• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 추계학술발표대회 논문집
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• pp.79-82
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• 2005

In this study, mechanical properties of carbon fabrics composite under the thermal shock cycling were evaluated. Due to the interactions between fiber and polymer matrix, it is reasonable to conclude that both thermal cycles of thermal shock result in improvement of interlaminar shear strength(ILSS) for the longer conditioning time duration. The rise in ILSS may be attributed to the improved adhesion by cryogenic compressive stress and also by the post-curing strengthening effect. However, the flexural and tensile strength were decreased with increasing conditioning time of thermal cycle.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2018년도 추계학술논문요약집
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• pp.125-126
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• 2018

• 한국진공학회지
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• 제21권3호
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• pp.178-184
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• 2012

니켈촉매 막을 증착시킨 산화규산 기판 위에 아세틸렌기체와 수소기체를 원료기체로 육불화황기체를 첨가기체로 사용하여 열화학기상증착 방법으로 탄소코일을 합성하였다. 첨가기체의 유량과 아세틸렌/육불화황 기체들의 싸이클릭 on/off 유량 변조에 따라 성장된 탄소코일의 특성(형성 밀도, 형상)을 조사하였다. 육불화황의 기체 유량이 가장 낮은 경우(5 sccm)에서, 2분동안 육불화황을 주입하여 아세틸렌/육불화황 기체를 싸이클릭 on/off 유량 변조시킴에 따라 탄소코일을 형성시켰다. 반면 육불화황을 5분 동안 연속적으로 주입한 경우에서는 탄소나노필라멘트 형상이 나타나지 않았다. 육불화황의 유량이 5 sccm에서 30 sccm으로 증가함에 따라 아세틸렌/육불화황 기체들의 싸이클릭 on/off 유량 변조는 탄소코일의 형상을 나노크기의 형태로만 제한시켰다. 육불화황 기체의 플로린 종에 의한 에칭 특성이 이러한 효과를 주게 하는 것으로 이해되었다.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Journal of Welding and Joining
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• 제17권6호
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Corrosion Science and Technology
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• 제7권2호
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• pp.69-76
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• 2008

Common methods for large scale hydrogen production, such as steam reforming and coal gasification, also involve production of carbonaceous gases. It is therefore necessary to handle process gas streams involving various mixtures of hydrocarbons, $H_2$, $H_2O$, CO and $CO_2$ at moderate to high temperatures. These gases pose a variety of corrosion threats to the alloys used in plant construction. Carbon is a particularly aggressive corrodent, leading to carburisation and, at high carbon activities, to metal dusting. The behaviour of commercial heat resisting alloys 602CA and 800, together with that of 304 stainless steel, was studied during thermal cycling in $CO/CO_2$ at $650-750^{\circ}C$, and also in $CO/H_2/H_2O$ at $680^{\circ}C$. Thermal cycling caused repeated scale separation, which accelerated chromium depletion from the alloy subsurface regions. The $CO/H_2/H_2O$ gas, with $a_C=2.9$ and $p(O_2)=5\times10^{-23}$ atm, caused relatively rapid metal dusting, accompanied by some internal carburisation. In contrast, the $CO/CO_2$ gas, with $a_C=7$ and $p(O_2)=10^{-23}-10^{-24}$ atm caused internal precipitation in all three alloys, but no dusting. Inward diffusion of oxygen led to in situ oxidation of internal carbides. The very different reaction morphologies produced by the two gas mixtures are discussed in terms of competing gas-alloy reaction steps.

• BMB Reports
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• 제28권4호
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• pp.359-362
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• 1995

The highly polymorphic variable number of tandem repeat (VNTR) loci in the human genome are informative markers for the genetic characterization of individuals in the paternity test and forensic science as well as for the study of human disease. In this study, VNTR loci D1S80 and D2S123 have been amplified by PCR and the amplified length polymorphic alleles were detected with a discontinuous vertical PAGE system and silver staining. For explicit DNA typing, PCR optimization, in which amplification efficiencies are similar over a wide range of allele sizes, non-specific amplifications are minimal, and new longer alleles have high amplification efficiency, has been performed by changing the PCR reaction buffer composition and thermal cycling conditions. It turned out that adding an appropriate amount of Tween 20 and NP40 to the PCR reaction buffer and raising the annealing temperature to $68^{\circ}C$ in thermal cycling made it possible for optimal VNTR loci amplification. A modified PAGE system for VNTR separation was established. Under these conditions, new longer alleles in the 01580 locus were discovered and 025123 pattern changes in colorectal tumors were observed. These technical tips are valuable for detecting various amplified fragment length polymorphisms.

• Journal of Welding and Joining
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• 제20권2호
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 한국재료학회지
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• 제4권3호
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• pp.334-338
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• 1994

Pb-Sn eutectic bulk specimens을 thermal cycling동안 electronic package의 땜납이 격게되는 변형 조건 즉 $10^{-3}-10^{-5}$/s정도의 낮은 frequency와 0.2-1%정도의 적당한 strain range에서 피로파괴 실험을 했을때, grain boundary sliding과 관련하여 임계면을 따라 일어나는 균열이 5단계에 의해 묘사될 수 있다는 것을 보였음.

• 한국재료학회지
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• 제4권3호
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• pp.329-333
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• 1994

1시간 주기로 -$35^{\circ}C$에서 +$125^{\circ}C$까지의 온도 변화에 지배되는 Leadless Ceranic Chip Carriers(LLCC'S)의 Solder접합부에서 균열이 계면을 따라 일어났다. 이런 균열이 계면을 취약하게 하는 어떤 불순물에 의한 것이 아닌지를 Scanning Auger Microprobe(SAM)을 이용해 조사했다. 그 결과 계면을 따라 일어나는 균열이 계면의 산화에 의해 일어날 수 있다는 것이 발견되었고, 그에 따라 산화에 취약해진 계면을 따라 일어나는 이런 종류의 피로 파괴현상에 대한 모델을 제시했다.