• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.4
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• pp.1-7
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• 2013

Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

• Journal of the Korean Society of Visualization
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• v.14 no.2
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• pp.25-30
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• 2016

The wafer temperature and its uniformity inside the LPCVD chamber were analyzed. The temperature uniformity at the end of the wafer load depends on the heat-insulating cap. The finite difference method was used to investigate the radiation and conduction heat transfer mechanisms, and the temperature field and heat diffusion in the LPCVD chamber was visualized. It was found that the temperature uniformity of the wafers could be controlled by the size and distance of the heat-insulating cap.

• Journal of computational fluids engineering
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• v.5 no.3
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• pp.8-15
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• 2000

This research is aimed to find out how the inlet angle of secondary air affects the uniformity of temperature distribution inside a small incinerator. A commercial code, PHOENICS, is used to simulate the thermal-flow field of an incinerator. The computational grid system is constructed by Multi-Block technique provided by PHOENICS. Numerical experiments are done with the five different angles of secondary air inlet. The uniformity of temperature distribution is evaluated by checking the standard deviation of temperature distribution in an incinerator. The computational results show that there is the minimum value of standard deviation at the certain angle of secondary air inlet, which means that there is an optimum angle of secondary air inlet that could improve the uniformity of temperature distribution in an incinerator. The optimum angle of secondary air inlet is between 30 degree and 45 degree in this particular case.

• Journal of computational fluids engineering
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• v.14 no.3
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• pp.1-8
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• 2009

Diverging channel from gas engine exit to the inlet section of Heat Recovery Steam Generator (HRSG) has been re-designed for 1 MW system. To improve the uniformity in velocity and temperature distribution of existing design(Case A and B), two additional test geometries have been chosen for the numerical simulation. At first, gas burner exit section has been centered to the inlet section of the boiler(Case C) and uniformity in velocity and temperature distribution has been improved considerably. Secondly, the diverging channel length can be further reduced to compact geometry with new guide vane design (Case D and E). Proposed design shows overall improvement in uniformity in velocity and temperature distribution compared to existing one.

• 한국전산유체공학회:학술대회논문집
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• 2008.03a
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• pp.148-154
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• 2008

Diverging channel from gas burner exit to the inlet section of Heat Recovery Steam Generator (HRSG) has been re-designed for 1 MW system. To improve the uniformity in velocity and temperature distribution of existing design(Case A and B) of 300 kW HRSG system, two additional test geometries have been chosen for the numerical simulation. At first, gas burner exit section has been centered to the inlet section of boiler(Case C) and uniformity has been improved considerably. Secondly, the diverging channel length can be further reduced for compact geometry with new guide vane design (Case D and E). Proposed design shows overall improvement in uniformity in velocity and temperature distribution compared to existing one.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.19-24
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• 2021

As the size of semiconductor devices decreases, the etching pattern becomes very narrow and a deep high aspect ratio process becomes important. The cryogenic etching process enables high aspect ratio etching by suppressing the chemical reaction of reactive ions on the sidewall while maintaining the process temperature of -100℃. ESC is an important part for temperature control in cryogenic etching equipment. Through the cooling path inside the ESC, liquid nitrogen is used as cooling water to create a cryogenic environment. And since the ESC directly contacts the wafer, it affects the temperature uniformity of the wafer. The temperature uniformity of the wafer is closely related to the yield. In this study, the cooling path was designed and analyzed so that the wafer could have a uniform temperature distribution. The optimal cooling path conditions were obtained through the analysis of the shape of the cooling path and the change in the speed of the coolant. Through this study, by designing ESC with optimal temperature uniformity, it can be expected to maximize wafer yield in mass production and further contribute to miniaturization and high performance of semiconductor devices.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2369-2374
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• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1609-1612
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• 2005

The effects of injection molding conditions on the uniformity and brightness of light guide plate(LGP) with micro-patterns were investigated in the present study. An injection molding system for stampers with mirco-pattern was designed and manufactured to perform experiment. Variations of injection molding speed, mold and melt temperature for LGP were considered in this work. Also, injection molding characteristics of LGP were investigated by numerical analysis using plastic injection molding commercial code. It was shown that injection molding conditions such as injection speed, melt temperature and mold temperature can have an effect on the uniformity and brightness of light guide plate.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.59-63
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• 2009

This paper presents two dimensional simulation results of an inductively coupled $Ar/O_2$ plasma reactor. The effects of operating conditions on the plasma properties and the uniformity of atomic oxygen near the wafer were systematically investigated. The plasma density had the linear dependence on the chamber pressure, the flow rate of the feed gas and the power deposited into the plasma. On the other hand, the electron temperature decreased almost linearly with the chamber pressure and the flow rate of the feed gas. The power deposited into the plasma nearly unaffected the electron temperature. The simulation results showed that the uniformity of atomic oxygen near the wafer could be improved by lowering the chamber pressure and/or the flow rate of the feed gas. However, the power deposited into the plasma had an adverse effect on the uniformity.