• Journal of the Korean institute of surface engineering
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• v.56 no.6
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• pp.443-450
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• 2023

SiC/SiC_f CMC is vulnerable to water vapor corrosion at a high temperature of 1500℃. So, EBC (Environmental Barrier Coating) materials are required to protect Si-based CMCs. Ytterbium silicates are reported to have coefficient of thermal expansion (CTE) similar to that of the base material, such as SiC/SiC_f CMC. When the EBC are materials exposed to high temperature environment, the interface between ytterbium silicates and SiC/SiC_f CMC is not separated, and the coating purpose can be safely achieved. For the perspective of EBC applications, thermally grown oxide (TGO) layer with different CTE is formed by the reaction with water vapor in EBC, which leads to a decrease in life time. In this study, we prepare two types of ytterbium silicates to observe the corrosion behavior during the expose to high temperature and water vapor. In order to observe this behavior, the steam-jet furnace is prepared. In addition, phase formation of these ytterbium silicates is analyzed with microstructures by the before/after steam-jet evaluation at 1500℃ for 100 h.

• Journal of Technologic Dentistry
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• v.33 no.4
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• pp.349-357
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• 2011

Purpose: In this study, for the reasons of observing the changes when using bonding agent with Ni-Cr alloy and Co-Cr alloy and using VM13 and Vintage MP ceramic which have the disparity in coefficient of thermal expansion, it is carried out to evaluate the characteristics of the bonding agent through the analysis of the interface between metal and ceramic and the analysis of bond strength by variable. Methods: The surface treatment was performed on the two kinds of alloy(Ni-Cr alloy and Co-Cr alloy) specimens, which were sandblasted and were treated with bonder application. The metal-ceramic interfaces were analyzed with EPMA in order to ionic diffusion, and the shear test was performed. Results: As a result of observation of metal-ceramic interfacial properties, it was observed that Cr atoms were spread from the alloy body to the ceramic floor in the specimen of Group B. It was also seen that Cr, W atoms were spread from the alloy body to the ceramic floor in the specimen of Group S. In consequence of observing Shear bond strength, it was calculated that the specimen of BSV was 27.75(${\pm}11.21$)MPa, BSM was 27.02(${\pm}5.23$)MPa, BCV was 30.20(${\pm}5.99$)MPa, BCM was 27.94(${\pm}10.76$)MPa, SSV was 20.83(${\pm}2.58$)MPa, SSM was 23.98(${\pm}3.94$)MPa, SCV was 32.32(${\pm}4.68$)MPa, and SCM was 34.54(${\pm}10.63$)MPa. Conclusion: In the metal-ceramic interface of Bellabond plus sample group, diffusion of Cr atoms was incurred and diffusion of C Cr atoms and W atoms in the sample group of $Starloy{(R)}\;C$ was observed. Using bonding agent showed the higher bond strength than using the sand blasting treatment. In the Bellabond plus alloys, the specimen group with the use of binding materials showed higher shear bond strength, but didn't show statistically significant differences (p>0.05). In the $Starloy{(R)}\;C$ alloys, the specimen group with the use of binding materials showed higher shear bond strength and statistically significant differences(p<0.05). In terms of VM13 ceramic, it was in the Bellabond plus alloys that the high shear bond strength was showed, but there's no statistically significant differences(p>0.05). In terms of Vintage MP ceramic, it was in the $Starloy{(R)}\;C$ alloys that the high shear bond strength was showed and statistically significant differences(p<0.05). Metal-ceramic to fracture of the shear strength measurements and an analysis of all aspects of military usage fracture of the composite, respectively.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.285-292
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• 1992

Ultrathin(8nm) oxynitride (SiOxNy) film have been formed on Si(100) by rapid thermal processing(RTP) in $O_2$and $N_2$O as reactants. Compared with conventional furnace $O_2$ oxide, the oxynitride dielectrics shows better characteristics of I-V and TDDB, and less flat-band voltage shift. The oxynitride has a behavior of Fowler-Nordheim tunneling in the region of V 〉${\varphi}_0$ simialr to pure Si$O_2$oxide. The relative dielectric constant of oxynitride is higher than that of conventional pure oxide. Excellent diffusion harrier property to dopant(B$F_2$) is also observed. Nitrogen depth profiles by SIMS, AES, and XPS show nitrogen pile - up at Si$O_2$/Si interface, which can explain the improved properties of oxynitride dielectrics.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.283-287
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• 2017

