• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 하계학술발표대회 논문집
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• pp.776-781
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• 2008

A ground heat exchanger in a GSHP system is an important unit that determines the thermal performance of a system and its initial cost. The Size and performance of this heat exchanger is highly dependent on the thermal properties. A proper design requires certain site-specific parameters, most importantly the ground effective thermal conductivity, the borehole thermal resistance and the undisturbed ground temperature. This paper is part of a research project aiming at constructing a database of these site-specific properties, especially ground effective thermal conductivity. The objective was to develop and evaluation method, and to provide this knowledge to design engineers. To achieve these goals, thermal response tests were conducted using a testing device at nearly 150 locations in Korea. The in-situ thermal response is the temperature development over time when a known heating load imposed, e.g. by circulating a heat carrier fluid through the test exchangers. The line-source model was then applied to the response test data because of its simplicity. From the data analysis, the range of ground effective thermal conductivity at various sites is $1.5{\sim}4.0\;W$/mK. The results also show that the ground effective thermal conductivity varies with grouting materials as well as regional geological conditions and groundwater flow.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2004년도 한국우주과학회보 제13권2호
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• pp.239-242
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• 2004

The fairing of the launch vehicles has a role of protecting the spacecraft from outer thermal, acoustical, and mechanical loads during flight. Among them, the thermal load is analyzed in the present study. The ascent thermal analyses include aerodynamic heating rate on every point of the fairing, heat transfer through the fairing and spacecraft, and the final temperature during ascent flight phase. A design code based on theoretical/experimental database is applied to calculate the aerodynamic heating rate, and a thermal math program, SINDA/Fluint, is considered for conductive heat transfer of the fairing. The results show that the present design satisfies the allowing temperature of the structure. Another important thermal problem, pyro explosive fairing separation device, is calculated because the pyro system is very sensitive to the temperature. The results also satisfies the pyro thermal condition.

• 전기학회논문지
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• 제57권12호
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• 대한건축학회논문집:계획계
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• 제35권8호
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• pp.23-34
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• 2019

The façade, a fundamental function as a skin that protects human life from external environment such as cold and hot weather, snow, rain, and wind, etc, has served as a media for communication between indoor space of the building and outside space. From the media for communication point of view, the approach to envelope design, in which environmental elements are transmitted internally through the filtering of external environments, has been evolving in various ways from the past to the present. Today, modern architecture technologies including curtain wall systems and user-friendly computer programming and environmental analysis programs demonstrate a differentiated approach to envelope design related to the indoor environment. For this reason, it is worth noting that the envelope design factors and trends that appear variously in the UNStudio's projects before and after the 2000s. The factors reflected in the envelop design in conjunction with the indoor environment obtained through the case study of the UNStudio's office projects were daylight environment, thermal environment, ventilation, noise, privacy and view, and consideration for daylight environment and thermal environment was reflected in many cases through the case study. Looking at the changes in the diagrams in order of year, it can be seen that the envelope design using the environmental analysis tool has been performed since 2006. This is a clue to show the envelop design changes from the conceptual method to the data-based one. The diagrams and analysis results related to the envelop design showed that the thermal environment related to solar radiation was the most, and no diagrams and analysis related to the indoor illumination were found. Since 2010, PV panel installation has been shown in the envelope design, which can be found in the increased efficiency of PV panels due to the technological advances and the decrease in production cost.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.425-429
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• 2004

In real design of the high & interim pressure turbine casing, it is one of the important things to figure out its thermal strain exactly. In this paper, with the establishment of the new concept for the heat transfer coefficient of steam that is one of the factors in analysis of the thermal stress for turbine casing, an analysis was done for one of the high & interim pressure turbine casings in operating domestically. The sensitivity analysis of the heat transfer coefficient of steam to the thermal strain of the turbine casing was done with a 2-D simple model. The analysis was also done with switching of the material properties of the turbine casing and resulted in that the thermal strain of the turbine casing was not so sensitive to the heat transfer coefficient of steam. On the basis of this, 3-D analysis of the thermal strain for the high and interim pressure turbine casing was done.

• 한국군사과학기술학회지
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• 제9권2호
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• pp.5-10
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• 2006

The heavy thermal load to battle tanks can cause electronic components' malfunction and crew to be put out of action. The thermal load is generated from Internal heat sources such as electronic devices installed in the room as well as extremely hot weather. In this study, heat and flow analysis for the cabin room of a battle tank was performed to deal with this thermal problem. This study presented the validation of simulation results in comparison with those of test, the investigation of optimal flow design for effective cooling in cabin room and finally the evaluation of thermal comforts to crew.

• 한국전기전자재료학회논문지
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• 제24권5호
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• pp.351-354
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• 2011

This paper was carried about thermal analysis for high efficiency point contact solar cell. Therefore, we carried about 2-D device and process simulator according to design and process parameters. As a result of simulations, power transfer efficiency have decreased more increasing temperature. Especially, power transfer efficiency of room temperature have been showed 25%. The other hand, power transfer efficiency of 350 K kalvin temperature have been showed 20%. Therefore, we will considered design with thermal dissipation of device.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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• pp.105-109
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• 2000

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

• 대한기계학회논문집B
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• 제26권3호
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• pp.507-514
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• 2002

A computation routine, capable of performing thermal design analysis of the triple-pressure bottoming system (heat recovery steam generator and steam turbine) of combined cycle power plants, is developed. It is based on thermal analysis of the heat recovery steam generator and estimation of its size and steam turbine power. It can be applied to various parametric analyses including optimized design calculation. This paper presents analysis results for the effects on the design performance of heat exchanger arrangements at intermediate and high temperature parts as well as steam pressures. Also examined is the effect of steam sources for deaeration on design performance.