• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1295-1300
• /
• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• Proceedings of the KSME Conference
• /
• 2001.06a
• /
• pp.831-836
• /
• 2001

In the case of axisymmetric thermal analysis of drum brakes, the distribution of frictional heat produced on the interface and temperature difference between mating frictional faces are very interesting problems to computational researchers. In this paper, heat conduction from the interface to the pad and the drum was modeled by using a thin interface element, so artificial division of the generated frictional heat between pad and drum is not necessary. Temperature difference between mating frictional faces is successfully modeled by using the interface element. The influence of some parameters on tile thermal stress was checked. The analysis was performed by ABAQUS/Standard code.

• Journal of the Korean Society for Railway
• /
• v.10 no.3 s.40
• /
• pp.251-256
• /
• 2007

The research analyzed dynamo test results to evaluate compatibility between brake disk made of NCM-CV cast iron and various pads. The dynamo test was executed with one kind of resin pad and three kinds of sintered pads suitable for 200 km/h trains according to a program which refers to UIC 541-3. The thermocouples were established in specific location in order to measure the temperature of disk and pads. In addition, the thermal imaging camera was used for capturing the instantaneous thermal characteristic of disk. The research results may be utilized to use as basis data of pad development for NCM-CV brake disk hereafter.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.27-32
• /
• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.3
• /
• pp.51-56
• /
• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Journal of Welding and Joining
• /
• v.29 no.1
• /
• pp.46-51
• /
• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.19 no.2
• /
• pp.211-215
• /
• 2010

Continuous contraction and expansion of disk brake can be due to friction and temperature difference at repeated sudden braking. As serious vibration at disk is produced, the braking force will be changed ununiformly and braking system can not be stabilized. Temperature and heat flux at disk brake are investigated by structural and thermal analysis in this study. The maximum equivalent stress and displacement are shown respectively at the ventilated hole and the lower part of disk plate. At thermal analysis of initial state, temperature on disk plate is distributed from $95.9^{\circ}C$ to $100^{\circ}C$. The maximum heat flux of $0.0168W/mm^2$ is shown at the inner friction part between disk plate and pad. At thermal analysis of transient state, temperature on disk plate is distributed from $95^{\circ}C$ to $96.5^{\circ}C$ after 100 second. The maximum heat flux of $0.0024W/mm^2$ is also shown at the inner friction part between disk plate and pad. By comparing with initial state, the temperature on disk plate is more uniformly distributed and heat flux is more decreased by 7 times at transient state.

• Tribology and Lubricants
• /
• v.27 no.5
• /
• pp.269-274
• /
• 2011

The purpose of this paper is to study and analyze the improvement method for the failure examples including the vehicle brake system in actual field. It was verified that the indicator plate of pad wear scratched the brake disk because of wearing after displacement of non- identification parts pad. The caliper of other vehicle was installed with brake system verified the phenomenon produced groove in center point because of one side wear when the pad was not fully contacted with the rub disk by other action surface pressure and pad action condition. It verified that the crack phenomenon fatigue was produced by brake thermal deformation because of decreasing the thickness by grinding to modify the non-uniformed wear of brake disk. It verified that the friction sound was produced by the friction phenomenon because of non-uniformed contact of lining and an alien substance with inner of the drum and lining braking by crack phenomenon with brake drum surface.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.181-183
• /
• 2006

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

• Proceedings of the KSME Conference
• /
• 2000.04a
• /
• pp.381-386
• /
• 2000

The brake force of drum brakes for commercial vehicles is applied by a s-cam. First of all the influence of the s-cam load angles and elastic modulus of the pad on the contact pressure distribution between pad and drum was checked by using 3 dimensional finite element model. In the second part, temperature and thermal stress analyses were carried out by an axisymmetric model with constant heat flux and pressure-proportional heat flux. In the case of temperature analysis the heat conduction from the interface to the pad and the drum was modeled using a thin soft film element, so artificial division of the generated heat flux between pad and drum is not necessary. The analysis was performed by ABAQUS/Standard code.