• Proceedings of the Korean Fiber Society Conference
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• 1992.06b
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• pp.9-9
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• 1992

• Proceedings of the KWS Conference
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• 1997.10a
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• pp.125-127
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.121-121
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• 1996

• 한국전자현미경학회:학술대회논문집
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• 2004.05a
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• pp.93-93
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• 2004

• Proceedings of the KWS Conference
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• 1993.10a
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• pp.110-113
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• 1993

• Proceedings of the KWS Conference
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• 1990.11a
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• pp.140-144
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• 1990

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Journal of Sensor Science and Technology
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• v.13 no.3
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• pp.195-198
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• 2004

For a diffusion barrier against copper, tantalum nitride films have been deposited on $SiO_{2}$ by atomic layer deposition (ALD), using PEMAT(Pentakis(ethylmethylamino)tantalum) and $NH_{3}$ as precursors, Ar as purging gas. The deposition rate of TaN at substrate temperature $250^{\circ}C$ was about $0.67{\AA}$ per one cycle. The stability of TaN films as a Cu diffsion barrier was tested by thermal annealing for 30 minutes in $N_{2}$ ambient and characterized through XRD, sheet resistance, and C-V measurement(Cu($1000{\AA}$)/TaN($50{\AA}$)/$SiO_{2}$($2000{\AA}$)/Si capacitor fabricated), which prove the TaN film maintains the barrier properties Cu below $400^{\circ}C$.

• International Journal of Human Ecology
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• v.3 no.1
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• pp.55-72
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• 2002

The purpose of this study was to evaluate the thermal resistance of pesticideprotective clothing and to investigate its subjective wear performance. Three different nonwoven fabrics, which provide barrier properties against water and pesticide, were used to manufacture the experimental clothing: spunbonded nonwoven (SB), spunbonded/meltblown/spunbonded nonwoven (SM), and spunlaced nonwoven (SL). The thermal insulation values of the experimental clothing were measured with a thermal manikin, and other wear trials were performed on human subjects in a climate chamber at $28^{\circ}C$, with 70% R.H. and air movement at less than 0.15m/s. Our results found that the thermal resistance was lower in the SB experimental clothing than in the others; that the mean skin temperature of subjects who wore the experimental clothing made with SL was significantly lower than that of subjects who wore the SB and SM clothing; and that the microclimate temperature and humidity with SB were significantly higher than that of the others. Overall, the experimental clothing made with SL was more comfortable than the others in terms of subjective wear sensations.

• Journal of Welding and Joining
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• v.7 no.2
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• pp.25-34
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• 1989

The purpose of this work is to coat ZrO$_{2}$ - 8Y$_{2}$O$_{3}$ ceramic on the Al cast alloy(AC-8A) by using the plasma spray method. Two types of coatings which were composed of two and three layer coating were examined. Each coating powder was analyzed for shape and size distribution and X-ray diffraction pattern. For the coated layers, microstructural analysis and performance estimation which was composed of static thermal test, thermal cyclic test and thermal shock test were conducted.