• 제목/요약/키워드: Thermal Mathematical Model

검색결과 192건 처리시간 0.028초

STM 열진공 시험 결과를 이용한 EOS-C Ver.3.0 열제어계 설계 검증 (Design Verification of Thermal Control Subsystem for EOS-C Ver.3.0 using STM Thermal Vacuum Test Result)

  • 장진수;양승욱;정연황
    • 한국항공우주학회지
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    • 제38권12호
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    • pp.1232-1239
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    • 2010
  • (주)쎄트렉아이는 지구관측위성의 주 탑재체로 사용될 고해상도 전자광학카메라, EOS-C Ver.3.0을 개발 중이다. EOS-C Ver.3.0은 현재 운용중인 DubaiSat-1의 주 탑재체인 EOS-C Ver.2.0 개발 경험을 바탕으로 능동 열제어 방식과 수동 열제어 방식을 적절하게 혼용하여 보다 향상된 성능을 갖도록 설계되었다. 설계를 바탕으로 STM을 개발하여 인증(qualification) 수준의 열진공 시험을 수행하여 설계 여유(design margin)를 확인하였다. 또한 열평형 시험 결과를 이용하여 열제어계 설계에 사용한 열-수치 모델에 대한 검증 작업을 수행하였으며, 열-수치 모델이 실제 열적 특성을 잘 모사하고 있음을 확인하였다.

비전도성 충진액을 포함하는 전동워터펌프 열 해석 모델 (Thermal analysis model for electric water pumps with non-conductive cooling liquid)

  • 정성택;윤선진;하석재
    • Design & Manufacturing
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    • 제16권2호
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    • pp.46-52
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    • 2022
  • As the consumer market in the eco-friendly vehicle industry grows, the demand for water pump in a electric car parts market. This study intend to propose a mathematical model that can verify the effect of improving thermal properties when a non-conductive cooling filler liquid is introduced into an electric vehicle water pump. Also, the pros and cons of the immersion cooling method and future development way were suggested by analyzing the cooling characteristics using on the derived analysis solution. Thermal characteristics analysis of electric water pump applied with non-conductive filler liquid was carried out, and the diffusion boundary condition in the motor body and the boundary condition the inside pump were expressed as a geometric model. As a result of analyzing the temperature change for the heat source of the natural convection method and the heat conduction method, the natural convection method has difficulty in dissipating heat because no decrease in temperature due to heat release was found even after 300 sec. Also, it can be seen that the heat dissipation effect was obtained even though the non-conductive filling liquid was applied at the 120 sec and 180 sec in the heat conduction method. It has proposed to minimize thermal embrittlement and lower motor torque by injecting a non-conductive filler liquid into the motor body and designing a partition wall thickness of 2.5 mm or less.

Strip Tension Control Considering the Temperature Change in Multi-Span Systems

  • Lee Chang Woo;Shin Kee Hyun
    • Journal of Mechanical Science and Technology
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    • 제19권4호
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    • pp.958-967
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    • 2005
  • The mathematical model for tension behaviors of a moving web by Shin (2000) is extended to the tension model considering the thermal strain due to temperature variation in furnace. The extended model includes the terms that take into account the effect of the change of the Young's Modulus, the thermal coefficient, and the thermal strain on the variation of strip tension. Computer simulation study proved that the extended tension model could be used to analyze tension behaviors even when the strip goes through temperature variation. By using the extended tension model, a new tension control method is suggested in this paper. The key factors of suggested tension control method include that the thermal strain of strip could be compensated by using the velocity adjustment of the helper-rollers. The computer simulation was carried out to confirm the performance of the suggested tension control method. Simulation results show that the suggested tension control logic not only overcomes the problem of the traditional tension control logic, but also improves the performance of tension control in a furnace of the CAL (Continuous Annealing Line).

Thermal Model for Power Converters Based on Thermal Impedance

  • Xu, Yang;Chen, Hao;Lv, Sen;Huang, Feifei;Hu, Zhentao
    • Journal of Power Electronics
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    • 제13권6호
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    • pp.1080-1089
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    • 2013
  • In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.

전도성 접착제의 열경화 응력에 대한 해석 (Thermal Ratchetting of the Conductive Adhesives Joints Subjected to the Thermal Cycles)

  • 박주혁;서승호
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.208-213
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    • 2002
  • When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

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핵 폐기물 처리에 따른 지열문제(地熱問題) (Thermal Aspects of Nuclear Waste Disposal)

  • 한욱
    • 자원환경지질
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    • 제18권1호
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    • pp.49-53
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    • 1985
  • 본 연구는 핵 폐기물의 중심부에서 거리가 변화함에 따른 온도 곡선을 포함하여 폐기물 처리 계획을 이해하기 위한 수학적 모델이 적용되었다. 지열 문제를 위하여 수식의유도, 수치결과 및 제한점들을 평가하였으며 본 연구 결과와 절차로부터 방사성 물질로 인한 온도의 변화를 예측할 수 있다.

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과도탐침법에 의한 열전도계수 측정장치 개발 (Development of Experimental Apparatus For Measuring Thermal Conductivity by Transient Probe Method)

  • 배신철;김명윤
    • Journal of Biosystems Engineering
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    • 제22권1호
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    • pp.59-67
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    • 1997
  • An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

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DCS Model Calculation for Steam Temperature System

  • Hwang, Jae-Ho
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2004년도 ICCAS
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    • pp.1201-1204
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    • 2004
  • This paper suggests a DCS (Distributed Control System) model for steam temperature system of the thermal power plant. The model calculated within sectional range is linear. In order to calculate mathematical models, the system is partitioned into two or three sectors according to its thermal conditions, that is, saturated water/steam and superheating state. It is divided into three sections; water supply, steam generation and steam heating loop. The steam heating loop is called 'superheater' or steam temperature system. Water spray supply is the control input. A first order linear model is extracted. For linear approach, sectional linearization is achieved. Modeling methodology is a decomposition-synthetic technique. Superheater is composed of several tube-blocks. For this block, linear input-output model is to be calculated. Each tiny model has its transfer function. By expanding these block models to total system, synthetic DCS linear models are derived. Control instrument include/exclude models are also considered. The resultant models include thermal combustion conditions, and applicable to practical plant engineering field.

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The Analysis of Heat Transfer through the Multi-layered Wall of the Insulating Package

  • Choi, Seung-Jin
    • 한국포장학회지
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    • 제12권1호
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    • pp.45-53
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    • 2006
  • Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

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Numerical buckling temperature prediction of graded sandwich panel using higher order shear deformation theory under variable temperature loading

  • Sahoo, Brundaban;Sahoo, Bamadev;Sharma, Nitin;Mehar, Kulmani;Panda, Subrata Kumar
    • Smart Structures and Systems
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    • 제26권5호
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    • pp.641-656
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    • 2020
  • The finite element solutions of thermal buckling load values of the graded sandwich curved shell structure are reported in this research using a higher-order kinematic model including the shear deformation effect. The numerical buckling temperature has been computed using an in-house specialized code (MATLAB environment) prepared in the framework of the current mathematical formulation. In addition, the mathematical model includes the excess structural distortion under the influence of elevated environment via Green-Lagrange nonlinear strain. The corresponding eigenvalue equation has been solved to predict the critical buckling temperature of the graded sandwich structure. The numerical stability and the accuracy of the current solution have been confirmed by comparing with the available published results. Thereafter, the model is extended to bring out the influences of structural parameters i.e. the curvature ratio, core-face thickness ratio, support conditions, power-law indices and sandwich types on the thermal buckling behavior of graded sandwich curved shell panels.