• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.148-154
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• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Archives of design research
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• v.11 no.2
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• pp.179-188
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• 1998

One of the characteristics in the modem society is the overflow of the communication. The invention of various merchandise and the development of information and comunication changed the society of verbal characterization into that of visible environments. To establish the effective communication in these changes, the package has to understand, specify, and deliver the needs of the consumers by the thorough analysis of the marketing plans and the marketing strategies. In this thesis we considered the conception of the marketing and the change of the marketing environments, studied the close relationship between the marketing and the package and, furthermore, introduced the package process as one of the effective communication methods. The purpose of this thesis is to introduce the marketing strategies. to develope the theoretical processes of the package design as a communication method which can cope with the change of the marketing environments caused by that of the consumer's favorites.

• Proceedings of the Korea Contents Association Conference
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• 2017.05a
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• pp.453-454
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• 2017

The travellers using social media leave their location history in the form of trajectories. These trajectories can be bridged for acquiring information, required for future recommendation for the future travelers, who are new to that location, providing all sort of information. In this paper, we propose a personalized travel path recommendation scheme based on social life log. By taking advantage of two kinds of social media such as travelogue and community contributed photos, the proposed scheme can not only be personalized to user's travel interest but also be able to recommend a travel path rather than individual Points of Interest (POIs). It also maps both user's and routes' textual descriptions to the topical package space to get user topical package model and route topical package model (i.e., topical interest, cost, time and season).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.53 no.2
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• pp.111-120
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• 2004

This paper presents an application of Unified Modeling Language(UML) software technique for developing transmission pricing evaluation package. Also, this paper describes a transmission pricing algorithm applicable to a large-scale power system. The usage-based transmission pricing mechanism is very complex since it requires power flow analysis, fault current analysis, sensitivity evaluation of a transmission line, penalty factors calculation, transmission asset databases, and cost allocation rules, etc. For the efficient and flexible development of the transmission pricing package, a UML. approach is applied, which is composed of a use-case diagram, interaction diagram, class diagram, and package diagram using Rational Rose Unified Process(RUP). The designed transmission pricing package can be efficiently modified and reused as the market environments evolves since it is designed by Object-Oriented Programming(OOP).

• Publications of The Korean Astronomical Society
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• v.30 no.2
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• pp.675-677
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• 2015

A data simulator and reduction package for the Devasthal Optical Telescope Integral Field Spectrograph (DOTIFS) has been developed. Since data reduction for the Integral Field Spectrograph (IFS) requires complicated procedures due to the complex nature of the integral spectrograph, common reduction procedures are usually not directly applicable for such an instrument. Therefore, the development of an optimized package for the DOTIFS is required. The data simulator observes artificial object and simulates CCD images for the instrument considering various effects; e.g. atmosphere, sky background, transmission, spectrograph optics aberration, and detector noise. The data reduction package has been developed based on the outcomes from the DOTIFS data simulator. The reduction package includes the entire processes for the reduction; pre-processing, flat-fielding, and sky subtraction. It generates 3D data cubes as a final product, which users can use for science directly.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.108-111
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• 2000

The electrical characteristics of MQFP packages have been measured in RF regime. The s-parameter of the lead frame has been measured using the test fixture on which the do-capped package was mounted. A simple lumped equivalent circuit modeling of the lead frame and the test fixture can provide reasonable model parameters up to the frequency of 200 MHz.

• Journal of Digital Convergence
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• v.15 no.9
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• pp.479-486
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• 2017

The purpose of this study is to analyze the preference and value of consumers through the package design of cosmetics with the concept of cause branding, and to propose a package design that can satisfy consumers' needs. I have recruited an experimental group that emphasizes the importance of package design in purchasing cosmetics. And Survey and in-depth interviews were conducted by comparing cause brand's product with general brand's product. In the first experiment, the items were classified into cognitive, emotional, and behavioral responses and a total of 31 subjects were surveyed. In the second experiment, six interviewees were interviewed through a questionnaire prepared by extracting 4 items from Sheth 's consumption value standard. As a result of the experiment, consumers preferred a design that can quickly and accurately grasp the information of the product. Especially, it is not easy to know whether it is a cause brand's product. So It should be stated in the package how it will be socially beneficial.