• 한국안전학회지
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• 제27권3호
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• pp.57-62
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• 2012

The purpose of this paper is to find dangerous factors of a water purifier when water leaks due to inappropriate use and analyze the patterns of damaged parts in order to provide data for the examination of the cause of the problem. If the water purifier is inspected and managed by a non-specialist, when the FLC(Float Level Controller) at the top is inclined, water leakage may occur to the water purifier. The leaked water flows onto the cables and hoses and enters the thermostat terminal, heater, PCB, power supply connection connector, etc., becoming a dangerous factor that may cause a system failure, fire, etc. Due to the water that entered the input terminal, low noise and white smoke were generated at first. However, the flame gradually propagated due to the continuous inflow of moisture. It was found that when moisture reached the PCB, a carbonized conductive path was formed at the varistor terminal, input terminal, semiconductor device terminal, etc., and the flame became larger, which might result in a fire. From the metal microscope analysis of a damaged condenser terminal, it was found that the amorphous structure unique to copper cable disappeared, and voids, boundary surface and disorderly fine particles occurred. Also, in the case of the connector into which moisture penetrated, fusion and deformation occurred at the cable connection clips. The result of analysis of the power supply cable connector using a thermal image camera showed that most of the heat was generated from the cable connection clips and the temperature at the connection center was normal.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.30-34
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• 2023

Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• 대한기계학회논문집A
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• 제34권9호
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• pp.1305-1310
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• 2010

복잡한 시스템 계의 설계정보를 효과적으로 추출하기 위해서 형상최적설계가 수행되는 경우, 일반적으로 유한요소해석 기법과 D-최적배열을 이용한 실험계획법이 연동된 반응표면모델을 구성하고 여기에 최적설계기법이 적용된다. 그러나, 설계변수에 형상공차와 같은 변동성이 존재하면 최적해의 강건성 확보를 위하여 설계변수의 형상공차를 확률론적인 변동성으로 고려한 추가적인 강건설계가 필요하다. 본 연구에서는 계산시간이 많이 소요되는 유한요소해석에 의한 강건설계문제에 설계변수의 표준정규분포를 고려한 반응표면모델을 구축하여 최적설계를 수행하므로서 손쉽게 강건최적값을 구하는 방법을 제안하였다. 승용차용 브레이크 디스크에 제안된 방법을 적용하여 열변형과 중량을 최소화하는 설계변수의 강건최적해를 구하고, 몬테카를로 시뮬레이션 추정결과와 비교하여 이의 적합성을 검증하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.301-301
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• 2003

In current study, Nanocomposites are reinforced with carbon nanofiber, carbon nanotube and SiC, etc. Since the nano reinforcements have the excellent mechanical, thermal and electrical properties compared with that of existing composites, it has lately attracted considerable attention in the various areas. Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties. Until now, strengthening of the copper alloy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the alloy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conducting material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the cooer matrix composites of high strength and electric conductivity. In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process and align mechanism as well as optimized drawing process parameter are verified via numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of 10∼20$\mu\textrm{m}$ in length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper. it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber Optimal parameter for drawing process was obtained by analytical and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc. The lower drawing angles and lower reduction areas provides the less rupture of co tube is noticed during the drawing process and the better alignment of carbon nanofiber is obtained.

• 한국잠사곤충학회지
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• 제41권1호
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• pp.48-53
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• 1999

불용성 세리신을 가수분해하기 위해 염산 수용액을 이용하여 농도 및 시간별로 처리하여 처리조건이 가수분해에 미치는 영향에 대해 관찰되었다. 가수분해 후 분말화하여 분자량 분포와 분자량 및 백도를 측정하였고, 아미노산 분석을 통하여 세리신의 아미노산 조성의 변화를 시험하여 다음과 같은 결과를 얻었다. 염산 가수분해시 0.5N HCl보다 1N 처리시의 용해도가 5%가량 높았고, 처리 시간이 경과할수록 용해도가 증가하고, 6시간 이상의 처리에서는 그 증가폭이 크지않았다. 가수분해된 세리신의 전기영동 결과는 인정할만한 특정밴드는 나타나지 않았으며 분자량 6,000~20,000 사이에 많이 분포하는 것을 알았다. 가수분해된 세리신의 평균 중합도를 측정한 결과 4.2~5.9이었으며, 이를 분자량으로 환산하면 각각 470~670정도가 된다. 백도는 가수분해 시간이 경과할수록 감소하였다. 가수분해된 세리신의 아미노산 분석시 세리신 가수분해물은 220$^{\circ}C$ 부근의 열변성 피크와 330$^{\circ}C$ 부근의 열분해 피크에서 흡열 피크가 관찰되었다.

