• 산업기술연구
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• 제20권A호
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• pp.169-178
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• 2000

The 4-point bending tests have been performed In order to estimate the effect of TIG-dressing on fatigue strength and fatigue characteristics quantitatively for non load-carrying fillet welded joints subjected to pure bending. As a result of fatigue tests, fatigue strengths of as-welded specimens have satisfied the grade of fatigue strength prescribed in specifications of korea, AASHTO and JSSC. Fatigue strength at 2 million cycles of TIG-dressing specimens have increased compared with as-welded specimens. As the result of beachmark tests, fatigue cracks occurred at several points, where the radius of curvature and flank angle in the weld bead toes were low, and grew as semi-elliptical cracks, then approached to fracture. As a result of finite element analysis, stress concentration factor in weld bead toes has closely related to the flank angle and radius of curvature, and between these, the radius of curvature has more largely affected in stress concentration factor than flank angle. As a result of fracture mechanics approaches, the crack correction factor of test specimens has largely affected on stress gradient correction factor in case a/t is below 0.4. From the relations between stress intensity factor range estimated from FEM analysis and fatigue crack growth rate, fatigue life has been correctly calculated.

• Journal of Welding and Joining
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• 제17권3호
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• 한국해양학회지
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• 제30권4호
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• pp.237-249
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• 1995

대한 해협 횡단면 상의 수온, 염분 및 해류의 구조를 이해하기 위하여 1994년 5월 2일부터 20일 까지 현장 조사를 수행하였다. 연구선 탐양호를 이용하여 상세한 CTD 수 직 profile과 ADCP 측정 기록을 얻었으며 두 개의 시간차(15일과 25시간)에 대한 평균 장과 변동장을 분석하였다. 대한 해협 중앙부에는 서로 다른 두 개의 수기 즉 동측의 고온 고염수와 서측의 저온저염수가 서로 인접하면서 대단히 뚜렷한 연안 전선을 형성 하고 있다. 이 고운 고염 수괴가 약 보름에 걸쳐서 서진하면서 수온 염분장을 크게 변 화 시키고 있음을 관찰할 수 있었다. 또한 중층에서는 수시간대의 짧은 주기로서도 수 온과 염분이 변화하고 있었으며, 이 현상은 EOF분석에서 제 1고유 모드로 나타나며 그 것은 50%이상의 전체 분산을 점하고 있다. 대한 해협에서의 흐름은 조류에 의하면 심 하게 영향을 받고 있으며 해협 중앙부에서 사리와 조금 때 각각 최대 80-90 및 60-70 cm/s의 크기를 보여 준다. 강한 남향의 조류에 의해 때에 따라서는 북향하는 대마 난 류의 존재가 완전히 가려 보이지 않기도 하였다. 25시간 연속 해류 관측 결과의 조화 분석 결과사리와 조금 때 평균, 단일주조류 및 일일주조류의 크기가 서로 비슷함을 알 수 있었다. 대한 해협 서수도를 통과하는 용접수송량은 조금 때 2.1 사리 때에 3.4 Sv 으로 추정되었다.

• 한국터널지하공간학회 논문집
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• 제26권3호
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• pp.243-254
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• 2024

현재 국내 지역의 산업 발달로 인해 주요 도심은 물론 주변 도시 지역에도 건축물이 포화 상태이다. 이에 따라 사람들의 관심은 지하공간으로 쏠리게 되었고, 특히 도시개발에 있어서 터널은 광범위하게 활용되고 있다. 이에 따라 터널 및 터널굴착공법에 대한 연구가 활발히 진행되고 있다. 그러나 이수식 쉴드 TBM 사용 시 슬러지 배출관의 마모 및 파손 문제에 대한 연구는 부족한 실정이다. 따라서 본 논문에서는 기존 슬러지 배출관에 사용된 L자형 곡관을 T자형 곡관으로 변형하여 슬러지를 이동시켰다. 그 결과, L자형 곡관에 비하여 T자형 곡관이 슬러지 배출 시 곡관에 미치는 영향이 감소하는 것을 확인할 수 있었다. 이러한 결과를 바탕으로 이수식 쉴드 TBM 장비 사용 시 T자형 곡관을 사용하면 슬러지 배출관의 마모를 최소화할 수 있을 것으로 기대된다. 이는 결국 터널 공사 시 곡관 교체나 추가 용접에 따른 비용을 절감하는 등 경제적 이익으로 이어질 것으로 기대된다.

