• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 추계학술발표대회 논문집
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• pp.83-87
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• 1999

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.

• 한국건축시공학회지
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• 제23권5호
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• pp.559-570
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• 2023

건설산업에서 사용되는 구조용 강재의 부식은 산업화로 인해 많은 공격적인 이온이 내포된 대기 환경에서 증가추세에 있다. 따라서 본 연구에서는 아크 및 플라즈마 아크용사로 Al 코팅을 용착하여 Cl^-와 CO₃^2-같은 공격적인 이온을 다량 함유한 Society of Automotive Engineering(SAE) J2334 용액의 모사대기환경에서 그 효과를 비교하였다. 다양한 분석기법으로 코팅 특성과 부식 메커니즘을 고찰하였다. 플라즈마 아크용사로 용착된 Al 코팅은 밀도 있고 균일하면 층층이 적층이 잘 되었고 높은 부착력이 나타났다. 이 공법으로 용착된 Al 코팅을 SAE J2334 용액에 기간별로 침지하여 측정한 개회로전위(OCP)는 아크용사로 용착된 Al 코팅보다 더 양전성(electropositive)한 값을 보여주었다. 플라즈마 아크용사는 총 임피던스가 아크용사보다 높게 나타났다. SAE J2334 용액에 23일 침지하였을 때 플라즈마 아크용사 Al 코팅의 부식속도는 아크용사에 비해 20% 감소하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.58-62
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• 2000

The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1990년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 26-27 Oct. 1990
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• pp.333-338
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• 1990

Most verification of improvements for adaptive control schemes are. dependent on computer simulations, but these computer simulations have much limitation, because (if complex actual conditions of system. This paper is concerned with the constructions of a thermal process system for experiments with various control schemes. This thermal process system is composed of a water tank, PC-XT, AD/DA converters power supply and thermal sensors. We estimate. the algorithms of pole-assignment adaptive control in the manifold disturbances and environments, changing system dynamics. The system equations for thermal press are included.

• 동력기계공학회지
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• 제16권2호
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• pp.49-53
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• 2012

Thermal spray coatings developed by deposition of splats, it formed by impacting molten droplets on substrates during thermal spray process. In this study, the Ni-based coatings were fabricated by thermal spray process with two different process parameters, oxygen gas flow and acetylene gas flow, with three different levels of each parameters. The morphology of splats and microstructure were observed by optical microscope. Hardness test were performed on the Ni-based coatings. It was confirmed that process parameters of thermal spray process have effect in morphology of splats. These effects also have important implications on the deposit microstructure and properties of Ni-based coatings.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• 한국안전학회지
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• 제24권4호
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• pp.40-46
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• 2009

The early identification of thermal hazards associated with a process such as the heats of reaction, exothermic decompositions, and the understanding of thermodynamics before any large scale operations are undertaken. The evaluation of reaction factors and thermal behavior on esterification process in manufacture of concrete mixture agents are described in the present paper. The experiments were performed in the differential scanning calorimetry(DSC), C 80 calorimeter, and thermal screening unit($TS^u$). The aim of the study was to evaluate the thermal stability of single material and mixture in esterification process. We provided the thermal data of chemical materials to present safe operating conditions through this study.

• Journal of the Korean Wood Science and Technology
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• 제44권2호
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• pp.184-190
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• 2016

Recently, wood is attracting attention as green building interior decoration material. When wood is used as building interior decoration material, excellent dimensional stability and thermal performance is required. In this study, superheated steam treatment process and thermal compression process were applied to flat sawn Pinus koraiensis wood panel in order to improve dimensional stability and thermal performance. According to results of this study, superheated steam treatment process and thermal compression process improve thermal performance and dimensional stability of wood, especially in tangential direction. The spring back in radial direction reduces the effect of thermal compression on dimensional stability of wood in radial direction.

• 태양에너지
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• 제19권4호
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• pp.33-43
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• 1999

The study on ice thermal storage system is to improve total system performance and increase the economical efficiency in actual all-conditioning facilities. To obtain the high charging and discharging efficiencies in ice thermal storage system, the improvement of thermal stratification is essential, therefore the process flow must be piston flow in the cylindrical type. With the relation of the aspect ratio(H/D) in the storage tank, the stratification is formed better as inlet flow rate is smaller. If the inlet and the outlet port are settled at the upside and downside of the storage tank, higher storage rate could be obtainable. In case that the flow directions inside the thermal storage tank are the upward flow in charging and the downward in discharging, thermal stratification is improved because the thermocline thickness is maitained thin and the degree of stratification increases respectively. In the charging process, in case of inlet flow rate the thermal stratification has a tendency to be improved with the lower flow rate and smaller temperature gradient in case of inlet temperature, the large temperature difference between inflowing water and storage water are influenced from the thermal conduction. The effect of the reference temperature difference is seen differently in comparison with the former study for chilled and hot water. In the discharging process, the thermal stratification is improved by the effect of the thermal stratification of the charging process.