• Journal of Biosystems Engineering
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• v.4 no.2
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• pp.53-63
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• 1979

The knowlege of thermal properties of rough rice has become of greate importance to the analysis of heat and mass transfer phenomenon in rice drying and storage process. Some information is available on the thermal properties of rough rice in foreign countries but is not available for these properties in Korea. A fundamental study was made to determine the thermal conductivity and thermal diffusivity of rough rice with line source method and to select current and resistance suitable for these properties from investigating the effect of current and resistance of heating wire on the temperature rise. The result of this study may be summarized as follows ; 1. Even through the power per unit length of heating wires is about the same, the tendency of temperature rise showed a little difference among them , and the suitable range of it for thermal properties was found to be 3.56-5.37w/m. 2. the most desirable resistance and current of heating wire was 18.40 ohm/m, 0.44 amperes among three kinds of heating wires and currents, respectively. because it took 13 minutes or so for the heating wire to reach equilibrium temperature. 3. The thermal conductivity of rough rice was 0.120-0.130 w/m$ ^\circ C$. and thermal diffusivity of it was $5.8210 $\times10^{-8} -9.7529 $\times10^{-8} m^2 /s.$ 4.The thermal conductivity showed a little difference in variation with resistance of heating wire but the variation of current of heating wire at the same resistance did not affect the thermal conductivity , and the thermal diffusivity was not affected by the variation of resistance and current.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.7
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• pp.512-520
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• 2007

The design of a ground-source heat pump system includes specifications for a ground loop heat exchanger where the heat transfer rate depends on the effective thermal conductivity of the ground and the effective thermal resistance of the borehole. To evaluate these heat transfer properties, in-situ thermal response tests on four vertical test boreholes with different grouting materials were conducted by adding a monitored amount of heat to circulating water. The line-source method is applied to the temperature rise in an in-situ test and extended to also give an estimate of borehole effective thermal resistance. The effect of increasing thermal conductivity of the grouting materials from 0.818 to $1.104W/m^{\circ}C$ resulted in overall increases in effective thermal conductivity by 15.8 to 56.3% and reductions in effective thermal resistance by 13.0 to 31.1%.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.9 s.240
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• pp.1065-1073
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• 2005

The thermal conductivity of water- and ethylene glycol-based nanofluids containing alumina $(Al_2O_3)$, zinc oxide (ZnO) and titanium dioxide $(TiO_2)$ nanoparticles is measured by varying the particle diameter and volume fraction. The transient hot-wire method using an anodized tantalum wire for electrical insulation is employed for the measurement. The experimental results show that nanofluids have substantially higher thermal conductivities than those of the base fluid and the ratio of thermal conductivity enhancement increases linearly with the volume fraction. It has been found that the ratio of thermal conductivity enhancement increases with decreasing particle size but no empirical or theoretical correlation can explain the particle-size dependence of the thermal conductivity. This work provides, for the first time to our knowledge, a set of consistent experimental data over a wide range of nanofluid conditions and can therefore serve as a basis for developing theoretical models to predict thermal conduction phenomena in nanofluids.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.12
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• pp.2202-2207
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• 2007

The present article investigates experimentally and theoretically thermal and optical characteristics of thin film structures through measurement of thermal conductivity of Pyrex 7740 and reflectance in silicon thin film. The $3{\omega}$ method is used to measure thermal conductivity of very thin film with high accuracy and the optical characteristics in thin films are studied to examine the influence of incidence angle of light on reflectance by using the CTM(Characteristics Transmission Method) and the 633 nm He-Ne laser reflectance measurement system. It is found that the estimated reflectance of silicon show good agreement with experimental data. In particular, the present study solves the EPRT(Equation of Phonon Radiative Transport) which is based on Boltzmann transport equation for predicting thermal conductivity of nanoscale film structures. From the results, the measured thermal conductivity is in good agreement with the previous published data. Moreover, thermal conductivities are estimated for different film thickness. It indicates that as film thickness decreases, thermal conductivity decreases substantially due to internal scattering.