Recently, Ni-InGaAs has been required for high-performance III-V MOSFETs as a promising self-aligned material for doped source/drain region. As downscaling of device proceeds, reduction of contact resistance ($R_c$) between Ni-InGaAs and n-InGaAs has become a challenge for higher performance of MOSFETs. In this paper, we compared three types of sample, vacuum, 2% $H_2$ and 4% $H_2$ annealing condition in rapid thermal annealing (RTA) step, to verify the reduction of $R_c$ at Ni-InGaAs/n-InGaAs interface. Current-voltage (I-V) characteristic of metal-semiconductor contact indicated the lowest $R_c$ in 4% $H_2$ sample, that is, higher current for 4% $H_2$ sample than other samples. The result of this work could be useful for performance improvement of InGaAs n-MOSFETs.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.6
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• pp.769-774
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• 2013

Turbine blades and disc, which are one of the most important rotating parts of a gas turbine engine, are required to have highly efficient performance in order to minimize the total life cycle costs. Owing to these requirements, these components are exposed to severe conditions such as extreme turbine inlet temperatures, high compression ratios, and high speeds. To evaluate the structural integrity of a turbine disc under these conditions, material modeling and finite element analysis techniques are essential; furthermore, shape optimization is necessary for determining the optimal solution. This study aims to generate 2D finite element models of an axisymmetry model and a sector one and to perform thermal-structural coupled-field analysis and contact analysis. Structurally vulnerable areas such as the disc bore and disc-blade interface region are analyzed by a parametric study. Finally, an improved design is provided based on the results, and the necessity of elaborate shape optimization is confirmed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.362-363
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• 2012

A new cross-linkable polymer, cross-linked d-PBAB, which has the triphenylamine as the hole transporting moiety and ethynyl group as the thermal cross-linker is firstly synthesized by the combination of anionic polymerization and deprotection process. The thermal cross-linking reaction was performed at $240^{\circ}C$ for 50 min and cross-linked d-PBAB layer showed smooth surface and is not soluble at organic solvent under spin-coating of emitting layer (EML). The solution-processed PLED which was fabricated with cross-linked d-PBAB as HTL showed approximately two times higher Lmax and four times higher LEmax than those obtained from PLED with PEDOT:PSS as the HTL. These result is ascribed to better ability of cross-linked d-PBAB to block electrons and to prevent exciton-quenching than those of PEDOT : PSS at the EML interface. This results strongly suggested that cross-linked d-PBAB can be a promising material to replace conventional PEDOT : PSS. It can be suspected that PLEDwith cross-linked d-PBAB would show longer lifetime compared with that of PLED with PEDOT : PSS, and thus further studies are under investigation.

• Journal of Satellite, Information and Communications
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• v.5 no.2
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• pp.8-13
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• 2010

Satellite structure should be designed to accommodate and support safely the payload and equipments necessary for its own missions and to secure satellite and payloads from severe launch environments. The launch environments imposed on satellites are quasi-static accelerations, aerodynamic loads, acoustic loads and shock loads. Especially when optical payload is accommodated, satellite structure usually adopts the optical bench consisting of composite material not only to support and secure but also to guarantee good pointing stability against extreme thermal environments. This paper deals with optical bench and support structure which shall be designed to minimize the loads transferred to optical payloads from satellite.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.706-714
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• 1995

Silicon oxide thin films were deposited by remote plasma chemical vapor deposition (RPCYD). The effect of the operating variables, such as plasma power, deposition temperature and partial pressure of reactant on the material Properties of the silicon oxide film was investigated. By XPS, it was found out that the film was suboxide (O/Si<2) and small amount of nitrogen due to the plasma excitation was accumulated at the Si/SiO$_2$interface. The amount of dangling bonds at the Si/SiO$_2$interfaces were measured by ESR and the concentration of hydrogen bond was obtained by SIMS and FT-IR. The bond angle distribution(d$\theta$/$\theta$) was shown to be similiar to thermal oxide above 20$0^{\circ}C$ but the etch rate was higher than that of the thermal oxides due to the structural difference and the stress between silicon substrate and silicon oxide film.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Elastomers and Composites
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• v.49 no.1
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• pp.43-52
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• 2014

The effect of nanoclay (Cloisite 20A) on the self-adhesion behavior of uncured brominated-isobutylene-isoprene rubber (BIIR) has been studied. The dispersion state of nanoclay into the rubber matrix was examined by SEM, TEM and XRD analysis. The thermal degradation behavior of the filled and unfilled samples was examined by TGA and improvement in the thermal stability of the nanocomposites occurred based on the weight loss (%) measurements. Also, addition of nanoclay enhanced the cohesive strength of the material by reinforcement action thereby reducing the degree of molecular diffusion across the interface of butyl rubber. However, the average depth of penetration of the inter-diffused chains was still adequate to form entanglement on either side of the interface, and thus offered greater resistance to peeling, resulting in high tack strength measurements. The improvement in tack strength was only achieved at critical nanoclay loading above 8 phr. Contact angle measurement was also made to examine the surface characteristics. There was no significant interfacial property change by employing the nanoclay.