함하고 있는 3차원 적층 반도체 패키지에서 웨이퍼 간 접합부의 지름, TSV 지름, TSV 높이, pitch 변화에 따른 열응력의 변화를 예측하였다. 최대 von Mises 응력은 TSV의 가장 위 부분과 Cu 접합부, Si, underfill 계면에서 나타났다. TSV 지름이 증가할 때, TSV의 가장 위 부분에서의 von Mises 응력은 증가하였다. Cu 접합부 지름이 증가할 때, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. Pitch가 증가할 때에도, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. 한편, TSV 높이는 von Mises 응력에 크게 영향을 미치지 못하였다. 따라서 TSV 지름이 작을수록, 그리고 pitch가 작을수록 기계적 신뢰성은 향상되는 것으로 판단된다.

• Journal of Advanced Marine Engineering and Technology
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• 제38권6호
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• pp.688-697
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• 2014

본 연구에서는 최근, 전기자동차 및 소형 레저용 선박을 중심으로 연구가 진행 중인, 대용량 이차전지의 용량 증대를 위하여 필요한 내부 전극 접합 기술에 관하여 연구하였다. 종래의 초음파 용접으로 적층할 수 있는 적층 량의 한계를 극복하기 위한 방안으로 전극 소재에 직접 가열을 통한 용접 방법이 아닌 용가재 금속을 적용하여 전극을 접합시켜, 통전성과 인장강도를 증대시킴과 동시에 열적요인으로 인한 전극표면에 화학적 활성물질의 변성을 최소화 할 수 있는 저온 접합 방법에 대하여 연구하였다. 부연하여 현재 일반적으로 적용되고 있는 초음파 용접 및 저항 용접은 전극을 다량 적층 접합 시켰을 경우 일정한 전기 전도성과 접합 강도를 구현하기 힘들다. 용접을 위하여 무리하게 출력을 상승시킬 경우 용접열의 영향으로 전극의 변형 및 활성물질의 변성을 야기함과 동시에 최종 페키징(packaging) 이후 출력저하, 발열 등, 배터리의 안정성을 저하시키는 요인으로 작용한다. 따라서 본 연구에서는 고주파 유도가열을 통한 유도 가열 방식의 접합 방법과 용융 도금을 통한 용가재 금속의 전처리를 통한 종래와는 차별화된 전극접합 방법을 소개한다.

• Elastomers and Composites
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• 제34권3호
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• pp.247-252
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• 1999

보강 및 차수재인 지반용 고무재료를 열융착법에 의해 제조하였으며 환경공학분야에 적용을 위해 성능을 평가하였다. 이들 재료를 제조하는데 스펀본드 폴리에스테르 부직포, 유리섬유매트, 고강력 폴리에스테르사를 이용한 직포형 지오그리드를 기재로, SBS 함유 탄성 bitumen과 아스팔트를 보강재로 각각 사용하였다. 유리섬유 매트와 지오그리드를 기재로 사용한 지반용 재료의 경우 역학적성질이 우수하였으며, 부직포와 탄성 bitumen을 기재로한 경우에는 투수성이 우수하였다. 고무와 아스팔트를 혼합한 경우 연화점은 거의 변화가 없었으며, 고온에서의 치수안정성은 $120^{\circ}C$의 경우 두드러진 수축이 발생하지 않았다. 지반용 고무재료의 자외선에 대한 저항성은 가시적인 변화가 나타나지 않았다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1988-1990
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• 1996

In this work, we have grown or evaporated thermal oxide and E-beam oxide on the (100) oriented n-type silicon wafers, respectively and they were directly bonded with another silicon wafer after hydrophilization using solutions of three types of $HNO_3$, $H_{2}SO_{4}$ and $NH_{4}OH$. Changes of average surface roughness after hydrophilizations of the single crystalline silicon wafer, thermal oxide and E-beam evaporated silicon oxide were studied using atomic force microscope. Bonding interfaces of the bonded pairs were inspected using scanning electron microscope. Void and non-contact area of the bonded pairs were also inspected using infrared transmission microscope.

