• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.13-20
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• 2009

This work presents functionally graded coatings (FGC) of hydroxyapatite (HA) and metallic powders on Ti-6Al-4V implants using plasma spray coating method. HA has been the most frequently used coating material due to its excellent compatibility with human bones. However, because of the abrupt changes in thermomechanical properties between HA and the metallic implant across an interface, and residual stress induced on cooling from coating temperture to room temperature, debonding at the interface occurs in use sometimes. In this work, FGC of HA and Ti or Ti-alloy powders is made to mitigate the abrupt property changes at the interface and the effect of FGC on residual stress release is investigated by evaluating the mechanical bond strength between the implant and the HA coating layers. Thermal annealing is done after coating in order to crystallize the HA coating layer which tends to have amorphous structure during thermal spray coating. The effects of types and compositional ratio of metallic powders in FGC and annealing conditions on the bond strength are also evaluated by strength tests and the microstructure analysis of coating layers and interfaces. Finally, biocompatibility of the coating layers are tested under ISO 10993-5.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Korean Journal of Materials Research
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• v.29 no.7
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• pp.443-450
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• 2019

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.116-117
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• 2006

I-D ZnO nanostructures were fabricated by thermal evaporation method on Si(100), GaN and $Al_2O_3$ substrates without a catalyst at the reaction temperature of $700^{\circ}C$. Only pure Zn powder was used as a source material and Ar was used as a carrier gas. The shape and growth direction of synthesized ZnO nanostructures is determined by the crystal structure and the lattice mismatch between ZnO and substrates. The ZnO nanostructure on Si substrate were inclined regardless of their substrate orientation. The origin of ZnO/Si interface is highly lattice-mismatched and the surface of the Si substrate inevitably has the $SiO_2$ layer. The ZnO nanostructure on the $Al_2O_3$ substrate was synthesized into the rod shape and grown into particular direction. For the GaN substrate, however, ZnO nanostructure with the honeycomb-like shape was vertically grown, owing to the similar lattice parameter with GaN substrate.

• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.331-337
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• 2022

Manufactured thermoplastic composite materials to replace the metal materials used as battery housing materials for electric vehicles with lightweight materials. As the matrix material, nylon 6 which is a polymer material was used. Boron Nitrate(BN), which has high thermal conductivity, was used to provide heat dissipation performance. The heat dissipation characteristics of the thermally conductive polymer composite material according to the BN content and particle size were analyzed. The thermal conductivity value increased as the filler content increased, and composite materials particle size of 60 to 70㎛ and BN content of 50%, the thermal conductivity was 1.4 W/mK. The larger the particle size, the wider the inter-particle interface contact surface, which means that a thermal path was formed. wider the interfacial contact surface between the particles, and the thermal path was formed. A battery housing was manufactured using the manufactured thermally conductive polymer composite material, and the temperature change during charging and discharging of the cell was observed, and the possibility as a substitute material for the battery housing was confirmed.

• Polymer(Korea)
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• v.29 no.1
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• pp.96-101
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• 2005

Fluoropolymer of PTFE and PFA etc. is a heat resistance polymeric material that it is known as that maximum continuous use temperature reaches for 260 $^{\circ}C$. It was observed that these polymers had the enough thermal stability so enough that it was kept by thermal aging of 280 $^{\circ}C$/7 weeks too in this study. However, such thermal stability means that bulk material property is kept such as mechanical strength, melting point and initial pyrolysis temperature etc. If these polymers are evaluate by coating property such as surface contact angle, surface morphology, surface scratch, thing that heat resistance is not enough was confirmed in this study. Thermal aging of flouropolymer coating was achieved by gear aging oven that the exchange rate of air was controlled, and the analysis results were indicating serious damage of surface morphology and adhesive strength on metal substrate.

• Composites Research
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• v.35 no.6
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• pp.431-438
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• 2022

Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users' safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.35-45
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• 2002

The stresses of the underfill/chip interface due to thermal loading was studied using the finite element method. At first, the effective properties of underfill for several volume fractions of silica particles were calculated by Mori-Tanaka method for three different material sets, and the parameters of singularity for the bimaterial edge and the bimaterial wedge were calculated. Consequently, the stresses at the underfill/chip interface with volume fraction of silica particles were investigated. Five different geometric models of flip-chip assembly involving two kinds of bimaterial strips and three kinds of three-layer models were considered under the assumption that the underfill is homogeneous. It was assumed that all components of the flip-chip assembly were linear elastic and isotropic, and their properties were temperature independent. The analysis was conducted in the context of the uncoupled plane thermo-elasticity under a plane strain assumption.