• 한국세라믹학회지
• /
• 제26권5호
• /
• pp.631-636
• /
• 1989

Submicron high-purity mullite powder was prepared by a colloidal sol-gel route. Boehmite and silica were the starting materials. 2wt% $\alpha$-Al2O3 or ZrO2 was used as a seeding material. The gelled powder was calcined at 130$0^{\circ}C$ for 100min and attrition milled for 3hrs. The mullite powder obtained was composed of submicrometer and uniform particles with a narrow size distribution. It was hot-pressed at 1$600^{\circ}C$ for 1hr under 10MPa or was sintered at 1$650^{\circ}C$ for 4hrs. The bulk densities of the products made by both processes were 3.14 and 3.12g/㎤. the mechanical, thermal and electrical properties of the sintered mullite were characterized by bending strength, thermal expansion coefficient, thermal conductivity, dielectric constant and dielectric loss, etc.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 1998년도 하계종합학술대회논문집
• /
• pp.343-346
• /
• 1998

Ultra-thin gate oxide in MOS devices are subjected to high-field stress during device operation, which degrades the oxide and exentually causes dielectric breakdown. In this paper, we investigate the electrical properties of ultra-thin nitrided oxide (NO) and reoxidized nitrided oxide(ONO) films that are considered to be promising candidates for replacing conventional silicon dioxide film in ULSI level integration. We study vriations of I-V characteristics due to F-N tunneling, and time-dependent dielectric breakdown (TDDB) of thin layer NO and ONO depending on nitridation and reoxidation condition, and compare with thermal $SiO_{2}$. From the measurement results, we find that these NO and ONO thin films are strongly depending on its condition and that optimized reoxided nitrided oxides (ONO) films show superior dielectric characteristics, and breakdown-to-change ( $Q_{bd}$ ) performance over the NO films, while maintaining a similar electric field dependence compared to NO layer.

• The Korean Journal of Ceramics
• /
• 제1권2호
• /
• pp.96-100
• /
• 1995

Recently, alumina/glass composites have been applied as a substrate material for hybrid IC and LSI multi-chip packaging. In this study, the characterization of sodium borosilicate glasses containing NaF and $AlF_3$ and the preparation of the resulted glass/alumina composites have been examined and the effect of the addition of fluorides on the thermal. and dielectric properties of the sintered composites have been studied. The sintering temperature of specimens was lowered by about 100-$150^{\circ}C$ by the addition of fluorine compared with the specimens without fluorine. The specimens containing fluorine showed slightly lower dielectric constants than those of the specimens without fluorine.

• Journal of Ceramic Processing Research
• /
• 제13권spc2호
• /
• pp.428-432
• /
• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.58-61
• /
• 2001

Metal-insulator-semiconductor (MIS) C-V properties with high dielectric AIN thin films showed no hysteresis and good interface properties. The dielectric constant of the AIN film calculated from the capacitance at the accumulation region in the capacitance-voltage(C-V) characteristics was about 8. The C-V characteristics of MFIS capacitor showed a hysteresis loop due to the ferroelectric nature of the LiNbO$_3$ thin films. Typical dielectric constant value of LiNbO$_3$ film of MFIS device was about 23. The memory window width was about 1.2V at the gate voltage of $\pm$5 V ranges. Typical gate leakage current density of the MFIS structure was the order of 10$^{-9}$ A/cm$^2$ at the range of within $\pm$500 kV/cm. The ferroelectric capacitors showed no polarization degradation up to about 10$^{11}$ switching cycles when subjected to symmetric bipolar voltage pulse(peak-to-peak 8V, 50% duty cycle) in the 500kHz.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.470-473
• /
• 2001

In this study, 70/30 mol% P(VDF-TrFE) copolymer thin films were prepared by physical vapor deposition, and dielectric properties with frequency were investigated. From results of TA(Thermal Analysis), the Curie transition temperature and melting temperature were observed at 118.8$^{\circ}C$ and 146$^{\circ}C$, respectively. Therefore, while thin films were prepared, the substrate temperature was varied from 30$^{\circ}C$ to 90$^{\circ}C$. The dielectric constant decreased with increasing frequency. At measuring frequency of 1kHz, the relative dielectric constant increased from 3.643 to 23.998 with increasing substrate temperature from 30$^{\circ}C$ to 90$^{\circ}C$. As a result of dielectric loss factor, ${\alpha}$-relaxation and ${\beta}$-relaxation were observed near at 100Hz and 1MHz, respectively. And the magnitude of ${\alpha}$-relaxation decreased and that of ${\beta}$-relaxation increased with increasing substrate temperature.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.167-167
• /
• 2008

