• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.96-98
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• 2006

A new ex-situ model to diagnose a plasma processing equipment was presented. The model was constructed by combining wavelet, scanning electron microscope, ex-situ measurement of etching profile, and neural network. The diagnosis technique was applied to a tungsten etching process, conducted in a $SF_6$ helicon plasma. The wavelet was used to characterize detailed variations of plasma-etched surface. The diagnosis model was constructed with the vertical wavelet component. For comparison, a conventional model was built by using the estimated profile data. Compared to the conventional model, the wavelet-based model, demonstrated a much improved diagnosis.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.85-91
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• 2008

White light scanning interferometry has gotten a firm position in 3D surface profile measuring field. Recently, the LCD industry gave a chance for this technology to enter into real industry fields. It is known that white-light phase-shifting algorithm give a best resolution compare to other algorithms, but there are some problems to be resolved. One of them is 300nm jump in height profile, called bat-wing effect. The main reason of this problem is an ambiguity of phase-peak detection algorithm, and some solution has been proposed, but it didn't work perfectly. In this paper, I will show the cases when these effects are occurred, and these height discrepancies will be almost disappeared when broad-band illuminators are used.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.4
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• pp.101-108
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• 2016

Endmill fillet cutting at the corner was conducted with the online measurement of cutting forces and tool deflection by a tool dynamometer and an eddy current sensor system. The profile of the machined surface was also compared with the CAD profile with a Coordinate Measuring Machine (CMM) and CALYPSO software. It was found that the end mill cutter with four blades has a better surface profile than that with two blades, and the cutting forces and tool deformation were increased as the cutting speed was increased. When the tool located at the degree $45^{\circ}$ corner was found to conduct the maximum cutting force than started to the point of the workpiece. As it was compared with the CMM and ANOVA analysis result in the case that the cutting force and tool deformation was the maximum, it was found that the result was affected by the spindle speed and the number of blades.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.245-247
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• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.101-105
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• 1992

Machined graphite/epoxy composite surfaces were studied by using SEM(Scanning Electron Microscopy). surface profilometry and its analysis to determine suitable surface describing parameters for machined unidirectional and laminate composite surface. The surface roughness and profile are found to be highly dependent on the fiber layup direction and the measurement direction. Machined unidirectional and 0.deg. 45 .deg. 90 .deg. plies in laminate composite surface profiles are found to be Gaussian in the direction of machining. Since there exist bare fibers without matrix smearing in 0 .deg. ply, higher surface roughness values were found in this orientation. It was possible to machine 90 .deg. and -45 .deg. plies due to the adjacent plies, which were holding those plies. It was found that the microgeometrical variations in terms of roughness parameters Ra without Dy (maximum Damage Depth) region and Dy are better descriptors of the machined laminate composite surface than commonly used roughness parameters Ra and Ra. The characteristics of surface profiles in laminate composite are well represented in CHD (Cumulative Height Distribution) plot and PPD (Percentage Probability Density) plot. Also, the power spectral density function is shown to be capable of identifying the wavelength distribution of the machining damage.

• Journal of the Optical Society of Korea
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• v.18 no.1
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• pp.37-44
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• 2014

The use of a laser interferometer as a metrological tool in micro-optics measurement is demonstrated. A transmissive interferometer is effective in measuring an optical specimen having a high angle slope. A configuration that consists of an optical resolution of 0.62 micron is adapted to measure a specimen, which is a micro-Fresnel lens-shaped lenticular lens. The measurement result shows a good repeatability at each fraction of facets, however, a reconstruction of the lens shape profile is disturbed by a known problem of $2{\pi}$-ambiguity. To solve this $2{\pi}$-ambiguity problem, we propose a two-step phase unwrapping method. In the first step, an unwrapped phase map is obtained by using a conventional unwrapping method. Then, a proposed unwrapping method based on the shape modeling is applied to correct the wrongly unwrapped phase. A measured height of each facet is compared with a profile result measured by AFM.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.12
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• pp.130-138
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• 1995

Machined graphite/epoxy surfaces were studied by using SEM (Scanning Electron Microscopy), surface profilometry and its analysis to determine suitable surface describing parameters for machined unidirectional and multidirectional laminate composite. The surface roughness and profile are found to be highly depdndent on the fiber layup direction and the measurement direction. It was possible to machine 90 .deg. and -45 .deg. plies due to the adjacent plies, which were holding those plies. It was found that the microgeometrical variations in terms of roughness parameters $R_{a}$ without $D_{y}$(Maximum Damage Depth) region and $D_{y}$are better descriptors of the machined laminate composite surface than commonly used roughness parameters $R_{a}$and $R_{max}$ The characteristics of surface profiles in laminate composite are well represented in CPD (Cumulative Probability Distribution) plot and PPD (Percentage Probability Density) plot. Edge-trimmed multidirectional laminate surfaces are Gaussian and random for profiles measured along the tool movement direction, they are periodic and non-Gaussian in the direction perpendicular to the tool movement.t.ent.t.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.7
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• pp.939-947
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• 1997

An experimental study of the skin friction measurement in a turbulent boundary-layer has been carried out. The skin friction measurements are made using the laser interferometer skin friction (LISF) meter, which optically detects the rate of thinning of an oil applied to the test surface. This technique produces reliable skin friction data over a wide range of flow situations up to 3-dimensional complicated flows with separation, where traditional skin friction measurement techniques are not applicable. The present measured data in a turbulent boundary-layer on a flat plate using the LISF technique shows a good comparison with the result from the previous velocity profile techniques, which proves the validity of the present technique. An extensive error analysis is carried out for the present technique yielding an uncertainty of about .+-.8%, which makes them suitable for CFD code validation purposes. Finally the measurements of the skin friction in a separated region after a surface-mounted obstacle are also presented.

• Proceedings of the KSR Conference
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• 2010.06a
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• pp.533-539
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• 2010

The The contactless railway abrasion measurement system have to satisfy two conditions to increase the measurement accuracy as follows. The laser region projected on the rail have to be extracted without the geometrical distortion. The mapping of the acquired laser region data on the rail profile have to be matched with the cross section of rail, exactly. But, the conventional railway abrasion measurement system is required the post image processing with a camera model and a perspective transform for the exact mapping between the cross section of rail and the coordinate data extracted from a line laser region or the raw image obtained from a camera because the image captured from the camera has an oblique viewpoint. So, the measured rail profile data had limits to the measurement accuracy because of a discontinuity point. In this Paper, we propose the 3D rail profile reconstruction method to increase the accuracy of the railway abrasion measurement system applying the modified camera model and perspective transform to the image obtained from the bidirectional rail.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.107-114
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• 2017

In this investigation, we describe a metrological technique for surface and thickness profiles of a silicon (Si) wafer by using a 6 degree of freedom (DOF) stitching method. Low coherence scanning interferometry employing near infrared light, partially transparent to a Si wafer, is adopted to simultaneously measure the surface and thickness profiles of the wafer. For the large field of view, a stitching method of the sub-aperture measurement is added to the measurement system; also, 6 DOF parameters, including the lateral positioning errors and the rotational error, are considered. In the experiment, surface profiles of a double-sided polished wafer with a 100 mm diameter were measured with the sub-aperture of an 18 mm diameter at $10\times10$ locations and the surface profiles of both sides were stitched with the sub-aperture maps. As a result, the nominal thickness of the wafer was $483.2{\mu}m$ and the calculated PV values of both surfaces were $16.57{\mu}m$ and $17.12{\mu}m$, respectively.