• Title/Summary/Keyword: Thermal Contact

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Formation of ITO ohmic contact to $n^{+}$-InP for InP/lnGaAs HPT's fabrication (InP/AnGaAs HPT's 제작을 위한 $ITO/n^+$-InP Ohmic contact 특성 연구)

  • 황용한;한교용
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.213-216
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    • 2001
  • The use of a thin film of indium between the ITO and the $n^{+}$-InP contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. ITO/$n^{+}$-InP ohmic contact was successfully achieved by the deposition of Indium and thermal annealing. The specific contact resistance of about 6.6$\times$$10^{-4}$$\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to ITO/$n^{+}$-InP contact without the deposition of Indium between ITO and $n^{+}$-InP, it exhibited schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with that of InP/InGaAs HBTs with the opaque emitter contacts.

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Prediction of Poor Contact by Analysis of Electrical Signal and Thermal Characteristics (전기적 신호와 열적특성 분석에 의한 접촉불량 예측)

  • Lee, Heung-Su;Kim, Doo-Hyun;Kim, Sung-Chul;Kim, Yoon-Bok
    • Journal of the Korean Society of Safety
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    • v.27 no.3
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    • pp.36-41
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    • 2012
  • Electrical Connections often cause fires due to poor contact. Occurrence rate of these fires tends to increase annually. The reason why poor contacts occur is often because it is the low mechanical pressure at the contact points. A typical connection method using mechanical pressure is a screw terminal type. This study reviewed these poor contact cases in the screw terminals. In order to get reproduction of such cases, two types of experiments were conducted. the first one was conducted under the normal contact condition, and the other one was conducted under the poor contact condition that screw terminal of breaker was loosen and did not meet the requirements of toque value. In both types of experiments, compulsory vibration was adopted as a variable to aggravate poor contacts. Each of various current values(4.5A, 9.0A, 13.5A) is input. In these experiments, relationships of a contact, electrical signal such as current and electric pulse by ZCT and thermal characteristics according to vibration effect are analyzed. The suggested data and results in this study provide the useful resources helping to investigate fires due to poor contact, and they develop the detector for poor contact and finally reduce the electrical fire occurrence rate.

A Study on the Thermal Behavior Characteristic of Drum Brake considering Braking Patterns (제동 패턴을 고려한 드럼 브레이크의 열적 거동 특성에 대한 연구)

  • Lee, Kye-Sub;Son, Sung-Soo;Yang, Ki-Hyun
    • Transactions of the Korean Society of Automotive Engineers
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    • v.14 no.5
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    • pp.145-154
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    • 2006
  • Each part of drum brake system is loaded by continual mechanical force and thermal force every time of braking, so enough strength and stability are required. Thermal characteristic is one of the important factors in drum brake systems design. This paper presents the thermal performance such as temperature distribution and thermal contact stress of drum brake system considering several braking patterns; 80th heat braking test mode, heat fade braking test mode, general road mode, steep slope road mode and off road mode. Transient heat transfer analysis and Thermo elastic contact analysis is executed to obtain the temperature distribution, and to evaluate thermal stress of drum brake by using ABAQUS/Standard code. This procedure of analysis can effectively be used to improve the quality problem of brake system and to get design guideline of the new product.

Failure Analysis of Commercial Water-Repellent Coatings for High Temperature Plant (플랜트 부품용 상용 발수코팅의 고온 환경 고장 특성 비교 분석)

  • Lee, Byung-Ho;Kim, Hye-young;Hyeon, Chang-young;Byeon, Jai-Won
    • Journal of Applied Reliability
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    • v.17 no.1
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    • pp.78-82
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    • 2017
  • Purpose: The purpose of this study is to evaluate failure characteristic and mechanism of four commercial water-repellent coatings for elevated temperature machinery applications. Method: Thermal degradation was performed for up to 64 thermal cycles. 1 cycle consists of 15 minute holding at 523K under 300rpm revolution and 15 minute-natural cooling. Contact angle was measured and microstructure of the coating layer was observed by using a scanning electron microscope. Results: Four kinds of commercial repellent coating showed hydrophobic or super-hydrophobic property implying that all coatings are suitable for room temperature application. Contact angle of three kinds of commercial coatings decreased rapidly after thermal exposure, while only one specimen having hydrophobic surface showed extremely slow degradation. Conclusion: Observed decrease in contact angle of the coatings were attributed to formation of macro-sized pores and disappearance of micro-protrusion during thermal exposure. Optimum water-repellent coating needs to be selected under the consideration of initial contact angle as sell as service temperature.