The barium strontium calcium titanate powders were prepared by sol-gel method. Ferroelectric $(Ba_{0.54}Sr_{0.36}Ca_{0.1})TiO_3$(BSCT) thick films were fabricated by the screen-printing method on alumina substrate. And we investigated the structural and dielectric properties of BSCT thick films with the variation of sintering temperature. As a result of thermal analysis, BSCT polycrystalline perovskite phase was formed at around $660^{\circ}C$. The results of X-ray diffraction analysis were showed a cubic perovskite structure without presence of the second phase in all BSCT thick films. The average grain size and the thickness of the specimen sintered at $1450^{\circ}C$ were about 1.6 mm and 45 mm, respectively. The relative dielectric constant increased and the dielectric loss decreased with increasing the sintering temperature, the values of the BSCT thick films sintered at $1450^{\circ}C$ were 5641 and 0.4% at 1kHz, respectively.

• 한국전기전자재료학회논문지
• /
• 제28권7호
• /
• pp.456-461
• /
• 2015

In this study, the frequency properties of electrostatic capacity and dielectric loss for the samples with different types of filler has been measured in through the applied frequency range of 7 kHz ~3,000 kHz at temperature of $80^{\circ}C$, $110^{\circ}C$, $140^{\circ}C$, $170^{\circ}C$. The results of this study are as follows. When the sample is degradated at the temperature of $80^{\circ}C$, $110^{\circ}C$, $140^{\circ}C$, $170^{\circ}C$ and the frequency range of 7 kHz ~3,000 kHz is applied, It found that the electrostatic capacity of the sample with Polyimide film is larger than the sample with Grass fiber. It found that the dielectric loss for the sample with Polyimide film is larger than the sample with Grass fiber with increasing frequency and temperature in the $80^{\circ}C$, $110^{\circ}C$, $140^{\circ}C$, $170^{\circ}C$ range. Also, the dielectric loss decreased with increasing frequency. In case of the sample with Polyimide film, It found that the electrostatic capacity decreased with increasing temperature, and the dielectric loss gradually decreased with increasing frequency.

• 마이크로전자및패키징학회지
• /
• 제23권4호
• /
• pp.87-92
• /
• 2016

전자소자의 방열모듈에서 두께 방향의 열방출 특성에 대한 중요성이 증가하고 있다. 금속과 금속의 본딩 및 유전체와 금속의 본딩 구조를 갖는 2가지 종류의 2층 층상재료를 제조한 후 두께 방향으로 열확산계수를 측정하였다. 금속(STS439)과 금속(Al6061)으로 이루어진 2층 층상재료에서는 섬광법(LFA)으로 열확산계수를 측정했을 때, 열흐름의 방향을 반대로 변화시켜도 열확산계수의 변화가 없었다. 그런데, 유전체(AlN-Polymer)와 금속(Al6061)의 2층 층상재료에서는 열흐름의 방향을 반대로 인가하였을 때 열확산계수는 17.5% 정도 다르게 나타났다. 유전체와 금속의 단면구조를 갖는 2층 층상재료에서, 금속에서 유전체 방향으로 측정한 열확산계수가 유전체에서 금속 방향으로 측정한 열확산계수에 비해 17.5% 작게 나타난 이유는, 금속내의 전자가 갖고 있던 에너지가 유전체 쪽으로 전달되기 위해서는 계면 주변에서 포논의 에너지 형태로 변환될 때 저항이 생기기 때문이다.

• Journal of Electrical Engineering and Technology
• /
• 제4권4호
• /
• pp.527-530
• /
• 2009

$(Ba_{0.57}Sr_{0.33}Ca_{0.10})TiO_3$(=BSCT) powders, prepared by the sol-gel method, were doped using $MnCO_3$ as the acceptor and $Dy_2O_3$ as the donor. This powder was mixed with an organic vehicle. BSCT thick films were fabricated by the screen-printing techniques on the alumina substrate. The structural and dielectric properties of BSCT thick films were investigated with variation of the $Dy_2O_3$ amount. As a result of the differential thermal analysis (DTA), the exothermic peak was observed at around $670^{\circ}C$ due to the formation of the polycrystalline perovskite phase. All the BSCT thick films showed the XRD patterns of a typical polycrystalline perovskite structure. The average grain size of BSCT thick films decreased with an increasing amount of $Dy_2O_3$. The relative dielectric constant and dielectric loss of the BSCT thick film doped $Dy_2O_3$ 0.1mol% were 4637.4 and 1.6% at 1kHz, respectively.