• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1692-1696
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• 2004

This paper presents the thermally induced hot spot characteristics of rubbing surface in the friction pad disk brake. During the braking period, the rubbing surface with irregular asperities that are strongly engaged in rough surface, wear, and deformed surface due to a friction heating may produce an irregular distorted geometry of the disk surface. The tribological interactions between the disk and the pads are unstable if the contact stress is severe, in which the irregularity develops the contact pressure distribution, leading eventually to localized contact, high temperature and formation of hot spots. The computed results of contact spots that are simulated using a coupled thermal-mechanical analysis present sinusoidal distortions and localized extrusions of the disk surface, which are strongly related to a hot spot in the practical disk brake.

• Journal of the Korean Society of Safety
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• v.34 no.5
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• pp.22-30
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• 2019

In 2018, overload, overcurrent, insulation aging, and a contact failure caused 659 electric fires. There is almost no failure of electrical socket outlets during their manufacturing or installation period. After several months or several years, overload or overcurrent of electrical socket outlets leads to a contact failure or short circuit which causes an electric fire. Therefore, this paper analyzed for thermal characteristics based on a current value and the change in insulation resistance along with a temperature rise caused by electrical socket outlets and the state of laboratory use in workplaces. As a results, regarding the thermal characteristics based on the current value of each installation year, a temperature increase was related to a current value, an installation year, and whether the contact unit is corroded. Insulation resistance began to decrease when a temperature increased to a certain level. With a lapse of installation year, the temperature at which insulation resistance began to decrease was lowered. This paper can be applicable for the survey data about electrical socket outlet induced fire accidents and management guidelines.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.34-40
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• 2012

We have developed a highly sensitive inspection technique based on an electron beam inspection for detecting the contact failure of a poly-Si plugged layer. It was difficult to distinguish the contact failure from normal landing plugs with high impedance. Normally, the thermal annealing method has been used to decrease the impedance of poly-Si plugs and this method increases the difference of charged characteristics and voltage contrast. However, the additional process made the loss of time and broke down the device characteristics. Here, the interval scanning method without thermal annealing was effectively applied to enhance the difference of surface voltage between well-contacted poly-Si plugs and incomplete contact plugs. It is extremely useful to detect the contact failures of non-annealed plug contacts with high impedance.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.45 no.12
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• pp.1021-1030
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• 2017

This paper describes the algorithm of computing thermal contact conductance between unmatched grid interfaces for finite element thermal analysis. Because grid interfaces should be coincident with adjacent meshes for finite element method, large amount of man hours and huge computations are required to match interfaces between many numbers of complex subdomains. A novel method that distributes feasibly the conductances to interface nodes is proposed. The aims of the method are described, and details of the nodal conductance distribution algorithm with less dependency on meshes are represented. The algorithm can be applied both the flat and curved interfaces in 3 dimensional space, and proposed method can combined with many finite element application including thermal analysis.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.

• Journal of Institute of Convergence Technology
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• v.2 no.1
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• pp.38-42
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• 2012

A scroll compressor used in the air conditioning in automobile consists of the fixed scroll and the orbiting scroll. Temperature gradient in the scroll compressor during the operation induces the thermal expansion of two scrolls. Therefore, the gap between scrolls in the initial stage is regarded as an important variable in structural design of the scroll compressor. The coupled thermal-stress analysis was carried out for the scrolls of a scroll compressor. The temperatures of major points of two scrolls in the steady states were referred by the literature of C. Lin. The sequentially coupled thermal-stress analysis is utilized to the heat transfer analysis and the thermal expansion analysis. In the thermal expansion analysis, the contact analysis was considered between the fixed and the orbiting scrolls in order to obtain the penetration distance and the contact pressure between two scrolls. The range of deformation was from 44 to $76{\mu}m$ according to the height of the scroll. The maximum penetration distance of $60{\mu}m$ occurred at the top surface of the fixed scroll in the center of the scroll parts.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.3
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• pp.237-242
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• 2013

This paper proposes a thermal peripheral blood flowmeter integrated with a force sensor that is capable of contact force compensation. We fabricate this blood flowmeter using a nickel RTD (resistance temperature detector) and piezoresistive force sensor by using microfabrication technology. In an experiment, we obtained a decreasing trend for the blood flow under an increasing contact force with a linear tendency of 31.7%/N. We then performed a compensation process based on this obtained trend. As a result, the maximum variance in the blood flow at 1-3N was 9.8%. Thus we achieved consistent blood flow measurement independent of the contact force. In this work, we verified that the thermal blood flowmeter integrated with a force sensor has the ability to accurately measure the blood flow independent of the contact force.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.18-20
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• 2010

The mechanism for suppression of Ag agglomeration in Ag-Mg alloy ohmic contact to p-GaN is investigated. The Ag-Mg alloy ohmic contact shows low contact resistivity of $6.3\;{\times}\;10^{-5}\;{\Omega}cm^2$, high reflectance of 85.5% at 460 nm wavelength after annealing at $400^{\circ}C$ and better thermal stability than Ag contact The formation of Ga vacancies increase the net hole concentration, lowering the contact resistivity. Moreover, the oxidation of Mg atoms in Ag film increase the work function of Ag-Mg alloy contact and prevents Ag oxidation. The inhibition of oxygen diffusion by Mg oxide suppresses the Ag agglomeration, leading to enhance light reflectance and thermal stability.

• Transactions of Materials Processing
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• v.12 no.1
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• pp.18-25
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• 2003

This paper explains the process design for improving tool life in the conventional hot forging process. The thermal load and the thermal softening are happened by contact between the hotter billet and the cooler tools in hot forging process. Tool life decreases considerably due to the softening of the surface layer of a tool was caused by a high thermal load and long contact time between the tools and the billet. Also, tool life is to a large extent limited by wear, heat crack and plastic deformation in hot forging process. Above all, the main factors which affect die accuracy and tool life we wear and the plastic deformation of a tool. The newly developed techniques for predicting tool life are applied to estimate the production quantity for a spindle component and these techniques can be applied to improve the tool life in hot forging process.