• Journal of Korea Foundry Society
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• v.35 no.4
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• pp.67-74
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• 2015

In this study, Mg-Zn alloys are investigated in terms of their thermal properties after an addition of Cu. Al element is added to improve the mechanical properties and castability in general case. However, it was excluded here because it significantly decreases the thermal conductivity. On the other hand, Zn was added as a major element, which had less influence on reducing the conductivity and can complement the mechanical properties as well. Cu was also added, and it improved the heat transfer characteristics as the amount was increased. The composition ranges of Zn and Cu are 6 wt.% and 0~1.5 wt.%, respectively. Mg-6Zn-xCu alloy was prepared by a gravity casting method using a steel mold and then the thermal conductivity and the microstructure of the as-cast material were investigated. By measuring the density_(${\rho}$), specific heat_(Cp) and thermal diffusivity_(${\alpha}$), the thermal conductivity_(${\lambda}$) was calculated by the equation ${\lambda}={\rho}{\cdot}Cp{\cdot}{\alpha}$. As the amount of Cu increased in the Mg-6Zn-xCu alloy, the heat transfer characteristics were improved, resulting in a synergistic effect which is slow when the added Cu exceeds 1 wt.%. In order to investigate the relative thermal conductivity/emission of the Mg-6Zn-xCu alloy, AZ91 and AZ31 were experimentally evaluated and compared using a separate test equipment. As a result, the Mg-6Zn-1.5Cu alloy when compared to AZ91 showed improvements in the thermal conductivity ranging from 30 to 60% with a nearly 20% improvement in the thermal emission.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2465-2470
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• 2007

We have analyzed the three-dimensional thermal conduction in anisotropic materials using nonsymmetric-Fourier transforms. And a complete theoretical treatment of the photothermal deflection spectroscopy has been performed for thermal conductivity measurement in anisotropic medium. Thermal conductivity tensor was determined by the deflection angle and phase angle with the relative position between the heating and probe beams. The influence of the parameters, such as modulation frequency of the heating beam, the thermal conductivity tensor, was investigated.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.511-514
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• 2007

This study was performed to construct a geothermal data base about thermal conductivity of ground heat exchanger and thermal properties of grouting material which used to refill the borehole. We have acquired geothermal data sets from 39 sites over wide area of South Korea except to Jeju island. From data analysis, the range of thermal conductivity is $1.5{\sim}4.0$ W/mK. It means that thermal conductivity varies with grouting material as well as regional geology and ground water system.

• 한국컴퓨터산업교육학회:학술대회논문집
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• 2003.11a
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• pp.79-82
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.6
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• pp.923-928
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• 1986

A set of measurements has been made for the thermal conductivity of the pure paraffin in liquid and solid phases and for the effective thermal conductivity of the paraffin with metal scrap with the aid of the heat flux meter. Ther thermopile-type heat flux meter has been designed by steady state method and the functional relation between the temperature difference of both sides and heat flux has been obtained. The measured values of thermal conductivity are compared with the existing data for the pure paraffin and with the predicated values from the suggested model in which only one empirical constant is contained. The comparison within ten percent of the volume fraction of the metal scrap in the paraffin is satisfactory.

• The Korean Journal of Ceramics
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• v.3 no.1
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• pp.29-33
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• 1997

Four diamond films were deposited by the microwave plasma assisted chemical vapor deposition method varying CH4 concentration from 2.5 to 10% in the feeding gases. Thermal conductivity was measured on these free standing films by the steady state method from 80 K to 400K. They showed higher thermal conductivity as the film deposited with lower methane concentration. One exception, 7.79% methane concentration deposited film, was observed to be the highest thermal conductivity. Phonon scattering processes were considered to analyze the thermal conductivity with the full Callaway model. The grain size and the concentration of the extended and the point defects were used as the fitting parameters. Microstructure of diamond films was investigated with the scanning electron microscopy and Raman spectroscopy.