• Journal of Welding and Joining
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• 제14권3호
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• pp.48-57
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied by impact test, optical microscopy and scanning electron microscopy. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at $660^{\circ}C$ for HY-100 steel and thermal cycled from $1350^{\circ}C$ to $25^{\circ}C$ with a cooling time of $\Delta$t_${800^{circ}C/500^{circ}C}$=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of $570~620^{\circ}C$. The time to failure$(t_f)$ at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. By the precipitation of $\varepsilon$-Cu phase, the differential strengthening of grain interior relative to grain boundary may be greater in the Cu-bearing HSLA-100 steel than in HY-100 steel. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility. The activation energies for SRC of HSLA-100 steel are 103.9kcal/mal for 387MPa and 87.6kcal/mol for 437MPa and that of HY-100 steel is 129.2kcal/mol for 437MPa.

• 콘크리트학회논문집
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• 제19권4호
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• pp.401-409
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• 2007

본 연구는 국내 현장에서 적용되고 있는 SRC 기둥-RC 보 강축 방향 접합부의 구조 성능을 평가하기 위하여 국내 현장 조사 및 기존 연구 자료를 기초로 접합부 상세를 분류하였고, 6개의 실험체를 제작하여 구조 실험을 수행하였다. 실험 결과로부터 하중-변위 이력 및 최대 내력 도달 이후의 내력 저하 등에 대한 거동을 비교 분석하였다. 그 결과 넓은 보 단면 (RCW-P, RCW-W, RCW-F) 및 T형 보 단면 (RCT-W) 실험체들이 H형강 브라켓 부착형 실험체(HBR-L, HBR-S)에 비해 대체로 우수한 구조적 거동을 보여주었으며, 설계 내력을 상회하는 내력을 보유하고 있었다. 또한 현장에서 적용하여도 무리가 없는 것으로 판단된다. 특히, T형 보 단면 (RCT-W)을 갖는 실험체가 최대 내력 및 최대 내력 도달 이후 강도 저하 등 전반적으로 다른 접합 형태를 갖는 실험체에 비해 우수한 구조 성능을 보유하고 있었다. 그리고 H형강 브라켓 부착형 실험체들 (HBR-L, HBR-S)은 설계 내력에 미치지 못한 최대 내력을 보여 주었고 최대 내력 도달 이후 급격한 하중 저하를 나타내며 취성적인 거동을 보였다.

• 수산해양기술연구
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• 제14권2호
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• pp.79-87
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• 1978

