• Journal of the Korean Solar Energy Society
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• v.31 no.3
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• pp.95-100
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• 2011

Currently, office buildings in Korea tend to adopt as their outer wall the curtain wall structure which can be easily constructed and has beautiful external appearance as well. However, the problem is that the curtain wall structure does not have a uniform composition unlike the wall of existing reinforced concrete structures and has a frame made of metal with high heat conduction. Therefore, it is expected that the structure will be highly influenced by the thermal bridge. Thereupon, this study analyzes how to set up the composition of the wall system and heat transmission rate in consideration of the thermal characteristics of the curtain wall structure and applies it in practice by simulation in order to propose a guideline for the energy simulation method of the curtain wall structure and analyze its differences from existing simulation methods.

• Journal of the Korean Society of Propulsion Engineers
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• v.19 no.5
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• pp.15-21
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• 2015

The thermal decomposition characteristics of the ZPP(Zirconium/Potassium perchlorate), widely used as a primary charge of initiators, were investigated by differential scanning calorimetry(DSC). The DSC results with different heating rates were elaborated with AKTS-Thermokinetics software for the determination of the kinetic parameters of the thermal decomposition of ZPP. There was good agreement between the experimental and the simulation curves, based on the determined kinetic parameters, which indicates the validity of the kinetic description of the thermal decomposition process of ZPP.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.5 s.236
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• pp.617-624
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• 2005

An analysis of the effects of $CO_{2}$ on fundamental combustion characteristics was performed in Oxygen enriched condition by comparing the laminar burning velocities, flame structures, fuel oxidation paths. Fictitious $CO_{2}$ was introduced to discriminate the chemical reaction effects of $CO_{2}$ from the thermal effects. PREMIX code was utilized to evaluate the laminar burning velocities. OPPDIF code was utilized to investigate the flame structure and fuel oxidation path variation. The contributions of thermal effects on laminar burning velocities are dominant at lowly oxygen-enriched condition but those of chemical reaction effects become dominant at highly oxygen-enriched condition. Chemical reaction effects caused the additional flame temperature decrease besides thermal effects and oxygen-leakage increase in non-premixed flame. Specific fuel oxidation path and CO production path is enhanced in spite of overall decrement of fuel consumption rate by chemical reaction effects of$CO_{2}$.

• Journal of the Semiconductor & Display Technology
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• v.2 no.2
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• pp.5-8
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• 2003

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and $SiO_2$ by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and NH$_3$ as precursors. The TaN films were deposited at $250^{\circ}C$ by both method. The growth rates of TaN films were 0.8${\AA}$/cycle for PAALD and 0.75${\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w -1.8:0.12 mm but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was 11g/cmand one for thermal ALD TaN was 8.3g/$cm^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200 nm)/TaN(10 nm)/$SiO_2$(85 nm)/ Si structure was shown at temperature above $700^{\circ}C$ by XRD, Cu etch pit analysis.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.2
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• pp.83-89
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• 2010

Diamond-like carbon (DLC) coating was studied to be a good tribological problem-solver due to its low friction characteristics and high hardness. However, generally hydrogenated DLC film has shown a weak thermal stability above $300^{\circ}C$. However, the silicon doping DLC process by DC pulse plasma enhanced chemical vapor deposition (PECVD) for the new DLC coating which has a good characterization with thermal stability at high temperature itself has been observed. And we were discussed a process for optimizing silicon content to promote a good thermal stability using various tetramethylsilane (TMS) and methane gas at high-temperature. The chemical compositions of silicon-containing DLC film was analyzed using X-ray photoelectron spectroscopy (XPS) before and after heat treatment. Raman spectrum analysis showed the changed structure on the surface after the high-temperature exposure testing. In particular, the hardness of silicon-containing DLC film showed different values before and after the annealing treatment.

• Journal of Environmental Science International
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• v.9 no.3
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• pp.229-239
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• 2000

Spring, ground and thermal waters in the vicinity of Mt. Geumjeong and Mt. Baekyang area have been sampled and analyzed for major and minor elements. According to the Piper diagram, spring water belongs to $Ca-HCO_3$ and $Na-HCO_3$ types, groundwater to $Ca-HCO_3$ type, and thermal water to Na-Cl type. Based on the phase stability diagrams of $[Ca^{2+}]/{[H^+]}^2, [Mg^{2+}]/{[H^+]}^2, [K^+]/[H^+]$, and $[Na^+]/[H^+] vs. [H_4SiO_4]$, spring water, groundwater and thermal water are mostly in equilibrium with kaolinite. The result of factor analysis shows three factors (factor 1, 2 and factor 3) for the spring water, the groundwater and the thermal water which are represented by the influence of the dissolution of feldspar, calcite, anthropogenic sources (domestic and industrial wastes) and salt water.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.825-832
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• 2008

A simulation program is developed for analysing thermal networking process between the District heating and the CES(Community Energy Supply) systems. The effects of thermal networking on the District heating facilities previously being operated are implemented using mathematical correlations in terms of the fuel consumption and energy load such as heating and electricity. The operational characteristics according to the prime movers is modeled based on the materials of efficiency as a function of operational load. The unit energy load model is also developed extensively for several building types such as apartment complex, hotel, hospital, buildings for business and commercial use respectively. The specific features of the newly developed program in simulation of thermal networking process in district heating is described in terms of the reliability and the easiness for operating it etc.

• Land and Housing Review
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• v.3 no.1
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• pp.83-88
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• 2012

In this study, physical characteristics of cement and/or concrete materials that are typically used for energy-foundation (EF) structures have been studied. The thermal conductivity and structural integrity of the cement-based materials were examined, which are commonly encountered in backfilling a vertical ground heat exchangers, cast-in-place concrete piles and concrete lining in tunnel. For this purpose the thermal conductivity and unconfined compression strength of cement-based materials with various curing conditions were experimentally estimated and compared. Hydration heat generated from massive concrete in the cast-in-place concrete energy pile was observed for 4 weeks to estimate its dissipation time in the underground. The hydration heat may mask the in-situ thermal response test (TRT) result performed in the cast-in-place concrete energy pile. It is concluded that at least two weeks are needed to dissipate the hydration heat in this case. In addition, a series of numerical analysis was performed to compare the effect of thermal property of the concrete material on the cast-in-place pile.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.6
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• pp.580-585
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• 2009

Thermal analysis and design of FPA(Focal Plane Assembly)-CU(Cooling Unit) for Earth observation camera is performed. FPA-CU is the first cooling device for a spacecraft which is designed and manufactured by its own technology in Korea. FPA-CU has a special feature, TBM(Thermal Buffer Mass) which is discriminated from typical cooling devices using heat pipes and radiator. TBM can be regarded as a thermal energy reservoir and it shows thermally transient characteristics, which make it difficult to design the size and shape of TBM. In current study, a method to determine the volume and the size of TBM is proposed and validated. The transient thermal analysis for FPA-CU for 5 operational scenarios is performed and validates the final design of FPA-CU (Radiator,TBM, Heat pipe I/F). In case of an abnormal operation of a heat pipe among three radiator heat pipes, the temperature of FPA can be increased $3{\sim}4^{\circ}C$ according to the numerical simulation.