• Structural Engineering and Mechanics
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• 제62권5호
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• pp.595-606
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• 2017

During their life span, post-tensioned concrete structures may be exposed to thermal loads. Therefore, there has been a growing interest in research on the advanced analysis and design of post-tensioned concrete slabs subjected to thermal loads. This paper investigates the structural behaviour of post-tensioned one-way spanning concrete slabs. A nonlinear finite element model for the analysis of post- tensioned unbonded and bonded concrete slabs at elevated temperatures was developed. The interface between the tendon and surrounding concrete was also modelled, allowing the tendon to retain its profile shape during the deformation of the slab. The load-deflection behaviour, load-force behaviour in the tendon, and the failure modes are presented. The numerical analysis was conducted by the finite element ANSYS software and was carried out on two different one-way concrete slabs chosen from literature. A parametric study was conducted to investigate the effect of several selected parameters on the overall behavior of post-tensioned one-way concrete slab. These parameters include the effect of tendon bonding, the effect of thermal loading and the effect of tendon profile. Comparison between uniform thermal loading and nonuniform thermal loading showed that restrained post tensioned slab with bottom surface hotter has smaller failure load capacity.

• 한국표면공학회지
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• 제46권4호
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• 한국염색가공학회지
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• 제34권3호
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• pp.173-184
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• 2022

In this study, the TPU film was laminated on an aramid fabric or circular knits in order to implement an air cushion material that can respond to high impact forces in case of a fall and is easy to expand. To increase the bonding strength between the fabric layer and the film layer, a primer layer was formed in two ways: one for thermally bonding and laminating PET film and two for coating and aging hot melt type PUR adhesive. The tensile strength of the aramid air cushion was 2.5 times higher than that of the circular knits, but the tensile elongation of the aramid air cushion was very low compared to that of the circular knits. The tear strength of the aramid air cushion was about twice or more superior to that of the circular knits, the primer treatment method was good at A, and the peel strength was excellent at method A. The aramid air cushion was the lightest in weight. Summarizing the above results, it was best to combine the air cushion material with aramid woven fabric and primer treatment method A to cope with the high impact force applied when falling.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전력기술부문
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• pp.405-407
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• 2006

The power system analysis based on the accurate impedance of the individual underground cable, which is the inter connected to a large power system, is required. A study on calculation method of impedance allowable current for underground cables. furthermore, various methods of bonding and earthing the sheath have been used for the purpose of eliminating or reducing the sheath losses. the effectes of bonding and earthing must be includied in impedances. therefore, the subject of predicting thermal performance of soil and cable systems has been received increasing attension. for these problems, this paper describes a general formulation of impedance that is based on the effect of crossbonding and earthing of the sheath on the 66kV, 132kV and 220kV underground cable systems. also the work is presented, for calculating the temperature rise of power cable and soil.

• Journal of Industrial and Engineering Chemistry
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• 제67권
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• pp.312-315
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• 2018

Although the reversibility of 10,12-pentacosadiynoic amino meta-acid(PCDA-mBzA) against temperature and pH was reported, the modulation of reversibility by ion adsorption at terminal functional group has not been investigated. In this work, we developed a simple method for modulating the reversibility of PCDA-mBzA films upon a thermal stimulus by cadmium ion adsorption inducing the breakage of the outer hydrogen bonding of two hydrogen bonds, which are responsible for the reversible properties of PCDA-mBzA. External reflection-Fourier transform infrared (ER-FTIR) analyses revealed that the hydrogen bonding between the carboxylic acid groups was broken through ion adsorption and only a single hydrogen bond between the amide groups remained in the PCDA-mBzA polymer. In addition, PCDA-mBzA films could recover their original property through cadmium ion desorption. These results present that the transition between reversibility and irreversibility can be modulated artificially simply through the adsorption and desorption of metal ions.

• International Journal of Advanced Culture Technology
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• 제3권2호
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• pp.34-41
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• 2015

Bonding strength of a thermal sprayed coating is difficult to measure using a conventional pull-off test method. Scratch test is a potential alternative testing method. An adhesive and a cohesive bond strength of the coating can be measured by the pull-off test while the scratch test performed on the cross-section of the thermal sprayed coating can only demonstrate the cohesive bond strength of the coating. Nevertheless, it is still beneficial to perform the scratch testing on the cross-section of the coating for the sake of comparison thus providing an alternative to the pull-off test. The scratch test method can reduce testing time and cost in the long run due to a significant cost reduction in consumables and energy and time saving from the curing step of the glue used in the pull-off test. This research investigates the possibility of using the scratch test to measure the cohesive bond strength of Mo/NiCrBSi composite coating. The results from the pull-off test and the scratch test indicate that the cohesive bond strengths of the Mo composite coating show similar trend and that the cohesive bond strength are increased when increasing NiCrBSi content.