• Title/Summary/Keyword: TEM(Transmission Electron Microscopy)

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Observation of Defects in the Alpha-Alumina Single Crystal by TEM and REM Techniques (투과전자현미경(TEM)과 반사전자현미경법(REM)을 이용한 알루미나 단결정내의 결함들에 관한 관찰)

  • Kim, Yootaek
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.3 no.2
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    • pp.131-139
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    • 1993
  • Transmission electron microscopy( lEM) technique which is useful for investigating the crystalline structure and defects, and reflection electron microscopy( REM) of which technique has very high sensitivity of detecting the defects on the crystal surfaces were applied to study the behaviour of dislocations and twins in or on the $a- AI_20_3$ single crystals.

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Morphology of Nanocelluloses and Micro-sized Cellulose Fibers Isolated by Acid Hydrolysis Method

  • Cho, Mi-Jung;Park, Byung-Dae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.41 no.5
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    • pp.26-32
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    • 2009
  • As a part of utilizing the nanocellulose (NC) from lignocellulosic components of wood biomass, this paper reports preliminary results on the products of sulfuric acid hydrolysis. The purpose of this study was to investigate the morphology of both NC and micro-sized cellulose fiber (MCF) isolated by acid hydrolysis from commercial microcrystalline cellulose (MCC). Field emission.scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM) were employed to observe the acid hydrolysis suspension, NC, and MCF. The electron microscopy observations showed that the acid hydrolysis suspension, before separation into NC and MCF by centrifugation, was composed of nano-sized NCs and micro-sized MCFs. The morphology of isolated NCs was a whisker form of rod-like NCs. Measurements of individual NCs using TEM indicated dimensions of 6.96$\pm$0.87 nm wide by 178$\pm$55 nm long. Observations of the MCFs showed that most of the MCC particles had de-fibered into relatively long fibers with a diameter of 3-9 ${\mu}m$, depending on the degree of acid hydrolysis. These results suggest that proper technologies are required to effectively realize the potentials of both NCs and MCFs.

Ultrastructural Process of Protoplast Fusion Between Lentinula edodes and Coriolus versicolor

  • Kim, Chae-Kyun;Kim, Byong-Kak
    • Mycobiology
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    • v.29 no.1
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    • pp.15-18
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    • 2001
  • Protoplast fusion is a useful technique for establishing fungal hybrids to overcome the natural barriers. The ultrastructure of protoplast and its fusion process were observed using a scanning electron microscopy(SEM) and a transmission electron microscopy(TEM). The protoplasts were variable in size from $0.5{\sim}15{\mu}m$ in diameter, and the mean diameter was about $3{\sim}5{\mu}m$. It was impossible to discriminate protoplasts of Lentinula edodes from protoplasts of Coriolus versicolor by size and surface structure. Big aggregates of the dehydrated protoplasts were observed, after polyethylene glycol 4000 treatment. Nucleus, mitochondria, lipid granules and various vesicles having granules were scattered in the cytoplasm. The vesicles were heterogeneous in size and vary from one protoplast to another. The fused membrane layer of the two protoplasts was observed. Time protoplast membrane contact and reorganization of membrane components were essential condition for protoplast fusion. Transmission electron micrograph showed fused protoplasts and flattening of the cells in the area of the membrane contact. We hope that our electron microscopic observations provide some insights into the understanding of the fusion process of protoplast in fungi.

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Microscopic Investigation of the Strain Rate Hardening for Polycrystalline Metals (철강재료 변형률속도 경화의 미시적 관찰)

  • Yoon, J.H.;Park, C.G.;Kang, J.S.;Suh, J.H.;Huh, M.Y.;Kang, H.G.;Huh, H.
    • Transactions of Materials Processing
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    • v.17 no.1
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    • pp.46-51
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    • 2008
  • Polycrystalline materials such as steels(BCC) and aluminum alloys(FCC) show the strain hardening and the strain rate hardening during the plastic deformation. The strain hardening is induced by deformation resistance of dislocation glide on some crystallographic systems and increase of the dislocation density on grain boundaries or inner grain. However, the phenomenon of the strain rate hardening is not demonstrated distinctly in the rage of $10^{-2}$ to $10^2/sec$ strain rate. In this paper, tensile tests for various strain rates are performed in the rage of $10^{-2}$ to $10^2/sec$ then, specimens are extracted on the same strain position to investigate the microscopic behavior of deformed materials. The extracted specimens are investigated by using the electron backscattered diffraction(EBSD) and transmission electron microscopy(TEM) results which show the effect of texture orientation, grain size and dislocation behavior on the strain rate hardening.

Precise Analysis of the Surface Oxidation Layer on Cu Powders Using FE-TEM Techniques (전계방출 투과전자현미경 분석기술을 이용한 Cu 입자 표면산화층의 정밀평가)

  • Lee, Tae Hun;Yoo, Jung Ho;Hyun, Moon Seop;Yang, Jun-Mo;Seong, Mi-Ryn;Kwon, Jinhyeong;Lee, Caroline Sunyong;Kim, Jeong-Sun;Baik, Kyeong Ho
    • Korean Journal of Metals and Materials
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    • v.48 no.1
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    • pp.57-61
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    • 2010
  • Nanosized surface structures of Cu powders were investigated at the atomic scale by field-emission transmission electron microscope techniques. The nanoscale surface oxide layer on the Cu powder was analyzed to be the $CU_2O$ phase by electron diffraction pattern and electron energy-loss spectroscopy. In addition, it was found from high-resolution transmission electron microscopy study that there are formed no surface oxide layers on the surface of alkanethiol coated Cu powders.

