• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.30 no.3
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• pp.149-157
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• 2018

In this research, the psychological and physiological reactions of the driver were measured during winter to evaluate thermal comfort. The experiment was conducted using 3 different cases which are hot air heating, warm-wire seat heating and hot air & warm-wire seat heater operating simultaneously. With regard to psychological reaction, the warm-wire heating mode was the most preferred. The reason is that it is dry in other cases. With regard to EEG response, thermal comfort increased by 37% in warm air mode heating. In addition, when the warm-wire heating mode and the hot air & warm-wire heating mode were simultaneously operated, the thermal comfort continuously increased by between 17% and 20% for 20 minutes after boarding. Under the change of the autonomic nervous system, the thermal stress level increased by 23% after 15 minutes on board in the hot air heating mode and decreased continuously by 13% during the warm-wire seat heating mode. We recommended the hot air heating mode is only used for a short time to raise the inside temperature during the early boarding period and that warm-wire seat heating mode be actively utilized.

• Plant Breeding and Biotechnology
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• v.7 no.3
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• pp.272-286
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• 2019

Developing elite hybrid rice varieties is one important objective of rice breeding programs. Several genes related to male sterilities, restores, and pollinators have been identified through map-based gene cloning within natural variations of rice. These identified genes are good targets for introducing genetic traits in molecular breeding. This study was conducted to breed elite hybrid lines with major genes related to hybrid traits and disease/insect resistance in 240 genetic resources and F₁ hybrid combinations of rice. Molecular markers were reset for three major hybrid genes (S5, Rf3, Rf4) and thirteen disease/insect resistant genes (rice bacterial blight resistance genes Xa3, Xa4, xa5, Xa7, xa13, Xa21; blast resistance genes Pita, Pib, Pi5, Pii; brown planthopper resistant genes Bph18(t) and tungro virus resistance gene tsv1). Genotypes were then analyzed using molecular marker-assisted selection (MAS). Biological assay was then performed at the Red River Delta region in Vietnam using eleven F₁ hybrid combinations and two control vatieties. Results showed that nine F₁ hybrid combinations were highly resistant to rice bacterial blight and blast. Finally, eight F₁ hybrid rice varieties with resistance to disease/insect were selected from eleven F₁ hybrid combinations. Their characteristics such as agricultural traits and yields were then investigated. These F₁ hybrid rice varieties developed with major genes related to hybrid traits and disease/insect resistant genes could be useful for hybrid breeding programs to achieve high yield with biotic and abiotic resistance.

• Proceedings of the Korean Society of Crop Science Conference
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• 2022.10a
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• pp.292-292
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• 2022

Since 1992, the Rural Development Administration (RDA), Republic of Korea in collaboration with International Rice Research Institute (IRRI) has developed 6 japonica rice varieties(MS11, Japonica 1, 2, 6, 7 and Cordillera 4) that are adaptable to tropical regions. However, these varieties show moderate resistance or susceptibility to certain biotic and abiotic stress. The development of varieties with more stable forms of resistance is highly desirable, and this could be possibly achieved through rapid introgression of known biotic and abiotic resistant genes. In this study, we analyzed the allele types of major biotic stress resistant genes including Xa5, Xa13, Xa21 and Xa25 for bacterial leaf blight, Pi5, Pi40, Pish and Pita2 for blast, tsv1 for rice tungro spherical virus, and Bph6, Bph9, Bph17, Bph18 and Bph32 for brown planthopper by using gene-specific molecular markers. In addition, seed quality related genes Sdr4 for preharvest sprouting and qLG-9 for seed longevity were also analyzed. The results revealed that2h5 and Xa25 resistance alleles showed in all varieties while Pi5 resistance allele showed only in MS11. The Pish resistance allele were present in five varieties except for Japonica 1. Meanwhile, for the rest of the genes, no presence of resistance alleles found in six varieties. In conclusions, most of tropical japonica varieties are lack of the major biotic stress resistant genes and seed quality genes (Sdr4 and qLG-9). Moreover, the results indicated that rapid deployment of a few major genes in the current tropical japonica rice varieties is urgent to increase durability and spectrum of biotic stress resistance and also seed dormancy/longevity which are essential traits for tropical environments.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.35-39
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• 2023

ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

• The Journal of Korean Academy of Prosthodontics
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• v.54 no.2
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• pp.93-102
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• 2016

Purpose: The aim of this study was to evaluate the fit accuracy of two zirconia and titanium abutments in internal hexagonal implants. Materials and methods: One titanium abutment and two zirconia abutments were tested in internal hexagonal implants (TSV, Zimmer). Prefabricated zirconia abutments (ZirAce, Acucera) and customized zirconia abutments milled by the Zirkonzahn system (Zirkonzahn Max, Zirkonzahn) were selected and prefabricated titanium abutments (Hex-Lock, Zimmer) were used as a control. Eight abutments per group were connected to implants with 30 Ncm torque. The marginal gaps at abutment-implant interface, the internal gaps at internal hex, vertical and horizontal gaps between screws and screw seats in abutments were measured after sectioning the embedded specimens using a scanning electron microscope. Data analysis included one-way analysis of variance and the Scheffe test (n=16, ${\alpha}=0.05$). Results: The mean marginal gap of customized zirconia abutment was higher than those of two prefabricated zirconia and titanium abutments. The internal gaps at internal hex showed no significant differences between customized and prefabricated abutments and were higher than those of prefabricated titanium abutments. The mean vertical and horizontal gaps at screw in prefabricated zirconia abutment were higher than those of prefabricated titanium abutment. In the case of customized zirconia abutment, the mean horizontal gap at screw was higher than those of both the prefabricated zirconia and the titanium abutment but the mean vertical gap was not even measureable. The screw seats were clearly formed but did not match with abutment screws in prefabricated zirconia abutments. They were not, however, precisely formed in the case of customized zirconia abutments. Conclusion: Within the limitations of this study, the prefabricated titanium abutments showed better fit than the zirconia abutments, regardless of customized or prefabricated. Also, the customized zirconia abutments showed significantly higher marginal gaps and the fit was less accurate between screws and screw seats than the prefabricated abutments, titanium and zirconia.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.755-759
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• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

• The KIPS Transactions:PartA
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• v.17A no.6
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• pp.265-274
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• 2010

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.

• Korean Journal of Environmental Biology
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• v.37 no.4
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• pp.474-482
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• 2019

Disease monitoring in wild aquatic animals is necessary to obtain information about disease occurrence, disease agents, and the transmission of diseases between wild and cultured species. In this study, we monitored viral diseases in wild marine fish and crustacea caught by trawl in Korea in April and October 2018. We monitored the viral diseases in 977 fish from 39 different species and 287 crustacea from 14 different species. In fish, we collected kidney and spleen to detect viral hemorrhagic septicemia virus (VHSV), red sea bream iridovirus (RSIV), marine birnavirus (MABV), hirame rhabdovirus (HRV), and lymphocystis disease virus (LCDV). In crustacea, we monitored white spot syndrome virus (WSSV), infectious hypodermal and hematopoietic necrosis virus (IHHNV), taura syndrome virus (TSV), infectious myonecrosis virus (IMNV), yellowhead disease virus (YHDV), and white tail disease virus (WTDV) using pleopods, pereiopods, gills, muscle, and hepatopancreases. Although none of the viral diseases tested in this study were detected in the samples, these results will help disease control between aquaculture species and wild aquatic animals.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.