1 |
H. G. Cho and Y. K. Park, J. Korean Inst. Electr. Electron. Mater. Eng., 10, 770 (1997).
|
2 |
Y. Toureille and J. P. Reboul, Ann. Soc. Sci., 89, 190 (1978).
|
3 |
Annual Book of ASTM Standards, Electrical Insulation, 10.01, 19 (1993).
|
4 |
C. S. Huh, K. S. Jang, and H. G. Cho, J. Korean Inst. Electr. Electron. Mater. Eng., 9, 344 (1996).
|
5 |
R. J. Morgan, L. T. Mones, and W. J. Steele, Polymer, 23, 295 (1982). [DOI: http://dx.doi.org/10.1016/0032-3861(82)90320-2]
DOI
ScienceOn
|
6 |
Y. S. Yoo, J. H. Kim, K. S. Seo, H. G. Cho, and Y. K. Park, J. Korean Inst. Electr. Electron. Mater. Eng., 12, 1052 (1999).
|
7 |
T. Imai, F. Sawa, T. Ozaki, T Shimizu, R. Kido, M. Kozako, and T. Tanaka, Proc. of International Symposium on Electrical Insulating Materials, 5-9 (Kitakyushu, Japan, 2005) p. 239.
|
8 |
H. C. Karner, 6th ISH, 30.02, 1-4 (1989).
|