• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1487-1489
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• 2001

The tantalum oxide($Ta_2O_5$) is an important material for present thin-film capacitor application owing to its high dielectric constant and thermal stability. We report dielectric property of Si(p type)/Pt/$Ta_2O_5$/Ag based MIM structure obtained by RF sputtering and annealed in vacuum environment. We have measured and researched the characteristics of C-F, C-V and EPMA. And we describe parameter dependence on sputtered condition and annealed temperature with dielectric property.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.185-189
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• 1999

There has been a considerable attention in Invar alloys because of its low thermal expansion property. A low thermal expansion property of Invar alloys, lower than 10-6 near the room temperature, is attractive for precision machine tools. However, the expansion property of Invar alloys is limited below about 520。K, and mechanical properties are relatively low to apply to machine tools. In order to improve mechanical properties in this alloy, Ti alloy element was added to an invar alloy. Microstructure changes and optimum heat-treatment conditions according to Ti addition were discussed in the Ni38-Mo2-Crl-Fe Invar alloy.

• Korean Journal of Materials Research
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• v.25 no.12
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• pp.678-682
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• 2015

The electrical property of polymer matrix composites with added carbon powder is studied based on the temperature dependency of the conduction mechanism. The temperature coefficient of the resistance of the polymer matrix composites below the percolation threshold (x) changed from negative to positive at 0.20 < x < 0.21; this trend decreased with increasing of the percolation threshold. The temperature dependence of the electrical property(resistivity) of the polymer matrix composites below the percolation threshold can be explained by using a tunneling conduction model that incorporates the effect of the thermal expansion of the polymer matrix composites into the tunneling gap. The temperature coefficient of the resistance of the polymer matrix composites above the percolation threshold has a positive value; its absolute value increased with increasing volume fraction of carbon powder. By assuming that the electrical conduction through the percolating paths is a thermally activated process and by incorporating the effect of thermal expansion into the volume fraction of the carbon power, the temperature dependency of the resistivity above the percolation threshold can be well explained without violating the universal law of conductivity.

• Nuclear Engineering and Technology
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• v.33 no.2
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• pp.184-191
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• 2001

The effects of ${\gamma}$-irradiation on the crosslinking of high density polyethylene (HDPE) was investigated for the purpose of obtaining a suitable formulation for heat shrinkable materials. In this study the HDPE specimens were prepared by blending with cross linking agents and pressed into a 0.2 mm sheet at 18$0^{\circ}C$. ${\gamma}$-irradiation was conducted at 40 to 100 kGy in nitrogen. The heat shrinkable property and thermal mechanical property of the HDPE sheets have been investigated. It was found that the degree of crosslinking of the irradiated HDPE samples were increased with irradiation dose. Compared with the HDPE containing triallylisocyanurate, the HDPE containing trimethylol propane triacrylate shows a slight increase in crosslinking density. The heat transformation and dimension change of HDPE decreased with increasing radiation dose. The heat shrinkage of the samples increased with increasing annealing temperatures. The thermal resistance of HDPE increased upon the crosslinking of HDPE.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.385-396
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• 2012

Thermal shock test methods and thermal shock parameters for ceramics were reviewed from the following viewpoints: (1) The test methods should be based on the precise estimation of both temperature and thermal stress distributions in a specimen taking into account the temperature-dependent thermo-mechanical properties; (2) The thermal shock parameters must be defined as a physical property of the materials and described as a function of temperature at the fracture point of the specimen; (3) The relation between the strength and fracture toughness of brittle ceramics under a thermal shock load must be the same as the relation under a mechanical load. In addition, appropriate thermal shock parameters should be defined by the thermal shock strength and thermal shock fracture toughness based on stress and energy criteria, respectively. A constant heat flux method is introduced as a testing technique suitable for estimating these thermal shock parameters directly from the electric power charged.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.2
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• pp.57-60
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• 2005