기관밸브용접 SCr4-21-4N 및 SUH3-21-4N을 연구선정된 최적마찰압접조건 하에서 마찰압접을 하고 이때 생기는 압접부의 잔류응력 및 경도의 peak 등 압접결함의 제거 및 압접성능개선을 위한 열처리에 관하여 실험연구한 결과 다음과 같은 결론을 얻었다. (1) 배기 valve용강 SCr4-21-4N 및 SUH3-21-4N의 마찰압접을 위한 최적조건으로서 회전수 3,000rpm, 마찰가열압 p 하(1)=8 kg/mm 상(2), upset 압 p 하(2)=20 kg/mm 상(2), 압접가열시간 t 하(1)=3초, upset 시간 2.5초를 선정한 것이 매우 타당함이 실험적으로 입증되었다. (2) 이종재질 SUH3-SUH31, SCr4-SUH31, SCr4-SUH3, SUH3-CRK22, SCr4-21-4N 및 SUH3-21-4N의 마찰압접에 관한 저자의 종래 연구와 본연구 결과는 압접부의 압접 특성이 서로 매우 일치하였다. (3) SCr4-21-4N 및 SUH3-21-4N의 마찰압접부의 잔류응력 및 전도의 peak를 제거하기 위한 최적열처리조건은 $600^{\circ}C$$\times$30min.$\times$room air cooling의 normalizing임이 확인되었다. (4) 이때 열처리 후에는, 열처리전의 인장강도의 약 20%가 감소했으나, 파단 위치는 열영향부로부터 모재 SCr4 및 SUH3 측으로 이동하였다. (5) 상기 최적조건 하에서 마찰압접되고 열처리된 압접부의 현미경 조직검사 결과, 압접부가 매우 좁고 압접결함이 없으며, 치밀하고 조밀한 조직의 우수한 압접이었음이 확인되었다. (6) 상기 최적조건은, 기관 valve 생산을 위한 타이종재질의 마찰압접조건으로도 응용될 수 있을 것이다.

• Journal of Welding and Joining
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• 제30권2호
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• pp.59-64
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• 2012

Welding is an essential process in the automotive industry. Most welding processes that are used for auto body are spot welding and $CO_2$ welding are used in a small part. In production field, $CO_2$ welding process is decreased and spot welding process is increased due to welding quality is poor and defects are occurred in $CO_2$ welding process frequently. But $CO_2$ welding process should be used at robot interference parts and closed parts where spot welding couldn't. Because of the 0.65mm ~ 2.0mm thickness steel sheet were used in the automotive industry, poor quality of welding area such as burn through and under fill were happened frequently in $CO_2$ process. In this paper, we will study about the penetration depth which gives a huge impact on burn through changing a degree of base metal, welding position and torch angle. Voltage, current and welding speed were fixed but degree of base metal, welding position and torch angle were changed. And Cold- Rolled(CR) steel sheet was used. Penetration depth was analysed by multiple regression analysis to derive approximate calculations. And reliability of approximate calculations were confirmed through additional experiments. As the results of this research, we confirmed the effect of torch and plate angle to bead shape. And we present a possibility that can simulate more accurate to weld geometry, as deduced the verification equations that has tolerance of less than 21.69%.

• Journal of Welding and Joining
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• 제17권1호
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Welding and Joining
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• 제34권2호
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• pp.46-53
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• 2016

Effect of heating rate on microstructure of brazed joints with STS 304 Printed Circuit Heat Exchanger (PCHE),which was manufactured as large-scale($1170(L){\times}520(W)){\times}100(T)$, mm), have been studied to compare bonding phenomenon. The specimens using MBF 20 was bonded at $1080^{\circ}C$ for 1hr with $0.38^{\circ}C/min$ and $20^{\circ}C/min$ heating rate, respectively. In case of a heating rate of $20^{\circ}C/min$, overflow of filler metal was observed at the edge of a brazed joints showing the height of filler metal was decreased from $100{\mu}m$ to $68{\mu}m$. At the center of the joints, CrB and high Ni contents of ${\gamma}$-Ni was existed. For the joints brazed at a heating rate of $0.38^{\circ}C/min$, the height of filler was decreased from $100{\mu}m$ to $86{\mu}m$ showing the overflow of filler was not appeared. At the center of the joints, only ${\gamma}$-Ni was detected gradating the Ni contents from center. This phenomenon was driven from a diffusion amount of Boron in filler metal. With a fast heating rate $20^{\circ}C/min$, diffusion amount of B was so small that liquid state of filler metal and base metal were reacted. But, for a slow heating rate $0.38^{\circ}C/min$, solid state of filler metal due to low diffusion amount of B reacted with base metal as a solid diffusion bonding.