• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.115-115
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• 1997

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.924-927
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• 2007

In this study, adaptation of two-way shape memory effect of SMA wire to the actuator is examined. Therefore the SMA characteristics which are training, material properties, response time at different thermal cycling rates are tested. During training, permanent deformation is accumulated till a certain number of cycle and then saturated. The amount of two-way strain is unchangeable over all cycle and the slope of strain(or stress)-temperature curve is slower as the increase of applied stress. The rate effect is observed resulted from the thermal distribution which heating profile differs from cooling as thermal cycling time. Using the estimated SMA properties, an experimental test for the simple smart wing is performed.

• 한국신재생에너지학회:학술대회논문집
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• 2011.11a
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• pp.62.2-62.2
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• 2011

To guarantee 20-25 years to the lifetime of the PV modules without failure, reliability test of the module is very important. Field-aged test of the outdoor environment is required. However, due to time constraints, accelerated testing is required to predict the lifetime of PV modules and find causes of failure. Failure is caused by many complex phenomena. In this study, we experimented two accelerated tests about corrosion and fatigue, respectively. First, temperature cycling test for fatigue were tested and Coffin-Manson equation was analyzed. Second, damp heat test for corrosion were tested and Eyring equation were analyzed. Finally, using two-mode failure model, we suggest a new lifetime model that analyze the phenomenon by combining two kinds of data.

• Journal of Powder Materials
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• v.29 no.6
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• pp.505-510
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• 2022

The thermal shock resistance of cement composites with hollow glass microspheres (HGM) is investigated. Cement composites containing various concentrations of HGM are prepared and their properties studied. The density, thermal conductivity, and coefficient of thermal expansion of the composites decrease with increasing HGM concentration. A thermal shock test is performed by cycling between -60 and 50℃. After the thermal shock test, the compressive strength of the cement composite without HGM decreases by 28.4%, whereas the compressive strength of the cement composite with 30 wt% HGM decreases by 5.7%. This confirms that the thermal shock resistance of cement is improved by the incorporation of HGM. This effect is attributed to the reduction of the thermal conductivity and coefficient of thermal expansion of the cement composite because of the incorporation of HGM, thereby reducing the occurrence of defects due to external temperature changes.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.452-460
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• 2018

This study investigate changes in mechanical behaviors such as indentation load-displacement and hardness of thermal barrier coatings (TBCs) using cycling of thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/super alloy are prepared using different starting granules, 204C-NS and 204NS commercial powers, and the effect of double layers of 204C-NS on 204NS and 204NS on 204C-NS are investigated. The highest temperature applied during thermal shock test is $1100^{\circ}C$ and the maximum number of cycles is 1,200. The results indicate that bilayered TBC showed a relatively mechanically resistant property during thermal shock cycles and that the mechanical behavior is influenced by the microstructure of TBCs by exposure to high temperature during tests or different starting granules.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.48.1-48.1
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• 2011

In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.670-680
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• 1994

The thermophysical properties of Non-Newtonian fluid as the function of the temperature and the concentration are needed in many rheological heat transfer and fluid mechanics problems. The present work investigated the effects of the concentration and the temperature on the thermophysical properties of purely-viscous Non-Newtonian fluids such as the isobaric thermal expansion coefficient, density, zero-shear-rate viscosity, and zero-shear-rate dynamic viscosity within the experimental temperature range from $25^{\circ}C$ to $55^{\circ}C$. The densities of the test fluids were determined as the function of the temperature by utilizing a reference density and the least square equation for the measured isobaric thermal expansion coefficient. As the concentration of purely-viscous Non-Newtonian fluid was increased up to 10,000 wppm, the densities were proportionally increased up to 0.4%. The zero-shear-rate viscosities of test fluids were measured before and after the measurements of the first thermal expansion coefficients and the densities of Non-Newtonian fluid. Even though they were changed up to approximately 22% due to thermal aging and cycling, they had no effects on the thermal expansion coefficients and the densities of Non-Newtonian fluid. The zero-shear-rate dynamic viscosities for purely-viscous Non-Newtonian fluids were compared with the values for distilled water. They showed the similar trend with the zero-shear-rate viscosities due to small differences in the densities for both distilled water and purely-viscous Non-Newtonian fluid.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.266-275
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• 2018

Herein, a novel operating life (OL) test method was evaluated with 200 mAh pouch-type lithium-ion batteries. By combining the calendar life (CL) test with intermediate pulse power cycling, more realistic life prediction was possible, which encompassed real operation of batteries accompanying with thermal acceleration. Larger capacity decrease and resistance increase of pouch cell were observed in the OL test, which was well explained using the SEI film growth model. After dissemble of pouch cell, capacity loss and resistance increase mostly occurred within anode, reflecting that SEI film growth on anode surface was highly attributable to cell degradation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.258-261
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• 1997

The sealing integrity is related to the safe operation of arrester the prime failure reason of porcelain housed arresters is moisture ingress. To be a meaningful tests a polymer arrester sealing test must be a realistic acceleration of field service. We think the test should be an accelerating course of actual temperatures, the enduring property to mechanical load and temperatures should be considered together. A union test method consisting of the thermal mechanical test and thermal cycling test is proposed to test the sealing integrity of polymeric arresters, which uses dielectric loss, leakage current 1mA DC voltage and partial discharge as the diagnostic techniques, and the test results were presented. The comparison states that the TMTCUT method is suitable fur the test of sealing integrity of polymeric arresters. .