• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.788-795
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• 2008

An electrolyte supported SOFC cell was tested at $800^{\circ}C$ in air for 3600 h with an applied current density of $200\;mA/cm^2$ to examine possible cathode degradation issues. A scandium- stabilized zirconia (ScSZ) with additional manganese doping (ScSZ: Mn) was used as electrolyte. A strontium and copper-doped lanthanum ferrite (LaSrCuFe) and platinum were used as cathode and quasi-anode material, respectively. The DC resistance was logged over the complete testing period. Additionally, impedance spectroscopy was used from time to time to track changes of the cell in-situ. Post-test analysis of the cell using methods like scanning electron microscopy imaging and other electrochemical testing methods allow the identification of different degradation sources. The results indicate a promising combination of electrolyte and cathode material in terms of chemical compatibility and electrical performance.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.961-963
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• 2000

Most of the application standard of the low-voltage devices have applied one the IEC standard another the UL standard. European union applied the IEC60947-1 standard has not exceed 1000V a.c. or 1500V d.c.. Therefore. it is necessary to the low-voltage device has expended for rated operational voltage with our products. The export of European market shall be made for the CE-Marking in accordance with IEC60947-1 ( Low-voltage switchgear and controlgear). We shall be considered for the requirement with the IEC standard. In this time to study for power supply system at EU ( European union. At that time for design and development in order to the construction and test method among the study for the rated insulation voltage at less then 690V.

• Proceedings of the IEEK Conference
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• 2002.06a
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• pp.235-238
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• 2002

In this paper we describe the design and implementation of Electrical Ground Support Equipment(EGSE) for the CBS transponder testing. The main task of EGSE is to check out satellite systems, at system or subsystem level, during integration and validation phases of their life-cycle. Through a combination of hardware and software elements, EGSE supports manual, semi-automatic and fully automated testing. Automation is achieved by offering users simple, yet powerful means to write their own test application programs (test sequences) in high-level, test-oriented language and to run them in a strict real-time environment. The core of this environment is a user-configurable real-time database, containing all the information needed to calibrate acquired data, check them against predefined thresholds, automatically react to out-of-range conditions, display data using animated graphics or synoptic windows, and so on.

• The Transactions of the Korean Institute of Power Electronics
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• v.24 no.3
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• pp.191-200
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• 2019

This study proposes a hardware-in-the-loop simulation (HILS) system based on National Instruments' PXI platform to test power management and operation strategies for DC microgrids (MGs). The HILS system is developed based on the controller HIL prototype, which involves testing the controller board in hardware with a real-time simulation model of the plant in a real-time digital simulator. The system provides an economical and effective testing function for research on MG systems. The decentralized power management strategy based on the DC bus signaling method for DC MGs has been developed and implemented on the HILS platform. HILS results are determined to be similar to those of the off-line simulation in PSIM software.

• International Journal of Computer Science & Network Security
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• v.23 no.9
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• pp.157-161
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• 2023

Reliability is one of the computable quality features of the software. To assess the reliability the software reliability growth models(SRGMS) are used at different test times based on statistical learning models. In all situations, Tradational time-based SRGMS may not be enough, and such models cannot recognize errors in small and medium sized applications.Numerous traditional reliability measures are used to test software errors during application development and testing. In the software testing and maintenance phase, however, new errors are taken into consideration in real time in order to decide the reliability estimate. In this article, we suggest using the Weibull model as a computational approach to eradicate the problem of software reliability modeling. In the suggested model, a new distribution model is suggested to improve the reliability estimation method. We compute the model developed and stabilize its efficiency with other popular software reliability growth models from the research publication. Our assessment results show that the proposed Model is worthier to S-shaped Yamada, Generalized Poisson, NHPP.

• Journal of Information Technology Services
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• v.14 no.2
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• pp.129-142
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• 2015

The purpose of this study is to suggest an effective regression testing method in order to minimize the scope of test resulting from the modification of software and to prevent mismatch of test case and test objects. As a way to improve the efficiency of regression testing which uses a change-centric testing technique, the method flow is analyzed and grasped through a static analysis based on source code in order to identify modified parts. After the order of priority is set according to the results of user action log-based dynamic analysis on identified regression testing objects, test effect can be raised by adjusting the order of priority using code complexity. Quality assurance coverage can be checked using the user action log suggested in this study, and the progress of test and whether or not each function has been verified can be checked, too. In addition, by minimizing test parts and adjusting the order of test, costs and time can be saved, making it possible to conduct regression testing effectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.1C
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• pp.96-102
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• 2002

Current testing(Iddq testing) on monitoring the quiescent power supply current is an efficient and effective method for CMOS bridging faults. The applicability of this technique, however, requires careful examination. Since cardinality of bridging fault is O($n^2$) and current testing requires much longer testing time than voltage testing, it is important to note that a bridging fault is untestable if the two bridged nodes have the same logic values at all times. Such faults should be identified by a good ATPG tool; otherwise, the fault coverage can become skewed. In this paper, we present an object-oriented redundant fault detection scheme for efficient current testing. Experimental results for ISCAS benchmark circuits show that the improved method is more effective than the previous ones.

• Electronic Materials Letters
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• v.14 no.6
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• Journal of Internet Computing and Services
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• v.7 no.2
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• pp.151-160
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• 2006

Software quality evaluation system and software evaluation criterion have to be defined to evaluate software reliability. In this study, we develop software reliability quality metrics for evaluating of software reliability and research for testing of suitable criteria of software reliability. To accomplish a study successfully, we have to estimate the failure time of software using the number of software bugs. Software reliability is very important in software quality. We propose the estimation of software reliability. We propose the software reliability metrics and the software testing method that the basis of international standard ISO/IEC 9126 in software testing metrics.

• Korean Journal of Metals and Materials
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• v.50 no.7
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• pp.539-544
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• 2012

Thermal shock behavior of TiN-coated SUS 304 substrate was investigated using a laser ablation method. By short surface ablation with a pulse Nd-YAG laser, considerable surface crack and spalling were observed, whereas there were few oxidation phenomena, such as grain growth of TiN crystallites, nucleation and growth of $TiO_2$ crystallites, which were observed from the coatings quenched from $700^{\circ}C$ in a chamber. The oxygen concentration of the ablated coating surface with the pulse laser also had a lower value than that of the quenched coating surface by Auger electron spectroscopy and electron probe micro analysis. These results were attributed to the fact that the properties of the pulse laser method have a very short heating time and so the diffusion time for oxidation was insufficient. Consequently, it was verified that the laser thermal shock test provides a way to evaluate the influence of the thermal shock load reduced oxidation effect.