• Korean Journal of Materials Research
• /
• v.31 no.2
• /
• pp.97-100
• /
• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• Journal of Information Display
• /
• v.13 no.1
• /
• pp.1-6
• /
• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.990-993
• /
• 2006

We fabricated top emission organic light emitting diode (TEOLED) with transparent metal cathode Barium and Silver bilayer. Very thin Ba/Ag bilayer was deposited on the organic layer by thermal evaporation. This cathode shows high transmittance over 70% in visible range. And the device with a Ba-Ag has a low turn on voltage and good electrical properties.

• Proceedings of the IEEK Conference
• /
• 2000.11b
• /
• pp.225-228
• /
• 2000

In this paper, we demonstrated an analytical description method of forward voltage drop and reverse voltage of $P^{+}N$ junction diode with <111> oriented antimony doped silicon wafer 60keV boron implantation computer simulation results. In order to make electrical activation of implanted carriers, thermal annealing are carried out by RTP method for 1min at $1000^{\circ}C$ inert gas condition.

• Journal of Information Display
• /
• v.7 no.3
• /
• pp.23-26
• /
• 2006

We fabricated top emission organic light emitting diode (TEOLED) with transparent metal cathode Barium and Silver bilayer. Very thin Ba/Ag bilayer was deposited on the organic layer by thermal evaporation. This cathode showed high transmittance over 70% in visible range, and the device with a Ba-Ag has a low turn on voltage and good electrical properties.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.1117-1118
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2011.06a
• /
• pp.1163-1164
• /
• 2011

• ETRI Journal
• /
• v.27 no.3
• /
• pp.337-340
• /
• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• Biomedical Science Letters
• /
• v.15 no.1
• /
• pp.81-86
• /
• 2009

Lasers are necessity in our life related to the fields of medicine and cosmetic surgery. With 808 nm diode laser and $CO_2$ laser, we made some wounds on a dorsum of rat by laser irradiation. All of irradiations shows thermal effects on the whole region of skin tissues. They make wound damage depending on laser power and irradiation time. Because a collagen is plays an important role in tissue repair, we studied collagen accumulation in wound tissue. For wound healing, collagen accumulation was found in the near region of damage in epidermis and dermis layer of the rat skin. In case of the quantitative analysis of collagen in wound tissue, the amount of collagen in wound tissue by $CO_2$ laser irradiation is higher than that of 808 nm diode laser irradiation. And re-epithelialization was significantly faster in wound by $CO_2$ laser irradiation compared with that of 808 nm diode laser irradiation.

• Food Science of Animal Resources
• /
• v.42 no.1
• /
• pp.142-152
• /
• 2022

The present study was aimed at examining the antibacterial effects of nonthermal decontamination processes, which are equivalent to thermal treatment, to ensure microbiological safety of raw ground chicken. Escherichia coli or Salmonella were inoculated into 25 g of raw ground chicken samples. The raw ground chicken samples were non-treated or treated with high hydrostatic pressure (HHP) at 500 MPa (1-7 min), light-emitting diode (LED) irradiation at 405 nm wavelength (30-120 min), and heat at 70℃, 90℃ (1-60 min), and 121℃ (1-15 min). E. coli and Salmonella cell counts were enumerated after treatments. Moreover, the color parameters of treated raw ground chicken were analyzed. HHP treatment reduced E. coli and Salmonella cell counts by more than 5 Log CFU/g and more than 6 Log CFU/g after 7 min and 1 min, respectively; these effects were equivalent to those of thermal treatment. However, LED irradiation reduced Salmonella cell counts by only 0.9 Log CFU/g after 90 min of treatment, and it did not reduce E. coli cell counts for 90 min. Compared with those of the non-treated samples, the ΔE (total color difference) values of the samples treated with HHP were high, whereas the ΔE values of the samples treated with LED irradiation were low (1.93-2.98). These results indicate that despite color change by HHP treatment, HHP treatment at 500 MPa could be used as a non-thermal decontamination process equivalent to thermal treatment.