Characterization of Basal Plane Dislocations in PVT-Grown SiC by Transmission Electron Microscopy

  • Jeong, Myoungho;Kim, Dong-Yeob;Hong, Soon-Ku;Lee, Jeong Yong;Yeo, Im Gyu;Eun, Tai-Hee;Chun, Myoung-Chuel
    • Korean Journal of Materials Research
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    • v.26 no.11
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    • pp.656-661
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    • 2016
  • 4H- and 6H-SiC grown by physical vapor transport method were investigated by transmission electron microscopy (TEM). From the TEM diffraction patterns observed along the [11-20] zone axis, 4H- and 6H-SiC were identified due to their additional diffraction spots, indicating atomic stacking sequences. However, identification was not possible in the [10-10] zone axis due to the absence of additional diffraction spots. Basal plane dislocations (BPDs) were investigated in the TEM specimen prepared along the [10-10] zone axis using the two-beam technique. BPDs were two Shockley partial dislocations with a stacking fault (SF) between them. Shockley partial BPDs arrayed along the [0001] growth direction were observed in the investigated 4H-SiC. This arrayed configuration of Shockley partial BPDs cannot be recognized from the plan view TEM with the [0001] zone axis. The evaluated distances between the two Shockley partial dislocations for the investigated samples were similar to the equilibrium distance, with values of several hundreds of nanometers or even values as large as over a few micrometers.

Nano-structure Analysis on $V_2O_5$ Nanowires ($V_2O_5$ 나노선의 나노 구조 분석)

  • Lee, Hyung-Dong;Pieh, Sung-Hoon;Chang, Yu-Jin;Kim, Gyu-Tae;Park, Sung-Joon;Kim, Yong-Kwan;Ha, Jeong-Sook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.256-259
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    • 2004
  • [ $V_2O_5$ ] 나노선의 구조 분석을 위해 STM(Scanning Tunneling Microscopy)과 TEM(Transmission Electron Microscopy)을 이용하여 단일 $V_2O_5$ 나노선의 이미지를 얻었다. $V_2O_5$ 나노선은 상온에서 ammonium metavanadate$(NH_4VO_3)$와 양이온 교환수지$(DOWEX50{\times}8-100)$를 2차 증류수에 섞어 합성하였다. STM 시료는 3-APS(3-aminopropyltriethoxysilane)를 전 처리한 실리콘 기판에 $V_2O_5$ 나노선을 올려 만들었고, TEM 시료는 200 mesh/copper 그리드에 침전시켜 준비하였다. STM과 TEM의 결과로부터 $V_2O_5$ 나노선의 기하학적 단면이 $1.5nm{\times}10nm$에 거의 근사하는 것을 확인하였으며 두 이미지의 비교를 통해 $V_2O_5$ 나노선의 표면상태에 대해 논의하였다.

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Annealing for Improving adhesion between Metal layer and Oxide layer (산화막과 금속박막 계면에서의 adhesion 개선을 위한 열처리)

  • 김응수
    • Proceedings of the IEEK Conference
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    • 2002.06b
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    • pp.225-228
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    • 2002
  • The adhesion effect between the oxide layer and the metal layer has been studied by RTP anneal. Two types of oxides, BPSG and P-TEOS, were used as a bottom layer under multi-layered metal film. We observe the interface between oxide and metal layer using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Adhesion failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal film at 650"C RTP anneal. The phosphorus rich layer was observed at interface between BPSG oxide and metal layer by AES and TEM measurements. On the other hand adhesion was a)ways good in the sample used P-TEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal film was improved when the sample was annealed below $650^{\circ}C$.TEX>.

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Transmission Electron Microscopy Study of Stacking Fault Pyramids Formed in Multiple Oxygen Implanted Silicon-on-Insulator Material

  • Park, Ju-Cheol;Lee, June-Dong;Krause, Steve J.
    • Applied Microscopy
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    • v.42 no.3
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    • pp.151-157
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    • 2012
  • The microstructure of various shapes of stacking fault pyramids (SFPs) formed in multiple implant/anneal Separation by Implanted Oxygen (SIMOX) material were investigated by plan-view and cross-sectional transmission electron microscopy. In the multiple implant/anneal SIMOX, the defects in the top silicon layer are confined at the interface of the buried oxide layer at a density of ${\sim}10^6\;cm^{-2}$. The dominant defects are perfect and imperfect SFPs. The perfect SFPs were formed by the expansion and interaction of four dissociated dislocations on the {111} pyramidal planes. The imperfect SFPs show various shapes of SFPs, including I-, L-, and Y-shapes. The shape of imperfect SFPs may depend on the number of dissociated dislocations bounded to the top of the pyramid and the interaction of Shockley partial dislocations at each edge of {111} pyramidal planes.

Study on Surface Damage of Specimen for Transmission Electron Microscopy(TEM) Using Focused Ion Beam(FIB) (집속 이온빔을 이용한 투과 전자 현미경 시편의 표면 영향에 관한 연구)

  • Kim, Dong-Sik
    • 전자공학회논문지 IE
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    • v.47 no.2
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    • pp.8-12
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    • 2010
  • TEM is a powerful tool for semiconductor material analyses in structure or biological sample in micro structure. TEM observation need to make to coincide specimens for special purpose. in this paper, we have experimented for minimum surface damage on bulk wafer and patterned specimen by various conditions such as accelerating energy, depth of ion beam, ion milling types, and etc. in various specimen preparation methods by FIB (Focus Ion Beam). The optimal qualified specimens are contain low mounts of surface damage(about 5 nm) on patterned specimen.