• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.491-496
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• 2001

In recent years, the research and development about the new material proceed rapidly and actively in the building industry. As building structures become bigger, higher and more specialized, so does the demand for material with higher strength. In the future, we will need to research repair and rehabilitation to make high strength concrete mixed steel fibrous building safe. The carbon fiber reinforced plastic bonding method is widely used in reinforcing the existing concrete structure among the various methods. The repair of initiate loaded reinforced high-strength concrete beams mixed steel fibrous with epoxy bonded Carbon Fiber Sheets(CFS) was investigated experimentally. The CFS thickness and length were varied to assess the peel failure at the curtailment of CFS, The behaviour of the repaired beams was represented by load-longitudinal steel strain relation and failure modes were discussed. The test results indicate that CFS is very effective for strengthening the demand beams and controlling deflections of reinforced high strength concrete beams mixed steel fibrous happen diagonal crack, the increase in the number of CFS layers over two layers didn't effect the increase in the strength of beams.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.232-233
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• 2005

The Surface of semi-conductive silicone rubber was treated by oxygen plasma to improve adhesion and electric performance in joints between insulating and semi-conductive silicone materials. Surface characterizations were assessed using contact angle measurement and Fourier transform infrared spectroscope (FTIR). Adhesion level was understood from T-peel tests between plasma treated semi-conductive and insulating material. Electrical breakdown strength was measured to understand the charge of electrical performance. From the results, the oxygen plasma treatment produces a significant increase in function group of containing oxygen which can be mainly ascribed to the creation of carbonyl groups on the silicone surface from the strength were improved. Therefore it is concluded then plasma treatment leads to decrease voids originating form poor adhesive, and the improve the adhesion in silicone interface. So we could obtain higher electrical design level of silicone material used for electrical apparatus using oxygen plasma treatment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.12
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• pp.1009-1013
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• 2009

In this study, we have been synthesized the dielectric layer using pure organic and organic-inorganic hybrid precursor on flexible substrate for improving of the organic thin film transistors (OTFTs) and, design and fabrication of organic thin-film transistors (OTFTs) using small-molecule organic semiconductors with pentacene as the active layer with record device performance. In this work OTFT test structures fabricated on polymerized substrates were utilized to provide a convenient substrate, gate contact, and gate insulator for the processing and characterization of organic materials and their transistors. By an adhesion development between gate metal and PI substrate, a PI film was treated using $O_2$ and $N_2$ gas. The best peel strength of PI film is 109.07 gf/mm. Also, we have studied the electric characteristics of pentacene field-effect transistors with the polymer gate-dielectrics such as cyclohexane and hybrid (cyclohexane+TEOS). The transistors with cyclohexane gate-dielectric has higher field-effect mobility, $\mu_{FET}=0.84\;cm^2/v_s$, and smaller threshold voltage, $V_T=-6.8\;V$, compared with the transistor with hybrid gate-dielectric.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.450-456
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• 2005

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Transactions on Electrical and Electronic Materials
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• v.7 no.1
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• pp.16-20
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• 2006

In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints prepared with a insulating silicone materials. Surface characterizations were assessed using contact angle measurement and x-ray photoelectron spectroscopy (XPS), and then adhesion level and electrical performance were evaluated through T-peel tests and electrical breakdown voltage tests of treated semi-conductive and insulating joints. Plasma exposure mainly increased the polar component of surface energy from $0.21\;dyne/cm^2$ to $47\;dyne/cm^2$ with increasing plasma treatment time and then leveled off. Based on XPS analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and COH on semi-conductive silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiO_x,\;x=3{\sim}4$). The oxygen plasma treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength. In addition, electrical breakdown level of joints with adequate plasma treatment was increased by about $10\;\%$ with model samples of joints prepared with a semi-conducting/ insulating silicone polymer after applied to interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.868-872
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• 2006

In this work, the effects of the corona treatment on surface properties of semiconducting silicone rubber were investigated in terms of contact angles, ATR-FTIR(Attenuated total reflection fourier transform infrared spectroscopy) and XPS(X-ray photoelectron spectroscopy). And the adhesive characteristics were studied by measuring the T-peel strengths. Based on chemical analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and C-OH on semiconducting silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiOx,\;x=3{\sim}4$. The Corona treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength.

• Journal of Adhesion and Interface
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• v.11 no.1
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• pp.35-40
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• 2010

In this study, solvent based polyurethane (PU) adhesives were prepared with the hydrocarbon resin and the acrylic modified hydrocarbon resin contents. The solvent based PU adhesive were increased with increasing tackifier concentration. The surface state of films showed good compatibility with increasing the PX-95 concentration but A-1100 series didn't present homogeneous phase more than 10 phr. Mechanical strength and peel strength were maximum at 5 phr tackifier concentration especially PX-95 series in solvent based PU adhesive.

• Journal of Adhesion and Interface
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• v.11 no.3
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• pp.100-105
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• 2010

In this study, polyurethane dispersion was prepared by polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylolpropionic acid (DMPA), and monomeric diol. The effect of various monomeric diol, polyol/monomeric diol molar ratio and DMPA contents on the properties of polyurethane dispersion were investigated. As the molecular weight of monomeric diol and monomeric diol molar ratio increased, $T_g$ gradually increased. And when DMPA contents increased, also $T_g$ gradually increased. In the results of mechanical properties, when the molecular weight of monomeric diol, monomeric diol molar ratio of polyol/monomeric diol and DMPA contents increased, tensile strength was increased. Finally, optimum peel strength obtained when polyol/monomeric diol ratio was 8 : 2.

• Journal of Adhesion and Interface
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• v.6 no.2
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• pp.6-12
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• 2005

The plasma generally, ionized gas state, is the 4th material state composed the universe. Generating the plasma artificially has been studied by spending energy and it has a lot of applications in human's life. There are several merits to modify the surface of polymer using plasma. Above all, plasma maintains the property of polymer because of it changes the property of surface only. Also, it doesn't use a organic solvent and it is the environment friendship because of there are no waste under processing. Furthemore, in case of high-pressure plasma, it is possible that automated-processing continuously. In this study, we tried the reforming of surface to rise the adhesive strength between the material of polymer, experimented the rising of adhesive strength through a experiment of peel strength by virtue of processing time and using gas, confirmed the change of polymer's surface through measuring the surface contact angle analyzer and scanning electron microscopy (SEM).