Semiconductor carbon nanotube was grown on oxided silicon wafer with atmosphere pressure chemical vapor deposition (APCVD) method and investigated the electrical property after thermal oxidation at $300^{\circ}C$ in air. The electrical property was measured at room temperature in air after thermal oxidation at $300^{\circ}C$ for various times in air. Semiconductor carbon nanotube was steadily changed to metallic carbon nanotube as increasing of thermal oxidation times at $300^{\circ}C$ in air. Some removed area of carbon nanotube surface was shown with transmission electron microscopy (TEM) after thermal oxidation for 6 hours at $300^{\circ}C$ in air.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.8
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• pp.516-521
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• 2016

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile, and many other applications due to their excellent physical and electric properties. Especially, Mo-Cu composites with 5 ~ 20 wt.% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength, and prominent electrical and thermal conductivity. In most of the applications, highly-dense Mo-Cu materials with homogeneous microstructure are required for better performance. In this study, Mo-Cu alloys were prepared by PBM (planetary ball milling) and SPS (spark plasma sintering). The effect of Cu with contents of 5~20 wt.% on the microstructure and thermal properties of Mo-Cu alloys was investigated.

• Textile Coloration and Finishing
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• v.25 no.3
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• pp.206-214
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• 2013

There has been an increasing demand for high performance and energy-saving of blind. In order to develop the eco-friendly blind textiles, heat treatment process has been utilized for LM(Low Melting) polyester fabrics and the changes of the physical properties of the treated fabrics were examined according to temperature of heat treatment. Morphology, surface reflectance, contact angle, luster, thermal property and mechanical property of heat treated LM polyester fabrics were investigated. As results, morphology analysis of thermal treated fabrics confirmed that degree of fusion of LM polyester yarns improved with increase of temperature. Surface reflectance of thermal treated fabrics decreased with increase of temperature. Luster and contact angle of a water droplet on thermal treated fabrics increased slightly with increase of temperature. The mechanical properties of the fabrics by KES-FB system were found to be temperature-dependent and especially, bending and shear properties among them were highly related to temperature.

• Polymer(Korea)
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• v.24 no.3
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• pp.366-373
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• 2000

In this study, the PPS/ABS blend system was investigated in order to collectively identify the relationship among blend morphology, chemical compatibilization and thermal property. ABS resin was chemically modified by the incorporation of maleic anhydride through reactive extrusion for enhanced compatibilization, and PPS, ABS and the modified ABS were blend by a sing twin screw extruder. The effect of chemical modification of ABS on the morphological, mechanical, and thermal properities of the resulting blend was examined. A strong interaction was observed between PPS and MABS by optical microsopy as well as scanning electron microscopy, exhibiting a well-dispersed morphological feature. The PPS/MABS blend showing a single glass transition temperature was observed in dynamic mechanical analysis, demonstrating a pseudo-homogeneous phase morphology induced by chemical compatibilization. PPS/MABS blend also exhibited an enhanced thermal stability and heat distortion temperature compared with modified PPS/ABS blend.

• Korean Journal of Materials Research
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• v.29 no.9
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• pp.547-552
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• 2019

In the present study, the thermal conductivity of a silicon nitride($Si_3N_4$) thin-film is evaluated using the dual-wavelength pump-probe technique. A 100-nm thick $Si_3N_4$ film is deposited on a silicon (100) wafer using the radio frequency plasma enhanced chemical vapor deposition technique and film structural characteristics are observed using the X-ray reflectivity technique. The film's thermal conductivity is measured using a pump-probe setup powered by a femtosecond laser system of which pump-beam wavelength is frequency-doubled using a beta barium borate crystal. A multilayer transient heat conduction equation is numerically solved to quantify the film property. A finite difference method based on the Crank-Nicolson scheme is employed for the computation so that the experimental data can be curve-fitted. Results show that the thermal conductivity value of the film is lower than that of its bulk status by an order of magnitude. This investigation offers an effective way to evaluate thermophysical properties of nanoscale ceramic and dielectric materials with high temporal and spatial resolutions.