• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.46-49
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• 2003

Chemical mechanical polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5% hydrogen peroxide such as $Fe(NO_3)_3$, $H_2O_2$, and $KIO_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of $Al_3O_3$ particles in presence of surfactant stabilizing the slurry.

• Polymer(Korea)
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• v.38 no.6
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• pp.767-773
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• 2014

Rheological and electrical properties of polystyrene (PS)/carbon nanotube (CNT) nanocomposites via coagulated precipitation were investigated. Chemical modification and surfactant wrapping of CNT to improve the dispersion of CNTs may reduce the intrinsic properties of pristine CNT. To avoid this problem, PS and CNTs were dissolved and dispersed in dimethylformamide and then PS/CNT nanocomposites were prepared by the coagulated precipitation of CNT-dispersed PS solution in water. The coagulated precipitation method was highly effective enhancing the electrical conductivity of nanocomposites. Furthermore, the effect of adding poly(styrene-co-divinylbenzene) crosslinked particles to PS matrix on the rheological and electrical properties was investigated. With the addition of the crosslinked particles, the electrical percolation threshold of CNT reduced to 0.25 wt% and electrical conductivity increased further. It is speculated that CNTs in the volume occupied by crosslinked particles helped electrical pathway formation.

• Advances in nano research
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• v.8 no.1
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• pp.1-11
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• 2020

In order to develop a new adsorbent for removal of formaldehyde from aqueous solution, surface modification of TiO₂ nanoparticles was performed with 2,4-Dinitrophenylhydrazine (DNPH) that have a strong affinity to the formaldehyde. Sodium dodecyl sulfate (SDS) surfactant was used to improve the DNPH grafting to TiO₂ surface. Modified adsorbents were characterized by SEM, TEM, XRD, EDX and FTIR. Since the COD level in wastewaters including formaldehyde is considerable, it is necessary to determine the COD content of the synthetic wastewater. In order to determine the optimal removal conditions, the effect of contact time (60-210 min), pH (4-10) and adsorbent dosage (0.5-1.5 g/L) on adsorption and COD removal efficiencies were studied, using response surface method. EDX and FTIR analysis confirmed the presence of nitrogen-containing functional groups on the modified TiO₂ surface. The maximum formaldehyde adsorption and COD removal efficiencies by modified TiO₂ were about 15.65 and 7.35% higher than the unmodified nanoparticles respectively. Therefore, the grafting of nano-TiO₂ with DNPH would greatly improve its formaldehyde adsorption efficiency. The optimum conditions determined for a maximum formaldehyde removal of 99.904% and a COD reduction of 94.815% by TiO₂/SDS/DNPH nanocomposites were: adsorbent dosage 1.100 g/L, pH 7.424 and the contact time 183.290 min.

• Membrane Journal
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• v.24 no.4
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• pp.301-310
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• 2014

In this study, the silica nanoparticles were considerably chosen to improve a dimensional stability, proton transport and electrochemical performance of the resulting inorganic-organic nanocomposite membranes. For this purpose, hydrophobic silica (Aerosil$^{(R)}$ 812, Degussa) and hydrophilic silica (Aerosil$^{(R)}$ 380, Degussa) nanoparticles were, respectively, introduced into a Sulfonated poly(arylene ether sulfone) (SPAES) polymer matrix. The $SiO_2$ particles are evenly dispersed in a SPAES matrix by the aid of a non-ionic surfactant (Pluronics$^{(R)}$ L64). A $SiO_2$ content plays an important role in membrane microstructures and membrane properties such as proton conductivity and water uptake. Therefore, to study nanocomposite membranes with excessive amount of silica, the content of silica nanoparticles were increased up to 5 wt%. Interestingly, a hydrophobic $SiO_2$ containing nanocomposite membrane showed better electrochemical performance (29% higher than pristine SPAES) despite of low proton conductivity due to its adhesive properties with a catalyst layer in a single cell test. All the silica-SPAES membranes exhibited better performance than a pristine SPAES membrane.

• Korean Journal of Food Science and Technology
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• v.11 no.2
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• pp.112-117
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• 1979

By using the existing caustic refining system with a minimum modification and by using a combination of various emulsifiers(0.2 % sodium hexametaphosphate. 0.05 % sodium lauryl sulfate and 0.001 % dioctyl sodium sulfosuccinate), a new economical dewaxing process for sunflower seed oil was developed in order to reduce the cost of the dewaxing process. The results indicate that the waxes can be removed satisfactorily from the sunflower seed oil by emulsifying. batchwise or continuously, the oil with the aqueous surfactant solution, followed by centrifugation at ambient temperatures $(16{\sim}27^{\circ}C)$. Dewaxing loss for the batch process was satisfactory for both low wax-and high wax-crude oil, whereas dewaxing loss for the continuous process needs to be improved. The results indicate that initial level of wax content (low wax vs. high wax) did not affect the loss for batch process (0.82 % vs. 0.62 %), but affected the loss for continuous processes, regardless of the type of mixing mode (2.28 % and 5.68 % for low wax-and high wax-oil, respectively). It was also noted that the type of mixing mode (centactor vs. static mixer) for the continuous process affected the loss, regardless of the wax content (5.2 % and 2.8 % for contactor and static mixer, respectively).