• Publications of The Korean Astronomical Society
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• v.30 no.2
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• pp.687-690
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• 2015

For research and development of Silicon Carbide (SiC) mirrors, the Korea Astronomy and Space Science Institute (KASI) and National Optical Astronomy Observatory (NOAO) have agreed to cooperate and share on polishing and measuring facilities, experience and human resources for two years (2014-2015). The main goals of the SiC mirror polishing are to achieve optical surface figures of less than 20 nm rms and optical surface roughness of less than 2 nm rms. In addition, Green Optics Co., Ltd (GO) has been interested in the SiC polishing and joined the partnership with KASI. KASI will be involved in the development of the SiC polishing and the optical surface measurement using three different kinds of SiC materials and manufacturing processes (POCO$^{TM}$, CoorsTek$^{TM}$ and SSG$^{TM}$ corporations) provided by NOAO. GO will polish the SiC substrate within requirements. Additionally, the requirements of the optical surface imperfections are given as: less than 40 um scratch and 500 um dig. In this paper, we introduce the international collaboration and interim results for SiC mirror polishing and development.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.32-38
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• 2006

The magnetic fluid polishing technique can polish the tool of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. Therefore, we producted the magnetic fluid polishing device in order that mirror like finishing processes the tool surface. In order to a polishing condition selection, polishing characteristic was estimated by polishing conditions which are magnetic flux density, polishing speed, grain size, magnetic fluid. The tool was polished to the selected polishing condition. The result to evaluate the polished tool's performance with the cutting force and tool wear, the polished tool's performance was improved compared with the tool not to polish.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.22-27
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• 2010

The usage of ultra-precision machining is increasing by the manufacturing of precision optical elements such as camera lens, laser printer, CD player, DVD and microscope parts etc.. The WC alloy material is in wide use by mold core to improve the productivity and accuracy in manufacturing those precision parts. The WC alloy mould core can be machined effectively by the parallel grinding process which is an excellent technique for manufacturing of surface profile hard to machining materials such as the hardened metal alloy, Ceramics, Glass and so on. Magnetic assisted polishing as a final polishing process has also been utilized to obtain ultra-precision mirror surface with the elimination of traces presented on ground surface. It is able to deduce the optimal ultra-precision machining conditions of the WC alloy material from the experiment and analyses results.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.32-39
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• 2003

Pulse electrochemical machining process with high or low current density may produce a non-lustrous surface on workpiece surface. The usual polishing process to remove a black layer from the surface has been hand polish the part. But the milli-to-micro meter scale structure formed by the electrochemical machining process may be destroyed while polishing process. The application of ultra short voltage pulses based on the analysis of electrical double layer charging process allows high resolution electrochemical machining and polishing. This technique was based on the specific polarization resistance from the comparison of ideal and experimental potential variation during short voltage pulses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.358-359
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• 2005

Chemical mechanical polishing(CMP) process depends on a variety of variables. Especially, surface roughness of pad plays a key role in material removal in CMP in terms of transportation ability of pores and real contact area. The surface roughness is deteriorated with polishing time by applied pressure and relative velocity. In this reason, diamond conditioner has been used to maintain the roughness on the pad. The authors try to investigate the correlation between pad roughness and frictional behavior by comparing ex-situ conditioning with in-situ conditioning.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.4
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• pp.35-41
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• 2008

R/In order to satisfy the customer's variant needs for a product quality in recent years, a demand for developing higher precision machining technologies in a lot of application areas such as automobile, cellular phone and semiconductor has been increased more and more. Magnetic abrasive polishing(MAP) process is one of these precision technologies. In this study, to verify the parameters' effect of the MAP process on the surface roughness improvement of the plane and the inclined workpiece, well planned experiments which was called the design of experiments were carried out. Considered polishing factors were spindle speed, supplied current, abrasive type and working gap between the workpiece and the solid tool. As a result, it was seen that the supplied current and the working gap greatly affected the surface roughness improvement.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.107-117
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• 2003

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. And, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.