A study on Au-Sn alloy plating layer improving reliability of electrical contacts (전자부품 커넥터의 접속 신뢰성 향상을 위한 Au-Sn 합금 도금층 연구)

  • Choi, Jong Hwan;Son, Injoon
    • Journal of the Korean institute of surface engineering
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    • v.55 no.6
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    • pp.408-416
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    • 2022
  • In this study, the effect of Au-Sn alloy coating on reliability of electrical contacts was investigated via comparison with Au-Co alloy coating. The results show that Au-Sn alloy exhibited lower contact resistance and higher solder spreadability than those of Au-Co alloy after thermal aging. In the case of Au-Co alloy plating, the underlying Ni element diffused into Au-Co layer to form Ni oxides on surface during thermal aging, leading to increased contact resistance and decreased solder spreadability. Meanwhile, for Au-Sn alloy plating, Au-Ni-Sn metallic compound was formed at the interface between Au-Sn layer and underlying Ni layer. This compound acted as a diffusion barrier, thereby inhibiting the diffusion of Ni to Au-Sn layer during thermal aging. Consequently, Au-Sn alloy layer showed better contact reliability than that of Au-Co alloy layer.

A Study on the Contact Fatigue Life Evaluation for Railway Wheels Considering Residual Stress Variation (잔류응력 변화를 고려한 철도차량 차륜의 접촉피로 수명평가)

  • Seo, Jung-Won;Goo, Byeong-Choon;Choi, Jae-Boong;Kim, Young-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.9
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    • pp.1391-1398
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    • 2004
  • Railway wheels and axles belong to the most critical components in railway vehicles. The service conditions of railway vehicles became more severe in recent years due to the increase of speed. Therefore, a more precise evaluation of wheelset life and safety has been requested. Wheel/rail contact fatigue and thermal cracks due to braking heat are two main mechanisms of the railway wheel failure. In this paper, an evaluation procedure for the contact fatigue life of railway wheel is proposed. One of the main sources of the contact zone failure is the residual stress. The residual stress on wheel is formed during the manufacturing process which includes a heat treatment, and then is changed by contact stress developed by wheel/rail contact and thermal stress induced by braking. Also, the cyclic stress history for fatigue analysis is determined by applying finite elements analysis for the moving contact load. The objective of this paper is to estimate fatigue life by considering residual stress due to heat treatment, braking and repeated contact load, respectively.

The Electrical Roperties of TiN/$TiSi_2$ Bilayer Formed by Rapid Thermal Anneal at Submicron Contact (급속열처리에 의한 TiN/$TiSi_2$ 이중구조막을 이용한 submicron contact에서의 전기적 특성)

  • 이철진;성만영;성영권
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.9
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    • pp.78-88
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    • 1994
  • The electrical properties of TiM/TiSi$_{2}$ bilayer formed by rapid thermal anneal in NH$_{3}$ ambient after the Ti film is deposited on silicon cubstrate are investigated. N$^{+}$ contact resistance slightly increases with increasing annealing temperature with P$^{+}$ contact resistance decreases. The contact resistance of N$^{+}$ contance was less than 24[.OMEGA.] but P$^{+}$ thatn that of N$^{+}$ contact but the leakage current indicates degradation of the contact at high annealing temperature for both N$^{+}$ and contacts. The leakage current of N$^{+}$ Junction was less than 0.06[fA/${\mu}m^{2}$] but P$^{+}$ contact was 0.11-0.15[fA/${\mu}m^{2}$]. The junction breakdown voltage for N$^{+}$ junction remains contant with increasing annealing temperature while P$^{+}$ junction slightly decreases. The Electrical properties of a two step annealing are better than that of one step annealing. The Tin/TiSi$_{2}$ bilayer formed by RTA in NH$_{3}$ ambient reveals good electrical properties to be applicable at ULSI contact.

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A Molecular Simulation on the Adhesion Control of Metal Thin Film-Carbon Nanotube Interface based on Thermal Wetting (Thermal wetting 현상이 탄소나노튜브-금속박막 계면의 응착력에 미치는 영향에 관한 분자 시뮬레이션 연구)

  • Sang-Hoon Lee;Hyun-Joon Kim
    • Tribology and Lubricants
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    • v.39 no.1
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    • pp.8-12
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    • 2023
  • This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

Effect of Rapid Thermal Annealing on the Ti doped In2O3 Films Grown by Linear Facing Target Sputtering

  • Seo, Ki-Won;Kim, Han-Ki
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.342.1-342.1
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    • 2014
  • The electrical, optical and structural properties of Ti doped $In_2O_3$ (TIO) ohmic contacts to p-type GaN were investigated using linear facing target sputtering (LFTS) system. Sheet resistance and resistivity of TIO films are decreased with increasing rapid thermal annealing (RTA) temperature. Although the $400^{\circ}C$ and $500^{\circ}C$ annealed samples showed rectifying behavior, the $600^{\circ}C$ and $700^{\circ}C$ annealed samples showed linear I-V characteristics indicative of the formation of an ohmic contact between TIO and p-GaN. The annealing of the contact at $700^{\circ}C$ resulted in the lowest specific contact resistivity of $9.5{\times}10^{-4}{\Omega}cm^2$. Based on XPS depth profiling and synchrotron X-ray scattering analysis, we suggested a possible mechanism to explain the annealing dependence of the properties of TIO layer on rapid thermal annealing temperature.

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