• 대한기계학회논문집B
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• 제37권1호
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• pp.35-41
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• 2013

금형온도는 사출성형시 수지의 유동특성이나 성형품의 변형에 영향을 미치는 중요한 변수로서, 고온의 수지 주입과 냉각회로에 주입되는 냉각수의 영향을 받아 사출 사이클이 반복될수록 온도의 상승과 하강이 반복되는 주기적인 변화특성을 가지고 있다. 본 연구에서는 금형 냉각회로에 저온과 고온의 유체를 번갈아 주입하는 가변 금형온도 제어기법을 적용하여 성형전에는 금형온도를 높게 유지하고 성형후에는 낮게 유지함으로써 사출성형시 품질과 생산성을 동시에 높일 수 있는 연구를 수행하였다. 특히 열전달-유동해석을 연계한 다중사이클 사출성형 과도해석을 수행하여 수지와 금형, 냉각수간의 과도적인 온도변화를 수치적으로 고찰하였고, 기존 냉각방법과의 해석결과를 비교하여 제안된 가변 금형온도 제어기법의 가열 및 냉각과정에서의 효율성을 비교하였다.

• 소성∙가공
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• 제20권4호
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• pp.316-323
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• 2011

The hot curvature-forming of large aluminum thick plate using a grid-typed hybrid die is a process for the production of a spherical LNG tank. Many variables such as the initial die surface quality, grid size, grid thickness, size of blank plate and cooling line design, control the success of the process. In addition, the plate used in this process is generally larger than $10{\times}10m$ in size. Thus, it is very difficult to predict the surface characteristics of the plate during forming and to measure the different parameters due to the high cost of the experiments. In order to optimize the process design for the grid-type die, the development of an analytical method to predict the surface characteristics of the final product in hot curvature-forming is needed. This paper described the development of the method and procedures for FE simulations of the hot curvature-forming process, including hot forming, air flow, cooling, and thermal deformation analyses. An experiment for a small scale model of the process was conducted to check the validity of the numerical method. The results showed that the curvature of the plate in the analysis agrees well with that of the experiment within 0.037 and 0.016% tolerance margins for its side and corner, respectively.

• 소성∙가공
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• 제23권5호
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• pp.289-296
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• 2014

Uniaxial tensile tests were conducted to accurately evaluate the in-plane mechanical properties of fiber metal laminates (FMLs). The FMLs in the current study are comprised of a layer of self-reinforced polypropylene (SRPP) sandwiched between two layers of aluminum alloy 5052-H34. The nonlinear tensile behavior of the FMLs under in-plane loading conditions was investigated using both numerical simulations and a theoretical analysis. The numerical simulation was based on finite element modeling using the ABAQUS/Explicit code and the theoretical constitutive model was based on the volume fraction approach using the rule of mixture and a modification of the classical lamination theory, which incorporates the elastic-plastic behavior of the aluminum alloy and the SRPP. The simulations and the model are used to predict the inplane mechanical properties such as stress-strain response and deformation behavior of the FMLs. In addition, a post-stretching process is used to reduce the thermal residual stresses before uniaxial tensile testing of the FMLs. Through comparison of both the numerical simulations and the theoretical analysis with the experimental results, it is concluded that the numerical simulation model and the theoretical approach can describe with sufficient accuracy the actual tensile stress-strain behavior of the FMLs.

• 한국추진공학회지
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• 제2권1호
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• pp.31-40
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• 1998

고강도 알루미늄 대형 링롤재의 급냉 및 요소제거 후 발생하는 잔류응력을 2차원 및 3차원 유한요소 해석하였고, 3단계 절단법에 의해 측정된 변형율과 ABAQUS의 요소제거 기능을 이용한 해석값을 직접 비교하였다. 급냉후 잔류응력 해석결과는 2단 과시효후 측정값과 비슷한 경향을 보였으나 그 절대값의 차이가 크게 나타났다. 이는 링 시편의 높이가 작아 측정값이 부정확하였기 때문이며, 링의 높이를 증가시켜 높이방향으로 균일한 응력분포를 갖도록 하면 그 차이가 감소될 것으로 판단된다. 잔류응력을 측정하는 3단계 절단 과정을 모사한 3차원 해석결과와 측정된 변형율을 직접 비교함으로써 실험과 해석의 정확성을 향상시킬 수 있도록 하였다. 이로부터 잔류응력이 내재하고 형상이 복잡한 대형 알루미늄 구조물의 기계가 공에 의한 변형을 정확히 예측할 수 있는 기반을 마련하였다.