• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the Korea Information Processing Society Conference
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• 2002.04b
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• pp.1619-1622
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• 2002

최근에 생산되는 디지털 VLSI칩들은 그 집적도가 계속 높아지고 있으며, 이러한 칩들을 장착한 보드의 경우도 그 복잡성이 점차 높아지고 있다. 이에 따라 칩 및 보드에 대한 철저한 테스트 과정이 요구된다. 지금까지 보드 테스트 방법으로 널리 쓰였던 ICT(In-Circuit Test)는 칩의 고집적화에 따른 핀 간격의 조밀화와 SMT(Surface Mount Technology), BGA(Ball Grid Array), MCM(Multi Chip Module) 등의 새로운 패키징 방식의 등장에 따라 테스트 방법으로의 한계성을 드러내고 있다. 이에 대한 대안으로 등장한 IEEE Std 1149.1 은 ICT의 한계성을 극복할 수 있는 기술일 뿐 아니라 여러 가지 장점을 가지고 있으며 그 활용 분야도 다양하다. 본 논문에서는 IEEE Std 1149.1에 따라 설계된 보드 상에서 발생 가능한 고장들에 대한 고장 모델을 제시한다. 또한 각 고장 모델들의 양상과 진단 기법을 제시한다. 이를 통해 IEEE Std 1149.1에 따라 설계된 보드 상에서 발생한 고장들을 검출할 수 있으며, 고장의 종류 및 성격, 그리고 고장의 발생 위치 등의 정보를 얻을 수 있다. IEEE Std 1149.1에 따른 보드 설계가 보드의 신뢰성 보장에 긴요함을 인식하는 계기가 되기를 기대하며 제시된 고장 모델 및 진단 기법이 기술적으로 중요한 참고자료가 되기를 기대한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Clean Technology
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• v.10 no.2
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• pp.61-72
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• 2004

In this study, aqueous/semi-aqueous cleaning agents which consist of organic solvent, surfactant, cosurfactant, and water were developed by changing formulation parameters such as organic solvent type and contents, surfactant type and contents, and cosurfactant/surfactant(A/S) ratio, etc.. And physical properties and flux removal of the formulated cleaning agents have been evaluated. Also, the performance of oil-water separation from the rinse water contaminated during the cleaning process was evaluated for its recycling. The formulated cleaning agents in this work expected to have good penetration because of their low viscosity and low surface tension values of 30.2~32.5 dyne/cm. The flux removal with the terpene type cleaning agent was higher than that with hydrocarbon type cleaning agent and two commercial products (CPA(commercial product A), CPB(commercial product B)). And the performance of oil-water separation by gravity settling from the rinse water contaminated with formulated cleaning agent and soils was shown to be very good. The cleaning agents developed in this work were applied to surface mounting technology(SMT) cleaning process for manufacturing electronic parts at L electronic company. As a result, the newly developed cleaning agents showed two times better cleaning speed for removal of solder cream than the conventional ond containing ethanol and IPA(isopropyl alcohol). In addition, malodor and VOC problems generated by the previous organic cleaning agents have been solved in the manufacturing field through introduction of the non-volatile and environmental-friendly cleaning agents to the field.

• Transactions of the KSME C: Technology and Education
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• v.3 no.2
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• pp.131-140
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• 2015

The mono-ski for the paraplegia designed to skiing is formed as seat bucket on the sled. The impact force transferred by snow surface during skiing is absorbed by the leg joints of normal human, but it is transferred to the human body on the seat when using mono-ski. Most of commercially available mono-ski have absorbing device and link mechanism between seat and ski mount in order to complement it. In this study we developed the comfort evaluation model that could provide skiing simulation of mono-ski with hydraulic damper and analyzed vibrational acceleration occurred during skiing uneven surface. The evaluation method used in this study is the international standard BS6841. We evaluated comfort performance of mono-ski in accordance with nozzle adjustment of hydraulic damper.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.5269-5279
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• 2014

The cause of defects in the PCB SMT assembly is mostly solder paste deposits. Conventional inspection methods for solder paste deposits suffer from slow speed, low reliability and high cost. Therefore, this paper proposes a method for calculating the height and region of solder paste on PCB using the 3D profiles without measuring the 2D image. The solder paste region is detected by the phase difference in the measurement points and the average phase on the whole surface of PCB. The high reliable height of the solder paste region is computed by the average of the measurement points' phase with repeatability and reliability. The experimental results revealed improvements of 17% in inspection time and 29% repeatability in the height calculation of the solder paste region, resulting in a high speed and less expensive system.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.80-80
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• 2009

패키징 구조의 발전이 점차 중요한 문제로 대두되어, 칩의 집적 기술의 발전에 따라 실장기술에서도 고속화, 소형화, 미세피치화, 고정밀화, 고밀도화가 요구되고있다. 최근 선진국을 중심으로 전자 전기기기 및 부품의 실장기술에서도 환경 친화적인 기술을 요구함에 따라, 저에너지 공정 및 무연 실장 기술에 대한 연구가 활발하게 진행되고 있다. 기존의 SOP(Small Out-line Package), QFP(Quad Flat Package) 등은 소형화, 다핀화, 고속화, 실장성에 한계가 있기 때문에, SMT(Surface Mount Technology) 형식으로 된 BGA(Ball Grid Array)가 휴대형 전화를 비롯한 기타 전자 부품 실장에 널리 사용되고 있다. BGA ball shear 법은 BGA 모듈의 생산 및 취급 중에 발생할지도 모르는 기판에 수평으로 작용하는 기계적인 전단력에 BGA solder ball이 견딜 수 있는 정도를 측정하기 위해 사용되는 시험법이다. 전단 시험에 의한 전단 강도의 측정 외에 전기전도도 측정, 파면 관찰, 이동거리(displacement), 유한요소 해석법 등을 병행하여 시험법의 신뢰성 향상에 대한 연구가 이루어지고 있다. 본 실험에서는 지름이 $500{\mu}m$인 Sn-3.5Ag 솔더볼을 이용하여 세라믹 기판을 접합하여 BGA 패키지를 완성하였다. 상부 기판에 솔더볼을 정렬시켜 리플로우 방법으로 접합 한 후 솔더볼이 접합된 상부 기판과 하부 기판을 접합 하여 시편을 제작하였다. 접합된 시편들은 $150^{\circ}C$에서 0~800시간 열처리를 실시하였고, 열처리를 하면서 각각 $3{\times}10^2A/cm^2,\;5{\times}10^3A/cm^2$의 전류를 인가하였다. 시편들을 전단 시험기를 이용하여 솔더볼의 기계적 특성 평가를 하였으며, 계면 반응을 관찰하였다.

• Resources Recycling
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• v.7 no.4
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• pp.35-42
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• 1998

Surface mount technology is the biggest theme in the area of deιIronic component. To miniatunze an electronic component, s such as ferrite chip inductor, the cer뼈lic wet process for green-sheet lamination and/or screen printing method through a s solvent medium system is widely used. The preparation and characterization of NiCuZn Ferrite (NCZF) shurry and the green s sheet using the water mixed binder system has been studied. The 21 vol% of NCZF slurry was prepared by a ball milling. The p polyacrylic vinyl copolymer (Mw; 60,000) was used as a binder. Th$\xi$ mixture of distilled water, isopropyl alcohol (IPA) and 2l butoxy ethanol was used as a dispersion medium. The water content of medium varied from about 40% to 80%. As the results. Thc disp$\xi$rston stability of the NCZF slurry was attributed to the free polymer rather than the electrostatic force of the particle. T The viscosity of the NCZF slurry was greatly depended on the ratio of water content in the medium.